JPS61190134U - - Google Patents
Info
- Publication number
- JPS61190134U JPS61190134U JP1985075501U JP7550185U JPS61190134U JP S61190134 U JPS61190134 U JP S61190134U JP 1985075501 U JP1985075501 U JP 1985075501U JP 7550185 U JP7550185 U JP 7550185U JP S61190134 U JPS61190134 U JP S61190134U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconductor element
- conductive material
- bonded
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/736—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985075501U JPS61190134U (index.php) | 1985-05-20 | 1985-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985075501U JPS61190134U (index.php) | 1985-05-20 | 1985-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61190134U true JPS61190134U (index.php) | 1986-11-27 |
Family
ID=30616778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985075501U Pending JPS61190134U (index.php) | 1985-05-20 | 1985-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190134U (index.php) |
-
1985
- 1985-05-20 JP JP1985075501U patent/JPS61190134U/ja active Pending