JPS61183542U - - Google Patents

Info

Publication number
JPS61183542U
JPS61183542U JP1985067465U JP6746585U JPS61183542U JP S61183542 U JPS61183542 U JP S61183542U JP 1985067465 U JP1985067465 U JP 1985067465U JP 6746585 U JP6746585 U JP 6746585U JP S61183542 U JPS61183542 U JP S61183542U
Authority
JP
Japan
Prior art keywords
substrate
sealing frame
sealing
gap
sealing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985067465U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985067465U priority Critical patent/JPS61183542U/ja
Publication of JPS61183542U publication Critical patent/JPS61183542U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1985067465U 1985-05-09 1985-05-09 Pending JPS61183542U (US07345094-20080318-C00003.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985067465U JPS61183542U (US07345094-20080318-C00003.png) 1985-05-09 1985-05-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985067465U JPS61183542U (US07345094-20080318-C00003.png) 1985-05-09 1985-05-09

Publications (1)

Publication Number Publication Date
JPS61183542U true JPS61183542U (US07345094-20080318-C00003.png) 1986-11-15

Family

ID=30601316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985067465U Pending JPS61183542U (US07345094-20080318-C00003.png) 1985-05-09 1985-05-09

Country Status (1)

Country Link
JP (1) JPS61183542U (US07345094-20080318-C00003.png)

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