JPS61186317U - - Google Patents

Info

Publication number
JPS61186317U
JPS61186317U JP7197785U JP7197785U JPS61186317U JP S61186317 U JPS61186317 U JP S61186317U JP 7197785 U JP7197785 U JP 7197785U JP 7197785 U JP7197785 U JP 7197785U JP S61186317 U JPS61186317 U JP S61186317U
Authority
JP
Japan
Prior art keywords
main body
split metal
seeding machine
cap
mounting piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7197785U
Other languages
English (en)
Japanese (ja)
Other versions
JPH023687Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7197785U priority Critical patent/JPH023687Y2/ja
Publication of JPS61186317U publication Critical patent/JPS61186317U/ja
Application granted granted Critical
Publication of JPH023687Y2 publication Critical patent/JPH023687Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Sowing (AREA)
JP7197785U 1985-05-15 1985-05-15 Expired JPH023687Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7197785U JPH023687Y2 (cs) 1985-05-15 1985-05-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7197785U JPH023687Y2 (cs) 1985-05-15 1985-05-15

Publications (2)

Publication Number Publication Date
JPS61186317U true JPS61186317U (cs) 1986-11-20
JPH023687Y2 JPH023687Y2 (cs) 1990-01-29

Family

ID=30609959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7197785U Expired JPH023687Y2 (cs) 1985-05-15 1985-05-15

Country Status (1)

Country Link
JP (1) JPH023687Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8841779B2 (en) 2005-03-25 2014-09-23 Stats Chippac, Ltd. Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate

Also Published As

Publication number Publication date
JPH023687Y2 (cs) 1990-01-29

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