JPS61186317U - - Google Patents
Info
- Publication number
- JPS61186317U JPS61186317U JP7197785U JP7197785U JPS61186317U JP S61186317 U JPS61186317 U JP S61186317U JP 7197785 U JP7197785 U JP 7197785U JP 7197785 U JP7197785 U JP 7197785U JP S61186317 U JPS61186317 U JP S61186317U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- split metal
- seeding machine
- cap
- mounting piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 7
- 238000010899 nucleation Methods 0.000 claims description 6
- 230000004720 fertilization Effects 0.000 description 1
Landscapes
- Sowing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7197785U JPH023687Y2 (enExample) | 1985-05-15 | 1985-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7197785U JPH023687Y2 (enExample) | 1985-05-15 | 1985-05-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61186317U true JPS61186317U (enExample) | 1986-11-20 |
| JPH023687Y2 JPH023687Y2 (enExample) | 1990-01-29 |
Family
ID=30609959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7197785U Expired JPH023687Y2 (enExample) | 1985-05-15 | 1985-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH023687Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8841779B2 (en) | 2005-03-25 | 2014-09-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate |
-
1985
- 1985-05-15 JP JP7197785U patent/JPH023687Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH023687Y2 (enExample) | 1990-01-29 |