JPS61189281U

JPS61189281U -

Info

Publication number: JPS61189281U
Application number: JP7280085U
Authority: JP
Priority date: 1985-05-16
Filing date: 1985-05-16
Publication date: 1986-11-26

Description

[Brief explanation of drawings]

第１図は本考案の実施例を示すバーンイン装置
の概略構成図、第２図は従来のバーンイン装置の
構成図、第３図は第２図中のバーンインボードの
斜視図、第４図は第１図の動作を説明するための
バーンイン装置の構成図である。１０…筐体、１２…チヤンバ、１３…ダクト、
１４…送風機、１５…ヒータ、１７…ダンパ、１
８…吸気口、１９…排気口。 FIG. 1 is a schematic diagram of a burn-in device showing an embodiment of the present invention, FIG. 2 is a diagram of a conventional burn-in device, FIG. 3 is a perspective view of the burn-in board in FIG. 2 is a configuration diagram of a burn-in device for explaining the operation of FIG. 1. FIG. 10... Housing, 12... Chamber, 13... Duct,
14...Blower, 15...Heater, 17...Damper, 1
8...Intake port, 19...Exhaust port.

Claims

[Claims for Utility Model Registration] A semiconductor device 6 is housed in the chamber 12 and includes a chamber 12 for housing the semiconductor device 6, a heater 15 for heating, and a blower 14 for circulating air heated by the heater 15. A semiconductor device burn-in device in which a semiconductor device 6 is subjected to an operation test in a high-temperature atmosphere includes an air intake port 18 that introduces cold air into a hot air circulation path formed by the blower 14; an exhaust port 19 for discharging hot air to the outside; a damper 17 for opening and closing the intake port 18 and the exhaust port 19; and a damper 17 for opening and closing the intake port 18 and the exhaust port 19;
1. A burn-in apparatus for a semiconductor device, comprising: a control device 20 for switching and controlling the damper 5 to an off state and switching the damper 17 to an open state.