JPS61190143U - - Google Patents
Info
- Publication number
- JPS61190143U JPS61190143U JP1985074467U JP7446785U JPS61190143U JP S61190143 U JPS61190143 U JP S61190143U JP 1985074467 U JP1985074467 U JP 1985074467U JP 7446785 U JP7446785 U JP 7446785U JP S61190143 U JPS61190143 U JP S61190143U
- Authority
- JP
- Japan
- Prior art keywords
- burn
- board
- socket
- semiconductor element
- heat radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985074467U JPS61190143U (de) | 1985-05-20 | 1985-05-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985074467U JPS61190143U (de) | 1985-05-20 | 1985-05-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61190143U true JPS61190143U (de) | 1986-11-27 |
Family
ID=30614794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985074467U Pending JPS61190143U (de) | 1985-05-20 | 1985-05-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61190143U (de) |
-
1985
- 1985-05-20 JP JP1985074467U patent/JPS61190143U/ja active Pending