JPS61183473A - Method for metallizing surface of molded polyphenylene sulfide resin - Google Patents

Method for metallizing surface of molded polyphenylene sulfide resin

Info

Publication number
JPS61183473A
JPS61183473A JP2346285A JP2346285A JPS61183473A JP S61183473 A JPS61183473 A JP S61183473A JP 2346285 A JP2346285 A JP 2346285A JP 2346285 A JP2346285 A JP 2346285A JP S61183473 A JPS61183473 A JP S61183473A
Authority
JP
Japan
Prior art keywords
plating
polyphenylene sulfide
molded
sulfide resin
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2346285A
Other languages
Japanese (ja)
Inventor
Hirokazu Kobayashi
裕和 小林
Akihiko Kishimoto
岸本 彰彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2346285A priority Critical patent/JPS61183473A/en
Publication of JPS61183473A publication Critical patent/JPS61183473A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/26Roughening, e.g. by etching using organic liquids
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0333Organic insulating material consisting of one material containing S
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Abstract

PURPOSE:To metallize the surface of a molded resin article having a three- dimensionally ruggedness structure and to improve the bonding strength of the resulting film by roughening the surface of a product consisting of prescribed percentages of polyphenylene sulfide resin and an inorg. filler before plating. CONSTITUTION:A resin composition contg. the inorg. filler of 1-10mum average particle size by 10-250pts.wt. per 100pts.wt. polyphenylene sulfide resin is molded. The surface of the molded product is roughened with the solvent in which the resin is readily soluble, and the plating is carried out. Thus, the surface having three-dimensionally rugged structure is metallized, and the molded resin product having the metallized surface has superior bonding strength to the plated film.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、改善されたポリフェニレンスルフィド樹脂成
形品の表面金属化方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an improved method for surface metallization of polyphenylene sulfide resin molded articles.

〔従来の技術〕[Conventional technology]

従来、ポリフェニレンスルフィド成形品の表面を金属化
する方法としては、特公昭56−25453号公報に、
該成形品の被金属化面を機械的に粗面化処理し、次にク
ロム化合物、硫酸およびリン酸を主体としてなる強酸化
性水溶液でエツチングした後に化学メッキする方法が提
案されている。
Conventionally, as a method for metallizing the surface of polyphenylene sulfide molded products, Japanese Patent Publication No. 56-25453 describes
A method has been proposed in which the surface of the molded article to be metallized is mechanically roughened, then etched with a strongly oxidizing aqueous solution mainly consisting of a chromium compound, sulfuric acid and phosphoric acid, and then chemically plated.

〔本発明が解決しようとする問題点〕[Problems to be solved by the present invention]

しかしながら前記公報記載の方法においては、被金属化
面をサンド・ブラストあるいはサンドペーパーなどによ
り機械的に粗面化する必要があるため、三次元的な凹凸
を有する成形品には適用しがたいという欠点がある。更
に、引き続く強酸化性水溶液の処理により粗表面化効果
のないことは該公報に記載の通りであるが、得られる金
属メッキ膜と樹脂成形品との接着力も不十分であり有効
な方法とは言えない。
However, the method described in the above publication requires mechanical roughening of the surface to be metallized by sand blasting or sandpaper, and is therefore difficult to apply to molded products with three-dimensional irregularities. There are drawbacks. Furthermore, as stated in the publication, the subsequent treatment with a strong oxidizing aqueous solution has no effect on roughening the surface, but the adhesive strength between the resulting metal plating film and the resin molded product is also insufficient, so it cannot be said to be an effective method. do not have.

そこで本発明者らは、機械的な粗表面化処理を行うこと
なく、化学的エツチングによりポリフェニレンスルフィ
ド樹脂成形品の粗表面化が実現され、十分な金属メッキ
膜との接着力が得られる方法について鋭意検討を行い、
ポリフェニレンスルフィド樹脂に特定の充填剤を特定量
配合せしめてなる成形品をポリフェニレンスルフィドの
良溶媒で処理し、次いで通常のメッキ処理を施すことに
より特異的にメッキ接着力のすぐれた表面金属化ポリフ
ェニレンスルフィド樹脂成形品が得られること全見出だ
し本発明に到達した。
Therefore, the inventors of the present invention have conducted intensive studies on a method to roughen the surface of a polyphenylene sulfide resin molded product by chemical etching without performing mechanical surface roughening treatment, and to obtain sufficient adhesion strength with the metal plating film. and
A molded product made by blending a specific filler in a specific amount with a polyphenylene sulfide resin is treated with a good polyphenylene sulfide solvent, and then subjected to a normal plating treatment to produce a surface-metalized polyphenylene sulfide with specific plating adhesion. The present invention is based on the fact that a resin molded article can be obtained.

〔問題を解決するための手段〕[Means to solve the problem]

すなわち本発明は、ポリフェニレンスルフィド樹脂10
0重量部に対して、平均粒子径が1〜10μの範囲の無
機充填材10〜250M量部を含有せしめてなるポリフ
ェニレンスルフィド樹脂成形品を、ポリフェニレンスル
フィドの良溶媒を用いて粗表面化処理した後、メッキ処
理することを特徴とするポリフェニレンスルフィド樹脂
成形品の表面金属化方法に関する。
That is, the present invention provides polyphenylene sulfide resin 10
After roughening a polyphenylene sulfide resin molded product containing 10 to 250 M parts of an inorganic filler with an average particle size in the range of 1 to 10 μm based on 0 parts by weight using a good solvent for polyphenylene sulfide. , relates to a method for surface metallizing a polyphenylene sulfide resin molded article, which is characterized by plating treatment.

本発明で用いるポリフェニレンスルフィド(以下pps
と略称する)とは。
Polyphenylene sulfide (hereinafter pps) used in the present invention
).

構造式+S+ で示される繰返し単位を70モル%以上
、より好ましくは90モル%以上を含む重合体であり、
上記繰返し単位が70モル%未満では耐熱性が損なわれ
るため好ましくない。
A polymer containing 70 mol% or more, more preferably 90 mol% or more of repeating units represented by the structural formula +S+,
If the content of the repeating unit is less than 70 mol%, heat resistance will be impaired, which is not preferable.

ppsは一般に、特公昭45−3368号公報で代表さ
れる製造法により得られる比較的分子量の小さい重合体
と特公昭52−12240号公報で代表される製造法に
より得られる本質的に線状で比較的高分子量の重合体等
があり、前者の重合体においては、重合後酸素雰囲気下
において加熱することにより、あるいは過酸化物等の架
橋剤を添加して加熱することによりに重合度化して用い
ることも可能であり、・本発明においてはいかなる方法
により得られたPPSを用いることも可能である。成形
品自体の機械特性の面で、また、メッキ接着面でのPP
Sの凝集剥離に由来するメッキ膜接着力の低下を回避す
る意味では、前記特公昭52−12240号公報で代表
される製造法により得られる本質的に線状の重合体が、
より好ましく用いられ得る。
Generally, pps is a polymer with relatively small molecular weight obtained by the production method typified by Japanese Patent Publication No. 45-3368, and an essentially linear polymer obtained by the production method typified by Japanese Patent Publication No. 52-12240. There are polymers with relatively high molecular weight, and in the former polymer, the degree of polymerization can be increased by heating in an oxygen atmosphere after polymerization, or by adding a crosslinking agent such as peroxide and heating. - In the present invention, it is possible to use PPS obtained by any method. PP in terms of mechanical properties of the molded product itself and on the plating adhesive surface.
In order to avoid a decrease in the adhesion of the plating film due to the agglomeration and peeling of S, the essentially linear polymer obtained by the production method typified by the above-mentioned Japanese Patent Publication No. 12240/1980 is
It can be used more preferably.

また、PPSはその繰返し単位の30モル%未満を下記
の構造式を有する繰返し単位等で構成することが可能で
ある。
Furthermore, less than 30 mol% of the repeating units of PPS can be composed of repeating units having the following structural formula, etc.

本発明で用いられるPPSの溶融粘度は、成形品を得る
ことが可能であれば特に制限はないが、成形品の機械特
性の面では100ポアズ以上のものが、成形性の面では
10. OOOポアズ以下のものがより好ましく用いら
れる。
The melt viscosity of PPS used in the present invention is not particularly limited as long as it is possible to obtain a molded article, but in terms of mechanical properties of the molded article, it is 100 poise or more, and in terms of moldability, it is 10. Those of OOO poise or less are more preferably used.

また本発明で用いるPPSには、酸化防止剤、熱安定剤
、銅害防止剤、滑剤、結晶核剤、紫外線吸収剤、着色剤
を添加することができ、更に、PPSの架橋度を制御す
る目的で、通常の過酸化剤および、特開昭59−131
650号公報ζζ記載されているチオホスフィン酸金属
塩等の架橋促進剤、才たは特開昭58−204045、
特開昭58−204046号公報等に記載されているジ
アルキル錫ジカルボキシレート、アミノトリアゾール等
の架橋防止剤を配合することも可能である。
Furthermore, an antioxidant, a heat stabilizer, a copper damage inhibitor, a lubricant, a crystal nucleating agent, an ultraviolet absorber, and a coloring agent can be added to the PPS used in the present invention, and furthermore, the degree of crosslinking of the PPS can be controlled. For this purpose, ordinary peroxidants and JP-A-59-131
Crosslinking promoters such as thiophosphinic acid metal salts described in Publication No. 650 ζζ, or JP-A-58-204045,
It is also possible to incorporate crosslinking inhibitors such as dialkyltin dicarboxylate and aminotriazole described in JP-A-58-204046 and the like.

本発明で用いられる無機充填材としては、粗表面化処理
に用いるPPSの良溶媒に可溶のもの、不溶のもののい
ずれも用いられ、必ずしも球状である必要はないが、平
均粒子径が1〜10μの範囲にあることが重要であり、
より好ましくは1〜6μのものが用いられる。この範囲
の粒子径の充填材を用いる仁とにより、PPsの良溶媒
の処理により得られる凹凸構造が金属メッキ膜とのアン
カー効果に好適な大きさとなり、強いメッキ膜接着力が
得られる。平均粒子径が1μ未満または10μを超えた
値ではメッキ膜接着力が小さく好ましくなく、更に、1
0μを超えるとメッキの光輝性が著しく阻害され好まし
くない。ここでいう平均粒子径とは、沈降天秤法で測定
される粒度分布から求められる累積頻度が5096とな
る粒径(中位数)である。
The inorganic filler used in the present invention can be either soluble or insoluble in a good solvent for PPS used for surface roughening treatment, and does not necessarily have to be spherical, but has an average particle size of 1 to 10 μm. It is important that it is within the range of
More preferably, one having a diameter of 1 to 6 μm is used. By using a filler with a particle size in this range, the uneven structure obtained by treating PPs with a good solvent has a size suitable for an anchoring effect with the metal plating film, and strong plating film adhesion can be obtained. If the average particle diameter is less than 1μ or more than 10μ, the adhesion of the plating film will be small and undesirable;
If it exceeds 0μ, the brightness of the plating will be significantly impaired, which is not preferable. The average particle diameter here is the particle diameter (median number) at which the cumulative frequency determined from the particle size distribution measured by the sedimentation balance method is 5096.

本発明で用いられる無機充填材としては、アルミナ、酸
化珪素、酸化マグネシウム、酸化ジルコニア、酸化チタ
ンなどの金属酸化物、炭酸カルシウム、炭酸マグネシウ
ム、ドロマイトなどの炭酸塩、硫酸カルシウム、硫酸バ
リウムなどの硫酸塩、ワラステナイト、セリサイト、カ
オリン、マイカ、クレー、ベントナイト、アスベスト、
タルク、アルミナシリケートなどの珪酸塩、窒化ホウ素
、炭化珪素、サロヤンなどが挙げられるがこれらに限定
されるものではない。
Inorganic fillers used in the present invention include metal oxides such as alumina, silicon oxide, magnesium oxide, zirconia oxide, and titanium oxide, carbonates such as calcium carbonate, magnesium carbonate, and dolomite, and sulfuric acid such as calcium sulfate and barium sulfate. Salt, wollastenite, sericite, kaolin, mica, clay, bentonite, asbestos,
Examples include, but are not limited to, talc, silicates such as alumina silicate, boron nitride, silicon carbide, and Saroyan.

これら充填材は2種以上を併用することも可能であり、
必要によりシラン系、チタン系などのカップリング剤で
予備処理して使用することができる。
It is also possible to use two or more of these fillers together,
If necessary, it can be used after being pretreated with a silane-based, titanium-based, or other coupling agent.

これら無機充填剤の配合量はPP3100重量部に対し
、10〜250重量部、特に30〜100重量部が好ま
しい。10重量部未満では金属メッキ膜の接着性改善効
果が不十分であり、250重量部を超えると表面粗度が
大きくなりメッキ膜接着力、メッキの光輝性が損なわれ
好ましくない。
The blending amount of these inorganic fillers is preferably 10 to 250 parts by weight, particularly 30 to 100 parts by weight, based on 3100 parts by weight of PP. If it is less than 10 parts by weight, the effect of improving the adhesion of the metal plating film is insufficient, and if it exceeds 250 parts by weight, the surface roughness increases and the adhesion of the plating film and the brightness of the plating are impaired, which is not preferable.

また本発明において必須成分ではないが、成形品の機械
特性を改善する目的で、必要に応じてガラス繊維、炭素
繊維等の繊維状の強化材を、PP5100重量部に対し
、本発明の必須成分である上記無機充填材と繊維状強化
材の合計量が250重量部を超えない範囲で配合するこ
とが可能である。更に、本発明の目的を阻害しない範囲
で他種ポリマを少量配合することもできる。
In addition, although it is not an essential component in the present invention, in order to improve the mechanical properties of the molded product, a fibrous reinforcing material such as glass fiber or carbon fiber may be added to 5100 parts by weight of PP as an essential component of the present invention. It is possible to mix the above-mentioned inorganic filler and fibrous reinforcing material in such a range that the total amount does not exceed 250 parts by weight. Furthermore, small amounts of other types of polymers may be blended within a range that does not impede the object of the present invention.

PPSと無機充填材およびその他の添加物の配合手段は
任意であり、限定されるものではないが、例えば、スク
リュー押出機などで同時混合する方法などが採用できる
The means for blending PPS, inorganic fillers, and other additives is arbitrary and is not limited, but for example, a method of simultaneous mixing using a screw extruder or the like can be adopted.

配合物からの成形品の製造は、射出成形、押出成形、圧
縮成形、ブロー成形などの通常の熱可塑性樹脂の成形手
段が任意に採用でき、所望形状の成形品を容易に得るこ
とができる。
For producing a molded article from the compound, any conventional thermoplastic resin molding method such as injection molding, extrusion molding, compression molding, or blow molding can be used, and a molded article of a desired shape can be easily obtained.

本発明においてメッキ処理をするに際し、まず必要に応
じて成形品表面の油膜をふきとるなどの予備処理を施し
、次いでPPSの良溶媒を用いて粗表面化することが重
要である。酸化作用のある硝酸等の酸類で処理すること
は、表面に酸化膜を形成するため好ましくない。粗表面
化処理に用いるPPSの良溶媒としては、1−クロロナ
フタレン、l−ブロムナフタレン、トリエチレンテトラ
ミン、テトラエチレンペンタミン等およびこれらを含む
混合溶媒等が挙げられ、なかでも、1−クロルナフタレ
ンおよび1−ブロムナフタレンが好ましく用いられる。
When performing plating treatment in the present invention, it is important to first perform preliminary treatment such as wiping off an oil film on the surface of the molded article as necessary, and then roughen the surface using a good solvent of PPS. Treatment with acids such as nitric acid, which has an oxidizing effect, is not preferable because it forms an oxide film on the surface. Good solvents for PPS used in the surface roughening treatment include 1-chloronaphthalene, l-bromonaphthalene, triethylenetetramine, tetraethylenepentamine, etc., and mixed solvents containing these. Among them, 1-chloronaphthalene and 1-Bromnaphthalene is preferably used.

この粗表面化処理条件は、用いる溶媒の種類により異る
が、処理速度を速めるためには、高温に加熱することが
有効であり、例えば、1−クロルナフタレンを用いる場
合、200〜220℃に加熱された溶媒中に、成形品を
1〜30分間浸漬し、次いで十分洗浄するのが好ましい
The conditions for this surface roughening treatment vary depending on the type of solvent used, but in order to speed up the treatment speed, heating to a high temperature is effective. For example, when using 1-chlornaphthalene, heating to 200 to 220°C It is preferable to immerse the molded article in the solvent for 1 to 30 minutes and then thoroughly wash it.

また、用いた無機充填剤が用いた溶媒に不溶である場合
、上記粗表面化処理に引き続き、無機充填剤を分解また
は溶解せしめる目的で、酸またはアルカリ処理を行うこ
とも可能である。
Furthermore, if the inorganic filler used is insoluble in the solvent used, it is also possible to perform acid or alkali treatment following the surface roughening treatment for the purpose of decomposing or dissolving the inorganic filler.

このように粗表面化処理したメッキ用樹脂成形品に対し
て、通常公知のメッキ処理を施すことにより、メッキ膜
接着性、メッキの光輝性が著しくすぐれた表面金属化P
PS樹脂成形品が得られる。また、この粗表面化処理し
た成形品に、金属蒸着またはスパッタリング等で表面金
属化することも可能である。
By applying a commonly known plating treatment to the surface-roughened resin molded product for plating, it is possible to obtain a surface metallized P with extremely excellent plating film adhesion and plating brightness.
A PS resin molded product is obtained. Further, it is also possible to metallize the surface of the molded product subjected to the surface roughening treatment by metal vapor deposition, sputtering, or the like.

メッキ処理は、たとえば、塩化第1錫溶液によるセンシ
タイジング−塩化パラジウム溶液によるアクチベーテイ
ングー銅またはニッケル等の無電解メッキの各工程、ま
たは、キャタリステイングーアクセレ・−ティング−無
電解メッキの各工程を引き続き行うこと、更には、無電
解メッキを行った金属と同種または異種の金属により電
気メッキを追加して行うことからなる通常のメッキ方法
を適用することが可能である。
The plating process includes, for example, sensitizing with a stannous chloride solution, activating with a palladium chloride solution, and electroless plating of copper or nickel, or catalyst staining, accelerating, and electroless plating. It is possible to continue each step of plating, and furthermore, it is possible to apply a normal plating method consisting of additional electroplating with the same or different metal as the metal used for electroless plating.

また、メッキ処理を行うにあたり、通常公知の方法でメ
ッキ用樹脂成形品表面を部分的に遮敵することにより、
部分的に表面が金属化された成形品として得ることも可
能である。
In addition, when performing the plating process, by partially shielding the surface of the resin molded product for plating using a commonly known method,
It is also possible to obtain molded articles with a partially metallized surface.

更に、本発明の方法で成形品は、成形後の(スずれかの
工程の間において、結晶化度増大または架橋度増大の目
的でPPSの融点以下の温度で熱処理を行うことが可能
であり、メッキ処理後にメッキ膜接着力増大の目的で熱
処理することも可能である。
Furthermore, the molded article according to the method of the present invention can be heat-treated at a temperature below the melting point of PPS for the purpose of increasing the degree of crystallinity or crosslinking during any of the steps after molding. It is also possible to perform heat treatment after plating for the purpose of increasing the adhesion of the plating film.

以下に実施例を挙げて本発明をさらに詳細に説明する。The present invention will be explained in more detail with reference to Examples below.

〔実施例〕〔Example〕

実施例1〜11.比較例1〜4 溶融粘度1,200ポアズ(320℃、や断速度100
0秒−1)の粉末状pps <米国フィリップス・ペト
ロリアム社製1ライドン#P−4)100重量部に対し
、第1表に示した、各種無機充填材を第1表に示した割
合でドライ・ブレンドし、310℃に設定したスクリュ
ー押出機により溶融混合したのちストランド状で引き取
り、ストランドeカッターでペレタイズした。
Examples 1-11. Comparative Examples 1 to 4 Melt viscosity 1,200 poise (320°C, breaking speed 100
To 100 parts by weight of powdered pps <1 Rydon #P-4, manufactured by Phillips Petroleum, Inc., USA, various inorganic fillers shown in Table 1 were added in the proportions shown in Table 1. - After blending and melt-mixing using a screw extruder set at 310°C, the mixture was taken in the form of a strand and pelletized using a strand e-cutter.

次に各ペレットを310〜320℃に設定したスクリュ
ーインライン型射出成形機に(IL、金型温度130〜
140℃の条件で、−辺が80目の正方形で、厚さ約3
Hの試験片を成形した。
Next, each pellet was placed in a screw in-line injection molding machine set at 310-320°C (IL, mold temperature 130-320°C).
Under the condition of 140℃, - side is 80th square, thickness is about 3
A test piece of H was molded.

次いで各試験片を210℃に加熱しである1−クロルナ
フタレンに3分間浸漬した後、流水中で十分に洗浄し、
粗表面化した試験片を得た。
Next, each test piece was heated to 210°C and immersed in 1-chlornaphthalene for 3 minutes, and then thoroughly washed under running water.
A test piece with a roughened surface was obtained.

この粗表面化した各試験片につき、以下に示す工程を順
次行うことによりメッキ処理を施した。
Each test piece with a roughened surface was subjected to plating treatment by sequentially performing the steps shown below.

(1)  キャタリステイング A−30キヤタリスト(奥野製薬工業(株)Ifり溶液
に、25℃で3分間浸漬処理した。
(1) Catalyst A-30 Catalyst (Okuno Pharmaceutical Co., Ltd.) It was immersed in an If solution at 25° C. for 3 minutes.

(2)水洗 (3)  アクセレーティング 10g6硫酸溶液に40℃で3分間浸漬処理した。(2) Washing with water (3) Acceleration It was immersed in 10g of 6-sulfuric acid solution at 40°C for 3 minutes.

(4)水洗 6) 無電解銅メッキ 硫酸銅(Cu5On115HzO) 1001とホルマ
リンの3596水溶液400CCとを水で稀釈して11
としたメッキ液Aと酒石酸カリウムナトリウム(4水和
物ン4001と水酸化ナトリウム100fを水で稀釈し
て11としたメッキ液B、各200ccを使用直前に混
合し水で24に稀釈したメッキ液に、空気をバブリング
しながら、室温で8分間浸漬処理した。
(4) Water washing 6) Electroless copper plating Copper sulfate (Cu5On115HzO) 1001 and formalin 3596 aqueous solution 400 cc were diluted with water to 11
Plating solution A, potassium sodium tartrate (tetrahydrate 4001, and sodium hydroxide 100f diluted with water to make 11), 200 cc of each were mixed immediately before use, and the plating solution was diluted to 24 with water. The sample was immersed for 8 minutes at room temperature while bubbling air.

(6)  水洗 (7)  電気メッキ 無電解メッキを施した試験片を、濃硫酸50p、硫酸銅
(5水和物)200y、光沢剤としてSCB −MU 
10cc、 5CB−11cc(奥野製薬工業(株)製
)および水1,000ccからなる酸性銅メツキ浴中に
おき、温度約25℃、電流密度3A/dm’で15分間
、次いで12A/dm’で9分間電気メツキを行い、厚
み約50μの銅メッキ膜を形成した。
(6) Washing with water (7) Electroplating The electroless plated test piece was washed with 50p of concentrated sulfuric acid, 200y of copper sulfate (pentahydrate), and SCB-MU as a brightener.
10 cc, 5CB-11 cc (manufactured by Okuno Pharmaceutical Co., Ltd.) and 1,000 cc of water. Electroplating was performed for 9 minutes to form a copper plating film with a thickness of about 50 μm.

得られた表面金属化PPS成形品について、メッキ膜を
巾10ff、長さ40ffにわたってT剥離する際に必
要な力をメッキ膜の接着力として評価した結果および外
観観察によるメッキ光輝性の評価結果を第1表に示す。
Regarding the obtained surface metallized PPS molded product, the force required to peel off the plating film over a width of 10 ff and a length of 40 ff was evaluated as the adhesion force of the plating film, and the results of evaluating the plating brightness by observing the appearance were evaluated. Shown in Table 1.

実施例121 実施例3で用いた試験片について、210℃の1−クロ
ロナフタレンに浸漬する代りに、210℃の1−ブロム
ナフタレンに3 分間浸fiしたことのほかは、実施例
3と全く同様の操作を用い、表面金属化PPS成形品を
得て、メッキ膜の接着力を評価したところ、1980g
/lであった。
Example 121 The test piece used in Example 3 was exactly the same as Example 3, except that instead of being immersed in 1-chloronaphthalene at 210°C, it was immersed in 1-bromnaphthalene at 210°C for 3 minutes. Using this procedure, a PPS molded product with a metallized surface was obtained, and the adhesion of the plating film was evaluated.
/l.

比較例5〜10 実施例3および実施例8で用いた試験片について、21
0℃の1−クロロナフタレンに浸漬処理する代りに、次
の各処理を施すことにより粗表面化したことのほかは、
実施例3と全く同様の操作でメッキ処理を行い、メッキ
膜接着力を評価した結果は第2表に示した通りであった
Comparative Examples 5 to 10 Regarding the test pieces used in Example 3 and Example 8, 21
Except that the surface was roughened by applying the following treatments instead of immersion treatment in 1-chloronaphthalene at 0°C.
The plating process was carried out in exactly the same manner as in Example 3, and the adhesion of the plating film was evaluated. The results are shown in Table 2.

(1)  クロム混酸処理 重クロム酸カリウム162F、濃硫酸390CC,濃リ
ン酸99cc、水999CCの混合液に50℃で3分間
試験片を浸漬した。
(1) Chromium mixed acid treatment A test piece was immersed in a mixed solution of 162F potassium dichromate, 390cc of concentrated sulfuric acid, 99cc of concentrated phosphoric acid, and 999cc of water at 50°C for 3 minutes.

(21硝酸処理 60%硝酸に30℃で5分間試験片を浸漬したのら、水
洗し、更に10%炭酸ナトリウム溶液で中和した。
(21 Nitric acid treatment The test piece was immersed in 60% nitric acid at 30°C for 5 minutes, washed with water, and further neutralized with 10% sodium carbonate solution.

(3)硫酸処理 濃硫酸に150℃で5分間試験片を浸漬したのち、水洗
し、更に1096炭酸ナトリウム溶液で中和した。
(3) Sulfuric acid treatment The test piece was immersed in concentrated sulfuric acid at 150°C for 5 minutes, washed with water, and further neutralized with 1096 sodium carbonate solution.

第    2    表 実施例13 実施例1で用いたPP5100I量部に対し、平均粒径
2.3μの酸化チタン40重量部およびガラス繊維(日
本電気硝子(株)製TN−100)40重量部を溶融混
合せしめたペレットを用いたことのほかは、実施例1と
全く同様の方法で試験片を得て、更に、粗表面化処理、
メッキ処理を施し、表面金属化PPS成形品を得た。
Table 2 Example 13 To parts of PP5100I used in Example 1, 40 parts by weight of titanium oxide with an average particle size of 2.3μ and 40 parts by weight of glass fiber (TN-100 manufactured by Nippon Electric Glass Co., Ltd.) were melted. A test piece was obtained in exactly the same manner as in Example 1, except that the mixed pellets were used, and further surface roughening treatment and
A plating treatment was performed to obtain a PPS molded product with a metalized surface.

得られた成形品のメッキ光輝性は良好であり、メッキ膜
接着力は1720 f / txであった。
The resulting molded product had good plating brightness and plating film adhesion of 1720 f/tx.

実施例14 実施例3で用いたPPSの代りに、参考例1で示す方法
で得られたPPSを用いたことのほかは、実施例3と全
く同様の方法で表面金属化PPS成形品を得た。
Example 14 A surface metallized PPS molded product was obtained in exactly the same manner as in Example 3, except that PPS obtained by the method shown in Reference Example 1 was used instead of the PPS used in Example 3. Ta.

得られた成形品のメッキ光輝性は良好であり、メッキ膜
接着力は23501 / esであった。
The resulting molded product had good plating brightness and plating film adhesion of 23501/es.

参考例1(PPSの調!1) オートクレーブに硫化ナトリウム3.26 # (25
モル、結晶水4096を含む)、水酸化ナト+Jウム4
y、酢酸ナトリウム三水和物136#C約110モル)
およびN−メチル−2−ピロリドン(以下NMPと略称
する)7.94を仕込み、攪拌しながら徐々に205℃
まで昇温し、水ト8−(kgを含む留出水L506を除
去した。残留混合物に1,4−ジクロルベンゼン3.7
5 kq (25,5モル)およびNMP2#を加え、
265℃で4時間加熱した。反応生成物を熱湯で8回洗
浄し、80℃で24時間減圧乾燥して、溶融粘度2.5
00ポアズの粉末状PPS約2kgを得た。
Reference example 1 (PPS preparation! 1) Sodium sulfide 3.26 # (25
mole, including water of crystallization 4096), sodium hydroxide + Jium 4
y, about 110 mol of sodium acetate trihydrate 136#C)
and N-methyl-2-pyrrolidone (hereinafter abbreviated as NMP) 7.94 were added, and the temperature was gradually raised to 205°C while stirring.
Distilled water L506 containing 8 kg of water was removed. 3.7 kg of 1,4-dichlorobenzene was added to the remaining mixture.
Add 5 kq (25,5 mol) and NMP2#,
Heated at 265°C for 4 hours. The reaction product was washed 8 times with hot water and dried under reduced pressure at 80°C for 24 hours to a melt viscosity of 2.5.
Approximately 2 kg of powdered PPS of 00 poise was obtained.

比較例11 比較例5で用いたPPSの代りに実施例14で用いたP
PS (参考例1の方法で調整されたもの)を用いたこ
とのほかは、比較例5と全く同様の方法で表面金属化P
Ps成形品を得た。
Comparative Example 11 PPS used in Example 14 instead of PPS used in Comparative Example 5
The surface metallized P
A Ps molded product was obtained.

得られた成形品のメッキ膜接着力は190y/cIlで
あった。
The plating film adhesive strength of the obtained molded product was 190y/cIl.

実施例15 実施例3で用いた。pps組成物のペレットを用いて、
幅50ffX長さ80M×高さ35fi、厚さ2.5f
iの箱型成形品を成形し、実施例3で用いた試験片の代
りにこの成形品を用いたことのほかは全く同様の操作で
メッキ処理を行った。
Example 15 Used in Example 3. Using pellets of pps composition,
Width 50ff x length 80m x height 35fi, thickness 2.5f
A box-shaped molded product of i was molded, and plating was performed in exactly the same manner except that this molded product was used in place of the test piece used in Example 3.

得られた、成形品の外観は良好であった。The appearance of the obtained molded product was good.

〔発明の効果〕〔Effect of the invention〕

本発明のポリフェニレンスルフィド樹脂成形品の表面金
属化方法は、機械的粗面化処理の工程を経ずに行われる
ため、三次元的凹凸構造の面を表面金属化することが可
能であり、一方、本発明の方法により得られた表面金属
化ポリフェニレンスルワイド樹脂成形品はすぐれたメッ
キ膜接着力、表面光輝性およびPPSに由来するすぐれ
た耐熱、耐薬品性、機械特性を有し、金属代替用途をは
じめとする各種部品および、プリント配線基板として有
用である。
The method for surface metallizing polyphenylene sulfide resin molded articles of the present invention is carried out without a mechanical roughening process, so it is possible to surface metallize a surface with a three-dimensional uneven structure. The surface-metallized polyphenylene sulfide resin molded product obtained by the method of the present invention has excellent plating film adhesion, surface brightness, and excellent heat resistance, chemical resistance, and mechanical properties derived from PPS, and can be used as a metal substitute. It is useful as various parts including applications and printed wiring boards.

Claims (1)

【特許請求の範囲】[Claims] ポリフェニレンスルフィド樹脂100重量部に対して、
平均粒子径が1〜10μの範囲の無機充填材10〜25
0重量部を含有せしめてなるポリフェニレンスルフィド
樹脂成形品を、ポリフェニレンスルフィドの良溶媒を用
いて粗表面化処理した後、メッキ処理することを特徴と
するポリフェニレンスルフィド樹脂成形品の表面金属化
方法。
For 100 parts by weight of polyphenylene sulfide resin,
Inorganic filler 10-25 with an average particle diameter in the range of 1-10μ
1. A method for surface metallizing a polyphenylene sulfide resin molded article, which comprises roughening the surface of a polyphenylene sulfide resin molded article containing 0 parts by weight using a good solvent for polyphenylene sulfide, and then subjecting it to plating treatment.
JP2346285A 1985-02-12 1985-02-12 Method for metallizing surface of molded polyphenylene sulfide resin Pending JPS61183473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2346285A JPS61183473A (en) 1985-02-12 1985-02-12 Method for metallizing surface of molded polyphenylene sulfide resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2346285A JPS61183473A (en) 1985-02-12 1985-02-12 Method for metallizing surface of molded polyphenylene sulfide resin

Publications (1)

Publication Number Publication Date
JPS61183473A true JPS61183473A (en) 1986-08-16

Family

ID=12111182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2346285A Pending JPS61183473A (en) 1985-02-12 1985-02-12 Method for metallizing surface of molded polyphenylene sulfide resin

Country Status (1)

Country Link
JP (1) JPS61183473A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6686406B2 (en) 2000-04-26 2004-02-03 The Furukawa Electric Co., Ltd. Dielectric ceramic, resin-ceramic composite material, electrical part and antenna, and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6686406B2 (en) 2000-04-26 2004-02-03 The Furukawa Electric Co., Ltd. Dielectric ceramic, resin-ceramic composite material, electrical part and antenna, and manufacturing method thereof

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