JPS6119082A - Socket contact - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to contacts of LSI sockets mounted on electronic circuit boards constituting various electronic devices, computers, and other electronic devices.

To briefly explain this type of LSI mounting structure with reference to FIG. 1, an LSI socket 4 is mounted on a printed circuit board 7, and an LSII pin contact is inserted into an LSI pin introduction hole 5 formed in the LSI socket 4. 2, the LSII is mounted on the printed circuit board 7. 3 is L
This is a socket cover for SI socket 4. Inside the LSI socket 4, a pair of plate-shaped contact pieces 6 are arranged close to each LSI pin introduction hole 5 and spaced apart from each other, and these plate-shaped contact pieces 6 apply an appropriate contact pressure to the LSI pin contacts 2. By sandwiching the LSI pin and the LSI socket, the LSI pin and the LSI socket are electrically connected.

As shown in FIG. 2, the sides of the pair of plate-shaped contact pieces 6 expand outward and open, and the LSI pins are inserted into the LSI pin introduction holes.
By moving the SI pin contact 2 laterally toward the plate-like contact piece 6, it is inserted between the contact pieces through the wide opening 9 of the plate-like contact piece.

Conventionally, this type of LSI socket contact is shown in Fig. 2.
As shown in FIGS. 4 and 5, there was only one type of contact in which the contact gap, that is, the gap g between both plate-shaped contact pieces 6, was constant and only one type was available. In this case, the contact portion of the socket contact has a length range A, and the LSI pin contact 2 having an outer diameter d moves within this range. There is a relationship d>,9 between the pin outer diameter d and the contact piece gap g, so when the LSI pin contact 2 is moved laterally through the widened opening 9 of the contact piece 6, the socket contact The plate-shaped contact piece 6 is elastically displaced by the difference between the LSI pin outer diameter d and the socket contact gap y, and generates a specified contact force (pressing force) against the LSI pin contact 2.

However, in the conventional structure, as mentioned above, since the socket contact gap g is one type, LSI
Although it is possible to design a device that can absorb dimensional changes in the pin diameter, it has not been possible to design a device that can accommodate a wide range of dimensional changes in the LSI pin outer diameter d. Therefore, the same type of LSI
There is no problem for bottles whose outside diameter d is specified within a narrow range, but when using many types of LSIs with a wide range of LSI pin outside diameters, it is best to use only one type of LSI socket. It was impossible to cover the cost with just one, and each time I had to use several types of LSI sockets with different designs. As described above, using different LSI sockets depending on the LSI used has the drawback of causing confusion in use.

An object of the present invention is to solve the above-mentioned conventional drawbacks by forming a plurality of different contact positions on the socket-side contact pieces that come into contact with LSI pin contacts. ``T-mountable socket contact.

For this purpose, the present invention provides a contact for an LSI socket that is installed on a printed circuit board and that accepts an LSI.
The pin contactor of I is made to have multiple contact pieces that maintain a contact state within the same contact piece by varying stepwise the distance between the contact pieces at the points where the contact state is maintained by the pressing force created by being sandwiched between the two opposing contact pieces. It is individually formed.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 3 is a perspective view of an LSI socket contact according to an embodiment of the present invention, and corresponds to FIG. 2 showing the prior art. In this embodiment, a pair of spaced apart plate-shaped contact pieces 8, 8' are arranged at corresponding positions on the stepped portions 10, 10'.
is formed. As in the prior art, the pin insertion side of each plate-like contact piece 8,8' is formed with a wide opening 9 that widens outward. The stepped portion 10.10' is formed in such a manner that the distance between the contact pieces on the wide opening 9 side is also wider than the distance between the contact pieces on the opposite side, that is, on the back side in the pin movement direction. FIG. 6 is a plan view of the socket contact of the embodiment shown in FIG. 3, viewed from the axial direction of the LSI pin;
Figure 7 shows two types of LSI pin contacts 2 with different outer diameters.
．． 2' is the contact piece 8, 8' of a single socket contact.
FIG. 6th
As shown in the figure.

The gap between the pair of plate-shaped contact pieces 8, 8' having a step is a gap y on the back side in the direction of movement of the mating pin contacts 2, 2', and a gap g' on the front side, that is, the wide opening side. Moreover, the outer diameter of the two types of pin contacts 2 and 2' is d.
, d', the relationship is determined to be d'>, 9'>dM. The contact piece gap g on the narrower spacing side is designed to correspond to the pin contact diameter dK, and the gap g' on the wider spacing side is designed to correspond to the pin contact diameter d'. When a contact state is reached, a prescribed contact force is generated, and a stable contact state is maintained. Of course, the present invention is not limited to having two levels of gaps as in the illustrated embodiment, but may have a plurality of different gaps. Furthermore, each LSI pin contactor) 2 and 2' should be arranged so that they stop within the contact length ranges B and C in FIG. 7, corresponding to their respective outer diameters.
Another structure is provided to distinguish the amount of pin movement to prevent accidental contact.

As explained above, according to the present invention, by providing a plurality of gaps (contact gaps) in the same contact of an LSI socket and having different positions in the pin movement direction, several types of LSIs having different pin dimensions can be integrated. It can be implemented using different types of LSI sockets, which has the effect of ensuring uniformity in usage and eliminating concerns about confusion.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of the mounting structure of an LSI on a printed circuit board, FIG. 2 is a perspective view of a conventional LSI socket contact, and FIG. 3 is a perspective view of a socket contact according to an embodiment of the present invention. , FIG. 4 is a plan view of a conventional socket contact before LSI pin contact, FIG. 5 is a plan view of a conventional socket contact after pin contact,
FIG. 6 is a plan view of the socket contact according to the embodiment of the present invention before pin contact, and FIG. 7 is a plan view of the embodiment of the present invention after pin contact. 1...LSI, 2.2'...LSI pin contact, 4...LSI socket, 6, 8, 8'...plate contact piece, 7...printed circuit board, 10.10'. ...Step part, 9.9'...Gap between contact pieces, d, d'...Outer diameter of pin contact.

Claims (2)

[Claims] (1) A contact of an LSI socket installed on a printed circuit board and receiving an LSI has a pair of opposing plate-shaped contact pieces that sandwich both sides of a pin contact of an LSI inserted into the socket in a press contact state. A socket contact characterized in that a stepped portion is formed on the plate surface of the pair of plate-shaped contact pieces so that the distance between the pair of plate-shaped contact pieces changes stepwise. (2) The pair of plate-shaped contact pieces have side openings so as to sandwich the pin contact when the LSI pin contact inserted into the socket moves laterally, and the pair of plate-shaped contact pieces 2. The socket contact according to claim 1, wherein the spacing is formed so that the distance becomes narrower in the direction of lateral movement of the LSI pin contact.