JPS611903B2 - - Google Patents
Info
- Publication number
- JPS611903B2 JPS611903B2 JP19035381A JP19035381A JPS611903B2 JP S611903 B2 JPS611903 B2 JP S611903B2 JP 19035381 A JP19035381 A JP 19035381A JP 19035381 A JP19035381 A JP 19035381A JP S611903 B2 JPS611903 B2 JP S611903B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
- H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56190353A JPS5892252A (ja) | 1981-11-27 | 1981-11-27 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56190353A JPS5892252A (ja) | 1981-11-27 | 1981-11-27 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5892252A JPS5892252A (ja) | 1983-06-01 |
| JPS611903B2 true JPS611903B2 (ja) | 1986-01-21 |
Family
ID=16256774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56190353A Granted JPS5892252A (ja) | 1981-11-27 | 1981-11-27 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5892252A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310917A (ja) * | 1993-04-22 | 1994-11-04 | Mitsubishi Electric Corp | マイクロストリップ線路装置 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918658A (ja) * | 1982-07-22 | 1984-01-31 | Nec Corp | 半導体集積回路装置 |
| JPS6231156A (ja) * | 1985-08-02 | 1987-02-10 | Nec Corp | 半導体装置及びその製造方法 |
| JPS62119938A (ja) * | 1985-11-20 | 1987-06-01 | Mitsubishi Electric Corp | 冗長性回路を備えた半導体装置 |
| US4849363A (en) * | 1988-03-18 | 1989-07-18 | Digital Equipment Corporation | Integrated circuit having laser-alterable metallization layer |
| EP0405849A3 (en) * | 1989-06-30 | 1991-05-02 | American Telephone And Telegraph Company | Severable conductive path in an integrated-circuit device |
| JP3667507B2 (ja) * | 1997-10-27 | 2005-07-06 | 株式会社ルネサステクノロジ | 半導体装置及びその製造方法 |
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1981
- 1981-11-27 JP JP56190353A patent/JPS5892252A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310917A (ja) * | 1993-04-22 | 1994-11-04 | Mitsubishi Electric Corp | マイクロストリップ線路装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5892252A (ja) | 1983-06-01 |