JPS61186073U - - Google Patents
Info
- Publication number
- JPS61186073U JPS61186073U JP7114385U JP7114385U JPS61186073U JP S61186073 U JPS61186073 U JP S61186073U JP 7114385 U JP7114385 U JP 7114385U JP 7114385 U JP7114385 U JP 7114385U JP S61186073 U JPS61186073 U JP S61186073U
- Authority
- JP
- Japan
- Prior art keywords
- valve body
- passage
- liquid refrigerant
- pressure liquid
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 6
- 239000003507 refrigerant Substances 0.000 claims 6
- 239000012530 fluid Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Temperature-Responsive Valves (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7114385U JPH0311666Y2 ( ) | 1985-05-13 | 1985-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7114385U JPH0311666Y2 ( ) | 1985-05-13 | 1985-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61186073U true JPS61186073U ( ) | 1986-11-20 |
| JPH0311666Y2 JPH0311666Y2 ( ) | 1991-03-20 |
Family
ID=30608369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7114385U Expired JPH0311666Y2 ( ) | 1985-05-13 | 1985-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311666Y2 ( ) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010038455A (ja) * | 2008-08-05 | 2010-02-18 | Denso Corp | 膨張弁及びそれを備えた蒸気圧縮式冷凍サイクル |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9390974B2 (en) | 2012-12-21 | 2016-07-12 | Qualcomm Incorporated | Back-to-back stacked integrated circuit assembly and method of making |
| US9466719B2 (en) | 2009-07-15 | 2016-10-11 | Qualcomm Incorporated | Semiconductor-on-insulator with back side strain topology |
| US9496227B2 (en) | 2009-07-15 | 2016-11-15 | Qualcomm Incorporated | Semiconductor-on-insulator with back side support layer |
| US8921168B2 (en) | 2009-07-15 | 2014-12-30 | Silanna Semiconductor U.S.A., Inc. | Thin integrated circuit chip-on-board assembly and method of making |
| US9515181B2 (en) | 2014-08-06 | 2016-12-06 | Qualcomm Incorporated | Semiconductor device with self-aligned back side features |
-
1985
- 1985-05-13 JP JP7114385U patent/JPH0311666Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010038455A (ja) * | 2008-08-05 | 2010-02-18 | Denso Corp | 膨張弁及びそれを備えた蒸気圧縮式冷凍サイクル |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0311666Y2 ( ) | 1991-03-20 |
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