JPS61193973U - - Google Patents

Info

Publication number
JPS61193973U
JPS61193973U JP7805385U JP7805385U JPS61193973U JP S61193973 U JPS61193973 U JP S61193973U JP 7805385 U JP7805385 U JP 7805385U JP 7805385 U JP7805385 U JP 7805385U JP S61193973 U JPS61193973 U JP S61193973U
Authority
JP
Japan
Prior art keywords
spool
bonding wire
collar
wound
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7805385U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7805385U priority Critical patent/JPS61193973U/ja
Publication of JPS61193973U publication Critical patent/JPS61193973U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP7805385U 1985-05-24 1985-05-24 Pending JPS61193973U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7805385U JPS61193973U (fr) 1985-05-24 1985-05-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7805385U JPS61193973U (fr) 1985-05-24 1985-05-24

Publications (1)

Publication Number Publication Date
JPS61193973U true JPS61193973U (fr) 1986-12-03

Family

ID=30621686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7805385U Pending JPS61193973U (fr) 1985-05-24 1985-05-24

Country Status (1)

Country Link
JP (1) JPS61193973U (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844926U (ja) * 1981-09-24 1983-03-25 ベス工業株式会社 ヘア・ブラシの組立方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844926U (ja) * 1981-09-24 1983-03-25 ベス工業株式会社 ヘア・ブラシの組立方法

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