JPS61190139U - - Google Patents
Info
- Publication number
- JPS61190139U JPS61190139U JP1985074451U JP7445185U JPS61190139U JP S61190139 U JPS61190139 U JP S61190139U JP 1985074451 U JP1985074451 U JP 1985074451U JP 7445185 U JP7445185 U JP 7445185U JP S61190139 U JPS61190139 U JP S61190139U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- resin
- concave
- reinforced
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229910000833 kovar Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985074451U JPS61190139U (US20100012521A1-20100121-C00001.png) | 1985-05-20 | 1985-05-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985074451U JPS61190139U (US20100012521A1-20100121-C00001.png) | 1985-05-20 | 1985-05-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61190139U true JPS61190139U (US20100012521A1-20100121-C00001.png) | 1986-11-27 |
Family
ID=30614761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985074451U Pending JPS61190139U (US20100012521A1-20100121-C00001.png) | 1985-05-20 | 1985-05-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61190139U (US20100012521A1-20100121-C00001.png) |
-
1985
- 1985-05-20 JP JP1985074451U patent/JPS61190139U/ja active Pending