JPS61195066U - - Google Patents
Info
- Publication number
- JPS61195066U JPS61195066U JP1985079540U JP7954085U JPS61195066U JP S61195066 U JPS61195066 U JP S61195066U JP 1985079540 U JP1985079540 U JP 1985079540U JP 7954085 U JP7954085 U JP 7954085U JP S61195066 U JPS61195066 U JP S61195066U
- Authority
- JP
- Japan
- Prior art keywords
- heat conduction
- conduction rod
- box
- integrated circuit
- rotation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000003638 chemical reducing agent Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985079540U JPS61195066U (enrdf_load_stackoverflow) | 1985-05-28 | 1985-05-28 | |
| US06/764,278 US4628990A (en) | 1984-08-17 | 1985-08-09 | Cooling equipment for an integrated circuit chip |
| FR858512318A FR2569306B1 (fr) | 1984-08-17 | 1985-08-13 | Dispositif de refroidissement pour circuits integres |
| US06/882,115 US4685211A (en) | 1984-08-17 | 1986-07-03 | Method of producing a cooled electronic assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985079540U JPS61195066U (enrdf_load_stackoverflow) | 1985-05-28 | 1985-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195066U true JPS61195066U (enrdf_load_stackoverflow) | 1986-12-04 |
Family
ID=30624551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985079540U Pending JPS61195066U (enrdf_load_stackoverflow) | 1984-08-17 | 1985-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195066U (enrdf_load_stackoverflow) |
-
1985
- 1985-05-28 JP JP1985079540U patent/JPS61195066U/ja active Pending