JPS61183565U - - Google Patents
Info
- Publication number
- JPS61183565U JPS61183565U JP6776185U JP6776185U JPS61183565U JP S61183565 U JPS61183565 U JP S61183565U JP 6776185 U JP6776185 U JP 6776185U JP 6776185 U JP6776185 U JP 6776185U JP S61183565 U JPS61183565 U JP S61183565U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- base member
- bent
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims 6
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6776185U JPS61183565U (en18) | 1985-05-08 | 1985-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6776185U JPS61183565U (en18) | 1985-05-08 | 1985-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61183565U true JPS61183565U (en18) | 1986-11-15 |
Family
ID=30601880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6776185U Pending JPS61183565U (en18) | 1985-05-08 | 1985-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183565U (en18) |
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1985
- 1985-05-08 JP JP6776185U patent/JPS61183565U/ja active Pending