JPS61182587U - - Google Patents
Info
- Publication number
- JPS61182587U JPS61182587U JP1985065628U JP6562885U JPS61182587U JP S61182587 U JPS61182587 U JP S61182587U JP 1985065628 U JP1985065628 U JP 1985065628U JP 6562885 U JP6562885 U JP 6562885U JP S61182587 U JPS61182587 U JP S61182587U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting
- surface side
- emitting surface
- envelope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985065628U JPH0328470Y2 (US08063081-20111122-C00044.png) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985065628U JPH0328470Y2 (US08063081-20111122-C00044.png) | 1985-04-30 | 1985-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61182587U true JPS61182587U (US08063081-20111122-C00044.png) | 1986-11-14 |
JPH0328470Y2 JPH0328470Y2 (US08063081-20111122-C00044.png) | 1991-06-19 |
Family
ID=30597797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985065628U Expired JPH0328470Y2 (US08063081-20111122-C00044.png) | 1985-04-30 | 1985-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0328470Y2 (US08063081-20111122-C00044.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012039154A (ja) * | 2006-09-12 | 2012-02-23 | Hui Zhou Light Engine Ltd | 一体成形ledライトワイヤ |
US8496351B2 (en) * | 2006-09-12 | 2013-07-30 | Huizhou Light Engine Ltd. | Integrally formed single piece light emitting diode light wire and uses thereof |
US8567992B2 (en) | 2006-09-12 | 2013-10-29 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
US8807796B2 (en) | 2006-09-12 | 2014-08-19 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4892876U (US08063081-20111122-C00044.png) * | 1972-02-10 | 1973-11-07 |
-
1985
- 1985-04-30 JP JP1985065628U patent/JPH0328470Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4892876U (US08063081-20111122-C00044.png) * | 1972-02-10 | 1973-11-07 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012039154A (ja) * | 2006-09-12 | 2012-02-23 | Hui Zhou Light Engine Ltd | 一体成形ledライトワイヤ |
US8496351B2 (en) * | 2006-09-12 | 2013-07-30 | Huizhou Light Engine Ltd. | Integrally formed single piece light emitting diode light wire and uses thereof |
JP2013153224A (ja) * | 2006-09-12 | 2013-08-08 | Hui Zhou Light Engine Ltd | 一体成形ledライトワイヤ |
US8567992B2 (en) | 2006-09-12 | 2013-10-29 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
US8789971B2 (en) * | 2006-09-12 | 2014-07-29 | Huizhou Light Engine Ltd | Integrally formed single piece light emitting diode light wire |
US8807796B2 (en) | 2006-09-12 | 2014-08-19 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH0328470Y2 (US08063081-20111122-C00044.png) | 1991-06-19 |