JPS6118950B2 - - Google Patents
Info
- Publication number
- JPS6118950B2 JPS6118950B2 JP12605079A JP12605079A JPS6118950B2 JP S6118950 B2 JPS6118950 B2 JP S6118950B2 JP 12605079 A JP12605079 A JP 12605079A JP 12605079 A JP12605079 A JP 12605079A JP S6118950 B2 JPS6118950 B2 JP S6118950B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- parts
- weight
- group
- adhesive strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001296 polysiloxane Polymers 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 27
- 229920000800 acrylic rubber Polymers 0.000 claims description 16
- 229920000058 polyacrylate Polymers 0.000 claims description 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 13
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 239000013464 silicone adhesive Substances 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 description 72
- 239000000853 adhesive Substances 0.000 description 71
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 39
- 239000002390 adhesive tape Substances 0.000 description 14
- 239000000047 product Substances 0.000 description 12
- -1 1-methoxyethyl group Chemical group 0.000 description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- 229920001971 elastomer Polymers 0.000 description 10
- 239000005060 rubber Substances 0.000 description 10
- 230000000704 physical effect Effects 0.000 description 8
- 239000004809 Teflon Substances 0.000 description 7
- 229920006362 Teflon® Polymers 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 150000002430 hydrocarbons Chemical group 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 5
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 4
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 4
- 238000006482 condensation reaction Methods 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000005051 trimethylchlorosilane Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- REEBWSYYNPPSKV-UHFFFAOYSA-N 3-[(4-formylphenoxy)methyl]thiophene-2-carbonitrile Chemical compound C1=CC(C=O)=CC=C1OCC1=C(C#N)SC=C1 REEBWSYYNPPSKV-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- YLJJAVFOBDSYAN-UHFFFAOYSA-N dichloro-ethenyl-methylsilane Chemical compound C[Si](Cl)(Cl)C=C YLJJAVFOBDSYAN-UHFFFAOYSA-N 0.000 description 1
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- LVCMXMSJOUJZFC-UHFFFAOYSA-N diphenyl(silyloxy)silane Chemical compound C=1C=CC=CC=1[SiH](O[SiH3])C1=CC=CC=C1 LVCMXMSJOUJZFC-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000018984 mastication Effects 0.000 description 1
- 238000010077 mastication Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Description
本発明はシリコーン系粘着剤組成物に関するも
のであり、詳しくは一般に市販されている剥離紙
から容易に剥離することができる組成物を提供し
ようとするものである。
現在知られているシリコーン系粘着剤は粘着剤
としての性能を発揮する温度範囲が−65℃から
260℃と他の有機系粘着剤に比較してはるかに広
く、また高温、高湿度の雰囲気中においても電気
特性の低下などがほとんどみられないという特長
を有し、また、金属、ガラス、紙、織物、プラス
チツクス、シリコーンゴム、シリコーンワニスク
ロスあるいはテフロン(商品名)などにも良好に
粘着し、そのすぐれた性質が認められるにもかゝ
わらず、通常、シリコーン処理した剥離紙に接着
してしまうためその用途が限定されているのが現
状である。
他方、天然ゴムあるいはアクリル系ゴムをはじ
めとするシリコーン系ゴム以外の粘着剤はシリコ
ーン剥離紙を使用することができるが、それらは
耐熱性、耐水性あるいは難燃性などにおいてシリ
コーン系ゴム粘着剤に劣るという不利を有してい
る。
本発明は上記したような従来の不利を除去した
新規なシリコーン系粘着剤組成物を提供しようと
するものであつて、これは
(イ) 平均組成式
〔式中、R1は水素原子または一価炭化水素
基を表わす。aおよびbはそれぞれ0.5≦a≦
1.9,0≦b≦0.7である。ただしa+bは0.7≦
a+b≦1.9〕で示され、水酸基および/また
はアルコキシ基を0.5重量%以上含有するオル
ガノポリシロキサン 100重量部、
(ロ) 数平均分子量が5万〜300万である未加硫ア
クリル系ゴム 10〜80重量部
および
(ハ) 一般式
(R2)cSi(OR3)4-c …(ii)
〔式中、R2は水素原子または置換もしくは
非置換の一価炭化水素基を、R3は水素原子ま
たはアルキル基を表わす。cは0,1,2また
は3である〕で示される有機けい素化合物また
はその部分加水分解縮合物 1〜60重量部
からなるものである。
上記した(イ)〜(ハ)成分からなるシリコーン系粘着
剤はシリコーン自体が有する耐熱性、耐水性、電
気特性あるいは難燃性などの諸特性を備え、かつ
種々の基体に対してすぐれた粘着性を示すことは
もちろんのこと、市販されているシリコーン剥離
紙からも容易に剥離することができるという利点
を有する。
以下、本発明に係るシリコーン系粘着剤組成物
について詳細に説明する。
まず、本発明において使用される(イ)成分として
のオルガノポリシロキサンは上記した平均組成式
(i)で示される、分子中にけい素原子に直結するフ
エニル基を有するシロキサンであつて、このもの
は本発明の組成物から得られる粘着剤に接着性、
粘着性および投錨性を付与するものである。また
この(イ)成分はシリコーンが本来有する耐熱性、耐
水性および電気特性を該粘着剤に与えるものでも
ある。
式中、R1は水素原子または一価炭化水素基を
表わし、この一価炭化水素基としては例えばメチ
ル基、エチル基、プロピル基あるいはブチル基な
どのアルキル基、ビニル基あるいはアリール基な
どのアルケニル基などがあげられる。a,bおよ
びa+bは前述のとおりである。
上記したように、この(イ)成分は所定量のフエニ
ル基を含有することが必須であるが、このフエニ
ル基は(ロ)成分との相溶性を高める役割をし、また
市販のシリコーン剥離紙がジメチルポリシロキサ
ンまたはメチルハイドロジエンポリシロキサンを
主成分とする剥離剤を用いて処理してなるもので
あることから、これら剥離剤との親和性を極力低
くする作用をもつものである。しかして、この(イ)
成分におけるフエニル基の含有量はけい素原子1
個あたり0.5〜1.9個の範囲とされる。
また、けい素原子1個あたりのフエニル基
(C6H5)と水素原子または一価炭化水素基(R1)の
合計量(a+b)の比は0.7〜1.9の範囲であるこ
とが必須とされるが、これはa+bが0.7未満で
は本発明の組成物から得られる粘着剤が充分な粘
着力を有せず、かつ硬くもろいものとなつて使用
に供することが困難となり、反面それが1.9をこ
えると粘着剤としての凝集力が不足し、このよう
なシロキサン(a+bが1.9以上)を配合してな
る粘着剤を粘着テープやラベルなどに適用した場
合には糊はがれをひきおこす。
さらに、この(イ)成分であるシロキサンは、その
分子中に水酸基および/またはアルコキシ基を
0.5重量%以上含有することが必要であるが、こ
れが0.5重量%未満では基材に対して充分な投錨
力および凝集力を得ることができない。
この(イ)成分は、従来から知られている方法、例
えばフエニルトリクロロシラン、ジフエニルジク
ロロシラン、フエニルトリアルコキシシラン、ジ
フエニルジアルコキシシラン、ジフエニルシラン
ジオールあるいはこれらの混合物、さらにこれら
に必要に応じてメチルトリクロロシラン、ジメチ
ルジクロロシラン、トリメチルクロロシラン、メ
チルジクロロシラン、トリクロロシラン、ビニル
メチルジクロロシラン、ビニルトリクロロシラン
もしくはこれらに相当するアルコキシシランの1
種もしくは2種以上からなる混合物を加えてなる
ものを(共)加水分解することに容易に得られ
る。
つぎに、本発明において使用する未加硫アクリ
ル系ゴムは、本発明の組成物から得られる粘着剤
の粘着力と凝集力を高め、かつ粘着剤としての腰
の強さを付与するために必須の成分とされるもの
である。この(ロ)成分は数平均分子量が5万〜300
万の範囲にあることが必須とされるが、これは数
平均分子量が5万未満であるとこれを含む組成物
から得られる粘着剤に充分な凝集力を与えること
ができず、他方300万をこえると上記(イ)成分との
相溶性に劣るようになつたり、所望の粘着力が得
られなくなるからである。
このようなアクリル系ゴムとしては、アクリル
酸あるいはメタクリル酸のアルキルエステルとヒ
ドロキシアルキルアクリルエステル、2−クロロ
エチルビニルエーテル、アクリロニトリルあるい
はアクリルアミドを共重合させたもの、アクリル
酸エチルあるいはアクリル酸ブチルなどを主成分
とし、アクリル酸ヒドロキシプロピルあるいはア
クリル酸ヒドロキシエチルなどを0.1〜5モル%
(好ましくは0.5〜2モル%)含むものなどが例示
される。
また、本発明においてはアクリルゴムの物性を
改良する目的で、アクリルゴムにコモノマーとし
てブタジエン、酢酸ビニル、クロロプレンあるい
はイソブチレンなどの改質材を共重合させ、主鎖
にそれらの基を導入したものも使用できるが、こ
れらはアクリル単位として60モル%以上含有させ
たものであることが望ましい。
なお、本発明においては、数平均分子量が300
万以上のアクリル系ゴムであつてもロール素練り
を行つたりあるいはニーダーを用いて高剪断力を
与えて練つたりして分子鎖の切断を行い、結果と
して分子量が上記範囲に包含されるようなもので
あれば使用可能である。
この(ロ)成分の使用量は前記した目的を達成する
見地から上記(イ)成分100重量部に対して10〜80重
量部の範囲とすることが必須とされる。
さらに本発明において使用される(ハ)成分は上記
した一般式(ii)で示される有機けい素化合物または
その部分加水分解縮合物であつて、式中R2は水
素原子または置換もしくは非置換の一価炭化水素
基を表わし、これにはメチル基、エチル基、プロ
ピル基あるいはブチル基などのアルキル基、ビニ
ル基あるいはアリル基などのアルケニル基、フエ
ニル基などのアリール基、トリル基などのアルカ
リル基、またはこれらの基の水素原子が部分的に
ハロゲン原子、アミノ基、エポキシ基、アシル基
あるいはメルカプト基などの有機基で置換された
基をあげることができる。また、R3は水素原子
またはアルキル基を表わし、このアルキル基とし
ては、メチル基、エチル基、プロピル基、ブチル
基あるいは1−メトキシエチル基などが例示され
る。cは前述のとおりである。
このような有機けい素化合物としては下記に示
すようなものをあげることができる。
(C6H5)2Si(OH)2、C6H5(CH3)2SiOH、
C6H5(CH3)Si(OH)2、C6H5(CH3)Si
(OH)2、
(CH3)2Si(OCH3)2、(C6H5)2Si(OCH3)2、
CH2=CH−Si(OC2H5)3、C6H5(CH3)Si
(OCH3)2、
C6H5(H)Si(OC2H5)2、CH2=CH−Si
(OCH2CH2OCH3)3、
NH2CH2CH2NHCH2CH2CH2Si(OCH3)3、
この(ハ)成分は、上記したような本発明の目的を
達成する見地から上記(イ)成分100重量部に対して
1〜60重量部の範囲で使用することが必須とされ
る。
本発明の組成物は上記(イ)〜(ハ)成分を均一に混合
することにより達成されるが、具体的には、(イ)成
分と(ロ)成分とを両者の共通溶剤、例えばキシレン
あるいはトルエンなどの芳香族炭化水素系溶剤、
酢酸ブチルあるいは酢酸イソプロピルなどのエス
テル系溶剤、メチルエチルケトンあるいはメチル
イソブチルケトンなどのケトン系溶剤などに溶解
させ、これに(ハ)成分を混合する方法などが採用さ
れる。
なお、(ハ)成分が(イ)成分と(ロ)成分との溶剤混合物
に溶解せず、白濁や沈澱が生ずるような場合に
は、それらを加熱かく拌して(イ)〜(ハ)成分間で縮合
反応を行わせ、縮合により生成する水あるいはア
ルコール類を系外に除去すればよい。
上記縮合反応を行わせるにあたつては、該反応
に要する時間を短縮するために亜鉛、チタン、す
ずあるいは鉛などの金属の有機酸塩あるいはアミ
ン化合物などの従来から知られている縮合触媒を
少量使用することは何ら差支えない。
しかしながら、縮合反応を必要以上に行わせる
と、高粘度化して塗工作業に劣るようになるほか
メトキシ基あるいはエトキシ基などのアルコキシ
基、水酸基などの反応性極性基を減少させ、結果
として粘着剤としての特性を低下させるなどの不
利をもたらすので、溶液が透明になつたときに反
応を中止すればよい。
なお、本発明の組成物を調製する場合におい
て、(イ)成分としてa+bが0.7〜1.2で、かつaが
0.9〜1.2のものを100重量部使用し、(ハ)成分を1
〜10重量部使用すると固体状で常温において粘着
性の乏しいものとなるが、このものは80℃以上
(好ましくは100℃以上)に加熱することにより溶
融し粘着力および接着力が生ずるようになるの
で、ホツトメルト型接着剤として使用することも
できる。
一方上記と同じ分子構造を有する(イ)成分を使用
し、(ハ)成分を10〜60重量部使用した場合には一般
に溶液状態で使用することが好適とされる。例え
ば有効成分濃度50%の溶液で10000〜100000cS
(25℃)の粘着剤溶液を前述したような有機溶剤
に溶解して粘度を1000〜5000cS(25℃)に調製
し、これをガラスクロス、テフロン(商品名)、
ポリエステルフイルム、紙などの通常の粘着テー
プやラベルなどに用いられている種々の基材に均
一に塗布したのち、常温あるいは150℃以下の熱
風をあてて溶剤を除去することにより室温でも粘
着性を有する粘着テープ、ラベルあるいはワツペ
ンなどを得ることができる。
本発明により得られる粘着剤の基材への塗布量
は通常10〜100μm程度の範囲とすれば充分であ
る。
本発明の組成物には必要に応じて石英粉末、酸
化アルミニウム、酸化マグネシウム、煙霧質シリ
カ、カーボン、ガラス粉末、炭酸カルシウムある
いは酸化チタンなどの耐熱性にすぐれる無機質充
てん剤を配合してもよく、これによれば本発明の
組成物から得られる粘着剤の耐熱性、熱伝導性あ
るいは難燃性をさらに向上することができるが、
これらをあまり多量に使用すると粘着が著しく低
下するようになるのでその使用量は(イ)〜(ハ)成分の
合計量100重量部に対して20重量部以下とするこ
とが望ましい。
本発明の組成物から得られる粘着剤は、使用温
度が200℃以下であれば通常の粘着剤と同様に一
端塗布した被着体から剥離し再び別の被着体に適
用することができ、また使用温度が200〜300℃で
は架橋反応が進行してゲル化現象がみられ強力な
永久接着剤として使用することができる。
つぎに本発明の実施例および比較例をあげる
が、各例中の部は重量部を、wt%は重量%をそ
れぞれ示したものである。
実施例 1
平均組成式(CH3)0.32(C6H5)0.88SiO1.4で示さ
れ、Si原子に直結した水酸基を3.1wt%、ブトキ
シ基を2.6wt%含むポリシロキサン100部に、数平
均分子量15万、官能基としてヒドロキシプロピル
アクリレートを2.5モル%有するアクリルゴム
(生ゴム)30部をトルエン300部に均一に溶解した
ものおよびNH2CH2CH2NHCH2CH2CH2Si
(OCH3)3(KBM−603信越化学社製)20部を混合
溶解したところ、粘度8,500cS(25℃)の粘着
剤が得られた。さらにトルエン100部を加えて粘
度を3500cS(25℃)に調製し、ついでアプリケ
ータを用いて巾19mmのテフロン製テープ(商品
名)に均一に塗布し120℃で3分間熱処理を行い
溶剤分を除去したところ、粘着剤層の厚さが30μ
mの粘着テープが得られた。
この粘着テープについて諸物性を調べたところ
下記に示すような結果が得られた。
粘着力(J.Dow式ボールタツグNO) …14
接着力(ステンレス板SUS27C.P280Gに貼り、
180ピールの力)
…950g/19mm巾
凝集力(10mm巾、長さ20mmのテープをステンレ
ス板に貼り1Kgの力で30分間引張つた
時のずれ距離) …0.35mm
また、粘着剤面に市販のシリコーン剥離紙を貼
りつけ、ついで2Kgのゴムローラを10回往復させ
て加圧したのち、これを40℃の室内に1ケ月間放
置した。1ケ月後に剥離紙を剥離したところ、溶
易に剥離することができた。このものについて粘
着力と接着力を測定したところ、粘着力は14、接
着力は940g/19mm巾であり、このものは充分実
用に供することができるものであることが認めら
れた。
実施例 2
平均組成式(CH3)0.13(C6H5)1.1SiO1.38で水酸
基を2.1wt%含むポリシロキサン100部に、数平均
分子量25万、官能基としてヒドロキシプロピルア
クリレート2.5モル%を含むアクリルゴム(生ゴ
ム)40部をトルエン300部に均一に溶解したもの
およびCH2=CHSi(OCH2CH2OCH3)3
(KBC1003 信越化学社製)15部を添加し均一に
溶解したところ、粘度13000cS(25℃)の粘着剤
が得られた。さらに酢酸ブチルを150部加えて粘
度を4300cS(25℃)に調製し、ついで19mm巾の
テフロンテープに均一に塗布し、120℃で3分間
熱処理を行い溶剤を除去したところ、粘着剤層の
厚さが35μmの粘着テープが得られた。
この粘着テープの粘着面の物性は下記のとおり
であつた。
粘着力………4
接着力………870g/19mm巾
凝集力………0.15mm
このテープの粘着剤面に市販のシリコーン剥離
紙を貼りつけ2Kgのゴムローラを10回往復させて
加圧したのち40℃で1ケ月放置した。1ケ月後も
剥離紙は軽く剥離したので粘着テープの粘着力と
接着力を測定したところ、粘着力は4、接着力は
880g/19mm巾であり、このものは充分実用に供
することができるものであることが認められた。
実施例 3
平均組成式(CH3)0.13(C6H5)1.6(H)0.10
SiO1.09で水酸基を0.8wt%、エトキシ基を2.0wt
%含むポリシロキサン100部に、実施例1で用い
たアクリルゴム(生ゴム)50部を酢酸ブチル300
部に均一に溶解したものおよびCH3(C6H5)Si
(OCH3)2を30部混合溶解したところ、粘度
9000cS(25℃)の粘着剤が得られた。さらにト
ルエン150部を加えて2500cS(25℃)に粘度を調
製し、ついでアプリケータを用いて19mm巾のガラ
スクロステープに均一に塗布し130℃で3分間熱
処理を行い溶剤を除去したところ、粘着剤層の厚
さが25μmの粘着テープが得られた。
このテープの物性は下記のとおりであつた。
粘着力………12
接着力………1100g/19mm巾
凝集力………0.33mm
このテープの粘着剤面にシリコーン剥離紙を貼
り40℃で2ケ月間放置したのち、剥離紙を剥離し
たところ容易に剥離できた。2ケ月間経過後の粘
着力は12、接着力は1,100g/19mm巾であつ
た。
実施例 4
平均組成式(CH2=CH)0.22(C6H5)1.2SiO1.29
で示され、水酸基を2.7wt%、メトキシ基を3.3wt
%含むポリシロキサン100部に、実施例1で用い
たアクリルゴム(生ゴム)60部をトルエン300部
に均一に溶解したものおよび(C6H5)2Si(OH)2
を30部混合したところ、白濁沈澱を生じた。これ
にテトラプロピルチタネートを縮合触媒として10
部加えて加熱し還流下で30分間縮合反応を行わせ
たところ均一な溶液となつたので冷却したとこ
ろ、20000cS(25℃)の溶液が得られた。ついで
メチルイソブチルケトン200部を加えて粘度を
5000cS(25℃)に調製し、さらに酸化チタン粉
末20部を配合し、均一になるまでかく拌混合し
た。アプリケータを用いて19mm巾のポリエステル
フイルムに均一に塗布し120℃で5分間熱処理を
行い溶剤を除去したところ、粘着剤層の厚さ55μ
mの粘着テープが得られた。
このテープの物性は下記のとおりであつた。
粘着力………30
接着力………1,200g/19mm巾
凝集力………0.35mm
上記テープの粘着剤層面にシリコーン剥離紙を
貼り40℃で2ケ月間放置したのち、剥離紙を剥離
したところ、容易に剥離することができ、2ケ月
経過後の粘着力は30、接着力は1150g/19mm巾で
あつた。
実施例 5
平均組成式(CH3)0.10(C6H5)0.95SiO1.48で示
され、水酸基を4.4wt%、メトキシ基を2.6wt%含
むポリシロキサン100部に、数平均分子量80万、
官能基としてアクリロニトリルを1.0モル%共重
合したアクリルゴム45部をメチルエチルケトン
150部およびトルエン150部からなる混合溶剤に均
一に溶解したもの
The present invention relates to a silicone pressure-sensitive adhesive composition, and more specifically, it is an object of the present invention to provide a composition that can be easily peeled off from release paper that is generally available on the market. Currently known silicone adhesives exhibit their performance as adhesives within a temperature range of -65°C.
It has a temperature range of 260°C, which is much wider than other organic adhesives, and there is almost no deterioration in electrical properties even in high-temperature, high-humidity environments. Despite its excellent adhesion to textiles, plastics, silicone rubber, silicone varnish cloth, and Teflon (trade name), it usually does not adhere to silicone-treated release paper. Currently, its use is limited due to the On the other hand, silicone release paper can be used for adhesives other than silicone rubber, such as natural rubber or acrylic rubber, but they are not as good as silicone rubber adhesives in terms of heat resistance, water resistance, or flame retardancy. It has the disadvantage of being inferior. The present invention aims to provide a new silicone pressure-sensitive adhesive composition that eliminates the conventional disadvantages as described above. [In the formula, R 1 represents a hydrogen atom or a monovalent hydrocarbon group. a and b are each 0.5≦a≦
1.9, 0≦b≦0.7. However, a+b is 0.7≦
100 parts by weight of organopolysiloxane containing 0.5% by weight or more of hydroxyl and/or alkoxy groups, (b) 10 to 100 parts of unvulcanized acrylic rubber having a number average molecular weight of 50,000 to 3,000,000. 80 parts by weight and (c) General formula (R 2 ) c Si (OR 3 ) 4-c ...(ii) [In the formula, R 2 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, R 3 represents a hydrogen atom or an alkyl group. c is 0, 1, 2 or 3] or a partially hydrolyzed condensate thereof. The silicone adhesive consisting of the above-mentioned components (a) to (c) has the various properties of silicone itself, such as heat resistance, water resistance, electrical properties, and flame retardancy, and has excellent adhesion to various substrates. It has the advantage that it not only shows good properties but also can be easily peeled off from commercially available silicone release paper. Hereinafter, the silicone adhesive composition according to the present invention will be explained in detail. First, the organopolysiloxane as component (a) used in the present invention has the above-mentioned average composition formula:
A siloxane represented by (i) having a phenyl group directly bonded to a silicon atom in its molecule, which has adhesive properties to the pressure-sensitive adhesive obtained from the composition of the present invention.
It provides adhesiveness and anchoring properties. In addition, this component (a) also provides the adhesive with the heat resistance, water resistance, and electrical properties inherent to silicone. In the formula, R 1 represents a hydrogen atom or a monovalent hydrocarbon group, and examples of the monovalent hydrocarbon group include an alkyl group such as a methyl group, an ethyl group, a propyl group, or a butyl group, and an alkenyl group such as a vinyl group or an aryl group. Examples include bases. a, b and a+b are as described above. As mentioned above, it is essential that this (a) component contains a predetermined amount of phenyl group, but this phenyl group plays a role in increasing the compatibility with the (b) component, and commercially available silicone release paper Since it is treated with a release agent containing dimethylpolysiloxane or methylhydrodienepolysiloxane as a main component, it has the effect of minimizing the affinity with these release agents. However, this (a)
The content of phenyl group in the component is 1 silicon atom
The range is 0.5 to 1.9 pieces per piece. Furthermore, it is essential that the ratio of the total amount (a+b) of phenyl group (C 6 H 5 ) and hydrogen atom or monovalent hydrocarbon group (R 1 ) per silicon atom is in the range of 0.7 to 1.9. However, if a+b is less than 0.7, the adhesive obtained from the composition of the present invention will not have sufficient adhesive strength and will become hard and brittle, making it difficult to use. If the adhesive exceeds this value, the cohesive force of the adhesive will be insufficient, and if an adhesive containing such siloxane (a + b of 1.9 or more) is applied to adhesive tapes, labels, etc., the adhesive will peel off. Furthermore, this component (a), siloxane, has a hydroxyl group and/or an alkoxy group in its molecule.
It is necessary to contain 0.5% by weight or more, but if it is less than 0.5% by weight, sufficient anchoring force and cohesive force cannot be obtained for the base material. This component (a) can be prepared by conventionally known methods such as phenyltrichlorosilane, diphenyldichlorosilane, phenyltrialkoxysilane, diphenyldialkoxysilane, diphenylsilanediol, or a mixture thereof. If necessary, methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, methyldichlorosilane, trichlorosilane, vinylmethyldichlorosilane, vinyltrichlorosilane, or one of the alkoxysilanes equivalent to these.
It can be easily obtained by (co)hydrolyzing a species or a mixture of two or more species. Next, the unvulcanized acrylic rubber used in the present invention is essential for increasing the adhesive strength and cohesive force of the adhesive obtained from the composition of the present invention, and providing stiffness as an adhesive. It is said to be a component of This component (b) has a number average molecular weight of 50,000 to 300
However, if the number average molecular weight is less than 50,000, sufficient cohesive force cannot be imparted to the adhesive obtained from the composition containing it; This is because if it exceeds this, the compatibility with the component (a) becomes poor or the desired adhesive strength cannot be obtained. Such acrylic rubbers include copolymerized products of alkyl esters of acrylic acid or methacrylic acid and hydroxyalkyl acrylic esters, 2-chloroethyl vinyl ether, acrylonitrile, or acrylamide, and ethyl acrylate or butyl acrylate as main components. and 0.1 to 5 mol% of hydroxypropyl acrylate or hydroxyethyl acrylate, etc.
(preferably 0.5 to 2 mol%). In addition, in the present invention, for the purpose of improving the physical properties of acrylic rubber, acrylic rubber is copolymerized with a modifier such as butadiene, vinyl acetate, chloroprene, or isobutylene as a comonomer, and these groups are introduced into the main chain. Although they can be used, it is desirable that they contain 60 mol% or more of acrylic units. In addition, in the present invention, the number average molecular weight is 300
Even if the acrylic rubber has a molecular weight of more than 10,000 yen, molecular chains are cut by roll mastication or kneading with a kneader applying high shearing force, and as a result, the molecular weight falls within the above range. It can be used if it is like this. From the standpoint of achieving the above-mentioned objective, the amount of component (b) used must be in the range of 10 to 80 parts by weight per 100 parts by weight of component (a). Furthermore, the component (iii) used in the present invention is an organosilicon compound represented by the above general formula (ii) or a partially hydrolyzed condensate thereof, in which R 2 is a hydrogen atom or a substituted or unsubstituted Represents a monovalent hydrocarbon group, including alkyl groups such as methyl, ethyl, propyl, or butyl, alkenyl groups such as vinyl or allyl, aryl groups such as phenyl, and alkaryl groups such as tolyl. , or groups in which the hydrogen atoms of these groups are partially substituted with organic groups such as halogen atoms, amino groups, epoxy groups, acyl groups, or mercapto groups. Further, R 3 represents a hydrogen atom or an alkyl group, and examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, and a 1-methoxyethyl group. c is as described above. Examples of such organic silicon compounds include those shown below. ( C6H5 ) 2Si ( OH ) 2 , C6H5 (CH3 ) 2SiOH , C6H5 ( CH3 )Si(OH) 2 , C6H5 ( CH3 ) Si
(OH) 2 , (CH 3 ) 2 Si(OCH 3 ) 2 , (C 6 H 5 ) 2 Si(OCH 3 ) 2 , CH 2 =CH−Si(OC 2 H 5 ) 3 , C 6 H 5 ( CH3 )Si
( OCH3 ) 2 , C6H5 (H)Si( OC2H5 ) 2 , CH2 =CH- Si
(OCH 2 CH 2 OCH 3 ) 3 , NH 2 CH 2 CH 2 NHCH 2 CH 2 CH 2 Si(OCH 3 ) 3 , From the viewpoint of achieving the object of the present invention as described above, it is essential to use the component (c) in an amount of 1 to 60 parts by weight based on 100 parts by weight of the component (a). The composition of the present invention is achieved by uniformly mixing the above components (a) to (c). Specifically, components (a) and (b) are mixed in a common solvent, such as xylene. Or aromatic hydrocarbon solvents such as toluene,
A method is adopted in which the component (3) is dissolved in an ester solvent such as butyl acetate or isopropyl acetate, or a ketone solvent such as methyl ethyl ketone or methyl isobutyl ketone, and the component (iii) is mixed therein. In addition, if component (c) does not dissolve in the solvent mixture of components (a) and (b), and cloudiness or precipitation occurs, heat and stir the components (a) to (c). A condensation reaction may be carried out between the components, and water or alcohol produced by the condensation may be removed from the system. In carrying out the above condensation reaction, conventionally known condensation catalysts such as organic acid salts of metals such as zinc, titanium, tin or lead or amine compounds are used to shorten the time required for the reaction. There is no problem in using a small amount. However, if the condensation reaction is carried out more than necessary, the viscosity becomes high and coating work becomes poor, and the reactive polar groups such as alkoxy groups such as methoxy or ethoxy groups and hydroxyl groups are reduced, resulting in a The reaction may be stopped when the solution becomes clear, since this may cause disadvantages such as deterioration of the properties as a solvent. In addition, when preparing the composition of the present invention, as component (A), a+b is 0.7 to 1.2, and a is
Use 100 parts by weight of 0.9 to 1.2, and 1 part of component (C).
When ~10 parts by weight is used, it becomes solid and has poor adhesiveness at room temperature, but when heated to 80°C or higher (preferably 100°C or higher), it melts and becomes sticky and adhesive. Therefore, it can also be used as a hot melt adhesive. On the other hand, when component (a) having the same molecular structure as above is used and component (c) is used in an amount of 10 to 60 parts by weight, it is generally preferable to use it in a solution state. For example, 10,000 to 100,000 cS for a solution with an active ingredient concentration of 50%
(25°C) is dissolved in an organic solvent as mentioned above to adjust the viscosity to 1000-5000cS (25°C).
After uniformly applying it to various base materials used for regular adhesive tapes and labels, such as polyester film and paper, the solvent is removed by blowing hot air at room temperature or below 150°C, making it sticky even at room temperature. Adhesive tapes, labels, badges, etc. can be obtained. It is usually sufficient that the amount of the adhesive obtained by the present invention applied to the substrate is in the range of about 10 to 100 μm. The composition of the present invention may contain an inorganic filler having excellent heat resistance such as quartz powder, aluminum oxide, magnesium oxide, fumed silica, carbon, glass powder, calcium carbonate, or titanium oxide, if necessary. According to this, the heat resistance, thermal conductivity, or flame retardance of the adhesive obtained from the composition of the present invention can be further improved.
If too large amounts of these are used, the adhesion will drop significantly, so the amount used is desirably 20 parts by weight or less per 100 parts by weight of the total amount of components (a) to (c). The adhesive obtained from the composition of the present invention can be peeled off from the adherend to which it has been applied and reapplied to another adherend in the same way as ordinary adhesives, if the use temperature is 200°C or lower. Moreover, at a working temperature of 200 to 300°C, a crosslinking reaction progresses and a gelation phenomenon is observed, allowing it to be used as a strong permanent adhesive. Next, Examples and Comparative Examples of the present invention will be shown, and in each example, parts indicate parts by weight, and wt% indicates weight %. Example 1 Polysiloxane represented by the average composition formula (CH 3 ) 0.32 (C 6 H 5 ) 0.88 SiO 1.4 and containing 3.1 wt % of hydroxyl groups directly bonded to Si atoms and 2.6 wt% of butoxy groups 100 parts, 30 parts of acrylic rubber (crude rubber) having a number average molecular weight of 150,000 and 2.5 mol% of hydroxypropyl acrylate as a functional group, uniformly dissolved in 300 parts of toluene, and NH 2 CH 2 CH 2 NHCH 2 CH 2 CH 2Si
When 20 parts of (OCH 3 ) 3 (KBM-603 manufactured by Shin-Etsu Chemical Co., Ltd.) were mixed and dissolved, an adhesive with a viscosity of 8,500 cS (25° C.) was obtained. Furthermore, 100 parts of toluene was added to adjust the viscosity to 3500cS (25°C), and then it was applied uniformly to a 19mm wide Teflon tape (trade name) using an applicator and heat treated at 120°C for 3 minutes to remove the solvent. When removed, the thickness of the adhesive layer was 30μ
m adhesive tape was obtained. When various physical properties of this adhesive tape were investigated, the following results were obtained. Adhesive strength (J.Dow ball tag NO) ...14 Adhesive strength (attached to stainless steel plate SUS27C.P280G,
180 peel force) ...950g/19mm width Cohesive force (displacement distance when a tape of 10mm width and 20mm length is applied to a stainless steel plate and pulled for 30 minutes with a force of 1Kg) ...0.35mm Also, commercially available A silicone release paper was attached, and then a 2 kg rubber roller was moved back and forth 10 times to apply pressure, and then this was left in a room at 40°C for one month. When the release paper was removed one month later, it was easily removed. When the adhesive strength and adhesion strength of this product were measured, the adhesive strength was 14, and the adhesive strength was 940 g/19 mm width, and it was confirmed that this product could be sufficiently put to practical use. Example 2 To 100 parts of polysiloxane having an average compositional formula (CH 3 ) 0.13 (C 6 H 5 ) 1.1 SiO 1.38 and containing 2.1 wt % of hydroxyl groups, a number average molecular weight of 250,000 and hydroxypropyl as a functional group was added . A mixture of 40 parts of acrylic rubber (raw rubber) containing 2.5 mol% of acrylate uniformly dissolved in 300 parts of toluene and CH 2 =CHSi(OCH 2 CH 2 OCH 3 ) 3
(KBC1003 manufactured by Shin-Etsu Chemical Co., Ltd.) When 15 parts were added and uniformly dissolved, an adhesive with a viscosity of 13000cS (25°C) was obtained. Furthermore, 150 parts of butyl acetate was added to adjust the viscosity to 4300 cS (25°C), and then it was applied uniformly to a 19 mm wide Teflon tape and heat treated at 120°C for 3 minutes to remove the solvent. An adhesive tape with a thickness of 35 μm was obtained. The physical properties of the adhesive surface of this adhesive tape were as follows. Adhesive strength: 4 Adhesive strength: 870g/19mm width Cohesive strength: 0.15mm After applying commercially available silicone release paper to the adhesive side of this tape and applying pressure by moving a 2kg rubber roller back and forth 10 times, It was left at 40°C for one month. Even after one month, the release paper peeled off lightly, so I measured the adhesive strength and adhesive strength of the adhesive tape, and the adhesive strength was 4.
The weight was 880g/19mm width, and it was confirmed that this product could be put to practical use. Example 3 Average composition formula (CH 3 ) 0.13 ( C 6 H 5 ) 1.6 (H) 0.10
SiO 1.09 with 0.8wt% hydroxyl group and 2.0wt % ethoxy group
% of polysiloxane, 50 parts of the acrylic rubber (raw rubber) used in Example 1 was added to 300 parts of butyl acetate.
and CH 3 (C 6 H 5 ) Si
(OCH 3 ) When 30 parts of 2 were mixed and dissolved, the viscosity was
An adhesive of 9000 cS (25°C) was obtained. Furthermore, 150 parts of toluene was added to adjust the viscosity to 2500cS (25℃), and then it was applied uniformly to a 19mm wide glass cloth tape using an applicator, and when the solvent was removed by heat treatment at 130℃ for 3 minutes, it became sticky. An adhesive tape with an agent layer thickness of 25 μm was obtained. The physical properties of this tape were as follows. Adhesive strength…12 Adhesive strength…1100g/19mm width Cohesive strength…0.33mm Silicone release paper was pasted on the adhesive side of this tape and left at 40℃ for 2 months, then the release paper was peeled off. It was easily peeled off. After 2 months, the adhesive strength was 12, and the adhesive strength was 1,100 g/19 mm width. Example 4 Average composition formula (CH 2 = CH ) 0.22 ( C 6 H 5 ) 1.2 SiO 1.29
2.7wt% hydroxyl group, 3.3wt% methoxy group
% of polysiloxane, 60 parts of the acrylic rubber (crude rubber) used in Example 1 was uniformly dissolved in 300 parts of toluene, and (C 6 H 5 ) 2 Si(OH) 2
When 30 parts of the above were mixed, a cloudy white precipitate was produced. To this, tetrapropyl titanate was used as a condensation catalyst.
When the mixture was heated and a condensation reaction was carried out under reflux for 30 minutes, a homogeneous solution was obtained. When the solution was cooled, a solution of 20,000 cS (25°C) was obtained. Then add 200 parts of methyl isobutyl ketone to adjust the viscosity.
The temperature was adjusted to 5000 cS (25° C.), and 20 parts of titanium oxide powder was added and mixed by stirring until uniform. When applied uniformly to a 19 mm wide polyester film using an applicator and heat treated at 120°C for 5 minutes to remove the solvent, the adhesive layer thickness was 55 μm.
m adhesive tape was obtained. The physical properties of this tape were as follows. Adhesive strength: 30 Adhesive strength: 1,200g/19mm width Cohesive strength: 0.35mm Silicone release paper was applied to the adhesive layer of the above tape and left at 40℃ for 2 months, then the release paper was peeled off. As a result, it could be easily peeled off, and after two months, the adhesive strength was 30 and the adhesive strength was 1150 g/19 mm width. Example 5 To 100 parts of polysiloxane having the average compositional formula (CH 3 ) 0.10 (C 6 H 5 ) 0.95 SiO 1.48 and containing 4.4 wt % hydroxyl groups and 2.6 wt% methoxy groups, several Average molecular weight 800,000,
45 parts of acrylic rubber copolymerized with 1.0 mol% acrylonitrile as a functional group is mixed with methyl ethyl ketone.
Uniformly dissolved in a mixed solvent consisting of 150 parts and 150 parts of toluene
【式】(KBM403
信越化学社製)5部を添加して完全に溶解したと
ころ、このもの粘度は30000cS(25℃)であつ
た。該混合物をそのままアプリケータを用いて巾
19mmのテフロンテープに塗布し150℃で10分間熱
処理して溶剤を完全に除去したところ粘着剤層の
厚さが80μmのテープが得られた。このものは常
温でほとんどタツクがなく、短時間であれば、こ
のテープを重ねても保存することができた。しか
し1週間以上重ねておくと、剥離時にブロツキン
グをおこしたので、市販のシリコーン剥離紙を貼
り合せロール状に巻きとつた。このものは2週間
経過後であつてもシリコーン剥離紙を容易に剥離
することができた。さらに150℃で3分間加熱し
たところ、粘着剤が溶融してきたのでそのままス
テンレス板に貼り常温になつたときに接着力を測
定したところ1500g/19mm巾であり、ホツトメル
トタイプの接着剤に利用できることがわかつた。
実施例 6
平均組成式(C6H5)1.2SiO1.4で示され、水酸基
含有量が4.7wt%であるポリシロキサンに、数平
均分子量が15万で、官能基としてヒドロキシプロ
ピルアクリレートを2.5モル%含むアクリルゴム
(生ゴム)40部をトルエン300部に溶解したものお
よびCH2=CH−Si(OC2H5)3 15部を均一に溶解
させた。このものの粘度は5300cS(25℃)であ
つた。
上記で得た混合物を巾19mmのテフロンテープに
均一に塗布したのち、120℃で3分間加熱処理を
行つたところ粘着剤層の厚さが30μmの粘着テー
プが得られ、このテープの粘着面の物性は下記の
とおりであつた。
粘着力………4
接着力………830g/19mm巾
凝集力………0.22mm
また、粘着面に市販のシリコーン剥離紙を貼り
つけ、ついで2Kgのゴムローラを10回往復させて
加圧したのち、これを40℃の室内に1ケ月間放置
した。1ケ月間剥離後に剥離紙を剥離したとこ
ろ、容易に剥離することができた。このものにつ
いて粘着力と接着力を測定したところ、粘着力は
4、接着力は800g/19mm巾でありこのものは充
分実用に供することができるものであることが認
められた。
実施例 7
平均組成式(CH3)0.32(C6H5)0.88SiO1.4で示さ
れ、水酸基を3.1wt%、ブトキシ基を2.6wt%含む
ポリシロキサン100部に、数平均分子量15万、官
能基としてヒドロキシプロピルアクリレートを
2.5モル%含むアクリルゴム(生ゴム)30部をト
ルエン300部に溶解させたものおよびフエニルト
リメトキシシランの部分加水分解物(50%トルエ
ン溶液の粘度2.7cS(25℃))、メトキシ基含有量
27.6wt%、水酸基含有量4.7wt%、ジフエニルジ
シロキサンに相当)20部を混合溶解したところ、
粘度7700cS(25℃)の粘着剤が得られた。さら
にトルエン100部を加え粘度を3300cSに調製し、
これを巾19mmのテフロンテープに均一に塗布し、
120℃で3分間熱処理を行い溶剤を除去したとこ
ろ、粘着剤層の厚さが30μmの粘着テープが得ら
れた。この粘着テープの粘着面の物性は下記のと
おりであつた。
粘着力………14
接着力………1050g/19mm巾
凝集力………0.35mm
また、粘着面に市販のシリコーン剥離紙を貼り
つけついで2Kgのゴムローラを10回往復させて加
圧したのち、これを40℃の室内に1ケ月間放置し
た。1ケ月間経過後に剥離紙を剥離したところ、
容易に剥離することができた。このものについて
粘着力と接着力を測定したところ、粘着力は14、
接着力は940g/19mm巾であり、このものは充分
実用に供することができるものであることが認め
られた。
比較例 1
市販のシリコーン粘着テープ(ジメチルポリシ
ロキサン系)の粘着面に市販のシリコーン剥離紙
を貼り、2Kgの荷重をかけてローラで軽く2回往
復加圧したのち40℃で1日間放置したところ、剥
離紙が接着していた。剥離紙を強引にひつぱつた
ところ、粘着面がブロツキングしてしまつた。
比較比 2
エチルポリシリケート340部とトリメチルクロ
ロシラン172部を共加水分解して得られた樹脂300
部に、末端水酸基封鎖ジメチルポリシロキサン
(粘度3000000cS(25℃))300部をトルエン500部
に溶解した溶液を加え105℃で10時間加熱したと
ころ、200000cS(25℃)の粘着剤溶液が得られ
た。つぎに樹脂分に対して1%のベンゾイルパー
オキサイドを加えて溶解させ、さらにトルエンを
加えて10000cS(25℃)に粘度を調製し、ついで
巾19mmのテフロンテープにアプリケータを用いて
塗布し、150℃で5分間熱処理を行つたところ、
粘着剤層の厚さが60μmの粘着テープが得られ
た。このものについて物性を測定したところ、粘
着力は25、接着力は850g/19mm巾、凝集力は
0.21mmであつた。この粘着面に市販のシリコーン
剥離紙を貼り40℃で1日間放置したところ、互に
接着してしまい剥離することができなかつた。When 5 parts of [Formula] (KBM403 manufactured by Shin-Etsu Chemical Co., Ltd.) was added and completely dissolved, the viscosity of this product was 30,000 cS (25°C). Apply the mixture as is using an applicator.
When it was applied to a 19 mm Teflon tape and heat treated at 150°C for 10 minutes to completely remove the solvent, a tape with an adhesive layer thickness of 80 μm was obtained. This product had almost no tack at room temperature, and could be stored for a short time even with this tape layered over it. However, if it was kept for more than a week, blocking occurred during peeling, so a commercially available silicone release paper was bonded and wound into a roll. With this product, the silicone release paper could be easily peeled off even after two weeks had passed. After further heating at 150℃ for 3 minutes, the adhesive melted, so it was applied to a stainless steel plate as it was, and when it came to room temperature, the adhesive strength was measured, and it was 1500g/19mm width, indicating that it can be used as a hot melt type adhesive. I understood. Example 6 A polysiloxane having an average composition formula (C 6 H 5 ) 1.2 SiO 1.4 and a hydroxyl group content of 4.7 wt % has a number average molecular weight of 150,000 and hydroxypropyl acrylate as a functional group. A mixture of 40 parts of acrylic rubber (raw rubber ) containing 2.5 mol% of acrylic rubber dissolved in 300 parts of toluene and 15 parts of CH2 =CH-Si( OC2H5 ) 3 were uniformly dissolved. The viscosity of this product was 5300cS (25°C). After uniformly applying the mixture obtained above to a Teflon tape with a width of 19 mm, heat treatment was performed at 120°C for 3 minutes to obtain an adhesive tape with an adhesive layer thickness of 30 μm, and the adhesive surface of this tape The physical properties were as follows. Adhesive strength...4 Adhesive strength...830g/19mm width Cohesive strength...0.22mm Also, paste a commercially available silicone release paper on the adhesive surface, then apply pressure by moving a 2kg rubber roller back and forth 10 times. This was left in a room at 40°C for one month. When the release paper was peeled off after one month of peeling, it was possible to peel it off easily. When the adhesive strength and adhesion strength of this product were measured, the adhesive strength was 4 and the adhesive strength was 800 g/19 mm width, and it was confirmed that this product could be sufficiently put to practical use. Example 7 To 100 parts of polysiloxane having an average compositional formula (CH 3 ) 0.32 (C 6 H 5 ) 0.88 SiO 1.4 and containing 3.1 wt % of hydroxyl groups and 2.6 wt% of butoxy groups, several Average molecular weight 150,000, hydroxypropyl acrylate as a functional group
30 parts of acrylic rubber (raw rubber) containing 2.5 mol% dissolved in 300 parts of toluene and a partial hydrolyzate of phenyltrimethoxysilane (viscosity of 50% toluene solution 2.7 cS (25°C)), methoxy group content
27.6wt%, hydroxyl group content 4.7wt%, equivalent to diphenyldisiloxane) were mixed and dissolved.
An adhesive with a viscosity of 7700cS (25°C) was obtained. Furthermore, 100 parts of toluene was added to adjust the viscosity to 3300cS.
Apply this evenly to a 19mm wide Teflon tape,
When the solvent was removed by heat treatment at 120° C. for 3 minutes, an adhesive tape with an adhesive layer thickness of 30 μm was obtained. The physical properties of the adhesive surface of this adhesive tape were as follows. Adhesive strength…14 Adhesive strength…1050g/19mm width Cohesive strength…0.35mm In addition, commercially available silicone release paper was pasted on the adhesive surface, and a 2kg rubber roller was moved back and forth 10 times to apply pressure. This was left in a room at 40°C for one month. When I peeled off the release paper after one month,
It could be easily peeled off. When we measured the adhesive strength and adhesive strength of this item, the adhesive strength was 14,
The adhesive force was 940 g/19 mm width, and it was confirmed that this product could be used for practical purposes. Comparative Example 1 A commercially available silicone release paper was pasted on the adhesive side of a commercially available silicone adhesive tape (dimethylpolysiloxane type), and a load of 2 kg was applied and pressure was applied lightly back and forth twice with a roller, followed by being left at 40°C for 1 day. , the release paper was adhered. When I forcibly pressed the release paper, the adhesive side became brittle. Comparison ratio 2 300 parts of resin obtained by co-hydrolyzing 340 parts of ethyl polysilicate and 172 parts of trimethylchlorosilane
When a solution of 300 parts of dimethylpolysiloxane endblocked with hydroxyl groups (viscosity 3000000cS (25°C)) dissolved in 500 parts of toluene was added to the mixture and heated at 105°C for 10 hours, an adhesive solution of 200000cS (25°C) was obtained. Ta. Next, 1% benzoyl peroxide was added to the resin content to dissolve it, and toluene was added to adjust the viscosity to 10,000 cS (25°C). Then, it was applied to a Teflon tape with a width of 19 mm using an applicator. After heat treatment at 150℃ for 5 minutes,
An adhesive tape with an adhesive layer thickness of 60 μm was obtained. When we measured the physical properties of this product, the adhesive strength was 25, the adhesive strength was 850g/19mm width, and the cohesive strength was
It was 0.21mm. When a commercially available silicone release paper was attached to this adhesive surface and left for one day at 40°C, the paper adhered to each other and could not be peeled off.
Claims (1)
基を表わす。aおよびbはそれぞれ0.5≦a≦
1.9,0≦b≦0.7である。ただしa+bは0.7≦
a+b≦1.9〕で示され、水酸基および/また
はアルコキシ基を0.5重量%以上含有するオル
ガノポリシロキサン 100重量部、 (ロ) 数平均分子量が5万〜300万である未加硫ア
クリル系ゴム 10〜80重量部 および (ハ) 一般式 (R2)cSi(OR3)4-c 〔式中、R2は水素原子または置換もしくは
非置換の一価炭化水素基を、R3は水素原子ま
たはアルキル基を表わす。cは0,1,2また
は3である〕で示される有機けい素化合物また
はその部分加水分解縮合物 1〜60重量部 からなるシリコーン系粘着剤組成物。[Claims] 1 (a) Average compositional formula [In the formula, R 1 represents a hydrogen atom or a monovalent hydrocarbon group. a and b are each 0.5≦a≦
1.9, 0≦b≦0.7. However, a+b is 0.7≦
100 parts by weight of organopolysiloxane containing 0.5% by weight or more of hydroxyl and/or alkoxy groups, (b) 10 to 100 parts of unvulcanized acrylic rubber having a number average molecular weight of 50,000 to 3,000,000. 80 parts by weight and (c) general formula (R 2 ) c Si(OR 3 ) 4-c [wherein, R 2 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, and R 3 is a hydrogen atom or Represents an alkyl group. c is 0, 1, 2 or 3] A silicone adhesive composition comprising 1 to 60 parts by weight of an organosilicon compound or a partially hydrolyzed condensate thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12605079A JPS5649778A (en) | 1979-09-29 | 1979-09-29 | Silicone self-adhesive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12605079A JPS5649778A (en) | 1979-09-29 | 1979-09-29 | Silicone self-adhesive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5649778A JPS5649778A (en) | 1981-05-06 |
JPS6118950B2 true JPS6118950B2 (en) | 1986-05-15 |
Family
ID=14925401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12605079A Granted JPS5649778A (en) | 1979-09-29 | 1979-09-29 | Silicone self-adhesive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5649778A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69219210T2 (en) * | 1991-01-09 | 1997-08-07 | Nitto Denko Corp | DOUBLE-SIDED ADHESIVE TAPE, LAMINATED STRUCTURE THEREOF, ADHESIVE TAPE, AND METHOD FOR USE THEREOF |
KR100377243B1 (en) * | 2000-09-04 | 2003-03-26 | 안택진 | Adhesive composition, tape and label easily peeled off after an extended time period |
JP5000259B2 (en) * | 2006-10-18 | 2012-08-15 | 株式会社ダイセル | Transparent sealing material |
CN106167621B (en) * | 2016-08-03 | 2019-10-29 | 深圳市安品有机硅材料有限公司 | Flame retardant type room temperature vulcanized liquid silicone rubber |
-
1979
- 1979-09-29 JP JP12605079A patent/JPS5649778A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5649778A (en) | 1981-05-06 |
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