JPS61183970U - - Google Patents
Info
- Publication number
- JPS61183970U JPS61183970U JP6609485U JP6609485U JPS61183970U JP S61183970 U JPS61183970 U JP S61183970U JP 6609485 U JP6609485 U JP 6609485U JP 6609485 U JP6609485 U JP 6609485U JP S61183970 U JPS61183970 U JP S61183970U
- Authority
- JP
- Japan
- Prior art keywords
- magazine
- plating
- spans
- lined
- intervals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985066094U JPH0124146Y2 (enExample) | 1985-05-02 | 1985-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985066094U JPH0124146Y2 (enExample) | 1985-05-02 | 1985-05-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61183970U true JPS61183970U (enExample) | 1986-11-17 |
| JPH0124146Y2 JPH0124146Y2 (enExample) | 1989-07-21 |
Family
ID=30598679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985066094U Expired JPH0124146Y2 (enExample) | 1985-05-02 | 1985-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0124146Y2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004068107A (ja) * | 2002-08-08 | 2004-03-04 | Seiko Epson Corp | めっき方法 |
| US7642584B2 (en) | 1991-09-25 | 2010-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for forming the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5476321U (enExample) * | 1977-11-10 | 1979-05-30 | ||
| JPS54115643A (en) * | 1977-12-21 | 1979-09-08 | Bristol Aerojet Ltd | Coating method and apparatus |
| JPS57131394A (en) * | 1981-02-03 | 1982-08-14 | Toyo Giken Kogyo Kk | Method and device for plating by rotary power feed |
| JPS5856077U (ja) * | 1981-10-02 | 1983-04-15 | 株式会社 中部理化 | アルマイト処理に於けるアルミニウム板のラツキング装置 |
-
1985
- 1985-05-02 JP JP1985066094U patent/JPH0124146Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5476321U (enExample) * | 1977-11-10 | 1979-05-30 | ||
| JPS54115643A (en) * | 1977-12-21 | 1979-09-08 | Bristol Aerojet Ltd | Coating method and apparatus |
| JPS57131394A (en) * | 1981-02-03 | 1982-08-14 | Toyo Giken Kogyo Kk | Method and device for plating by rotary power feed |
| JPS5856077U (ja) * | 1981-10-02 | 1983-04-15 | 株式会社 中部理化 | アルマイト処理に於けるアルミニウム板のラツキング装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7642584B2 (en) | 1991-09-25 | 2010-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for forming the same |
| JP2004068107A (ja) * | 2002-08-08 | 2004-03-04 | Seiko Epson Corp | めっき方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0124146Y2 (enExample) | 1989-07-21 |