JPS61185569U - - Google Patents
Info
- Publication number
- JPS61185569U JPS61185569U JP6869785U JP6869785U JPS61185569U JP S61185569 U JPS61185569 U JP S61185569U JP 6869785 U JP6869785 U JP 6869785U JP 6869785 U JP6869785 U JP 6869785U JP S61185569 U JPS61185569 U JP S61185569U
- Authority
- JP
- Japan
- Prior art keywords
- silver paste
- cylinder
- pipe line
- reservoir
- piston
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6869785U JPS61185569U (bs) | 1985-05-09 | 1985-05-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6869785U JPS61185569U (bs) | 1985-05-09 | 1985-05-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61185569U true JPS61185569U (bs) | 1986-11-19 |
Family
ID=30603682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6869785U Pending JPS61185569U (bs) | 1985-05-09 | 1985-05-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61185569U (bs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003035276A1 (fr) * | 2001-10-25 | 2003-05-01 | Musashi Engineering, Inc. | Procede pour la distribution d'une substance liquide et dispositif correspondant |
| WO2003033168A3 (fr) * | 2001-10-17 | 2003-06-26 | Musashi Engineering Inc | Procede de distribution de materiau liquide et dispositif associe |
-
1985
- 1985-05-09 JP JP6869785U patent/JPS61185569U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003033168A3 (fr) * | 2001-10-17 | 2003-06-26 | Musashi Engineering Inc | Procede de distribution de materiau liquide et dispositif associe |
| CN100457290C (zh) * | 2001-10-17 | 2009-02-04 | 武藏工程株式会社 | 液体的排出方法及其装置 |
| WO2003035276A1 (fr) * | 2001-10-25 | 2003-05-01 | Musashi Engineering, Inc. | Procede pour la distribution d'une substance liquide et dispositif correspondant |