JPS61186317U - - Google Patents

Info

Publication number
JPS61186317U
JPS61186317U JP7197785U JP7197785U JPS61186317U JP S61186317 U JPS61186317 U JP S61186317U JP 7197785 U JP7197785 U JP 7197785U JP 7197785 U JP7197785 U JP 7197785U JP S61186317 U JPS61186317 U JP S61186317U
Authority
JP
Japan
Prior art keywords
main body
split metal
seeding machine
cap
mounting piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7197785U
Other languages
English (en)
Japanese (ja)
Other versions
JPH023687Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7197785U priority Critical patent/JPH023687Y2/ja
Publication of JPS61186317U publication Critical patent/JPS61186317U/ja
Application granted granted Critical
Publication of JPH023687Y2 publication Critical patent/JPH023687Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Sowing (AREA)
JP7197785U 1985-05-15 1985-05-15 Expired JPH023687Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7197785U JPH023687Y2 (enrdf_load_stackoverflow) 1985-05-15 1985-05-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7197785U JPH023687Y2 (enrdf_load_stackoverflow) 1985-05-15 1985-05-15

Publications (2)

Publication Number Publication Date
JPS61186317U true JPS61186317U (enrdf_load_stackoverflow) 1986-11-20
JPH023687Y2 JPH023687Y2 (enrdf_load_stackoverflow) 1990-01-29

Family

ID=30609959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7197785U Expired JPH023687Y2 (enrdf_load_stackoverflow) 1985-05-15 1985-05-15

Country Status (1)

Country Link
JP (1) JPH023687Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8841779B2 (en) 2005-03-25 2014-09-23 Stats Chippac, Ltd. Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate

Also Published As

Publication number Publication date
JPH023687Y2 (enrdf_load_stackoverflow) 1990-01-29

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