JPS61182587U - - Google Patents

Info

Publication number
JPS61182587U
JPS61182587U JP1985065628U JP6562885U JPS61182587U JP S61182587 U JPS61182587 U JP S61182587U JP 1985065628 U JP1985065628 U JP 1985065628U JP 6562885 U JP6562885 U JP 6562885U JP S61182587 U JPS61182587 U JP S61182587U
Authority
JP
Japan
Prior art keywords
light
emitting
surface side
emitting surface
envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985065628U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328470Y2 (US07943777-20110517-C00090.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985065628U priority Critical patent/JPH0328470Y2/ja
Publication of JPS61182587U publication Critical patent/JPS61182587U/ja
Application granted granted Critical
Publication of JPH0328470Y2 publication Critical patent/JPH0328470Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP1985065628U 1985-04-30 1985-04-30 Expired JPH0328470Y2 (US07943777-20110517-C00090.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985065628U JPH0328470Y2 (US07943777-20110517-C00090.png) 1985-04-30 1985-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985065628U JPH0328470Y2 (US07943777-20110517-C00090.png) 1985-04-30 1985-04-30

Publications (2)

Publication Number Publication Date
JPS61182587U true JPS61182587U (US07943777-20110517-C00090.png) 1986-11-14
JPH0328470Y2 JPH0328470Y2 (US07943777-20110517-C00090.png) 1991-06-19

Family

ID=30597797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985065628U Expired JPH0328470Y2 (US07943777-20110517-C00090.png) 1985-04-30 1985-04-30

Country Status (1)

Country Link
JP (1) JPH0328470Y2 (US07943777-20110517-C00090.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039154A (ja) * 2006-09-12 2012-02-23 Hui Zhou Light Engine Ltd 一体成形ledライトワイヤ
US8496351B2 (en) * 2006-09-12 2013-07-30 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
US8567992B2 (en) 2006-09-12 2013-10-29 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
US8807796B2 (en) 2006-09-12 2014-08-19 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892876U (US07943777-20110517-C00090.png) * 1972-02-10 1973-11-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892876U (US07943777-20110517-C00090.png) * 1972-02-10 1973-11-07

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039154A (ja) * 2006-09-12 2012-02-23 Hui Zhou Light Engine Ltd 一体成形ledライトワイヤ
US8496351B2 (en) * 2006-09-12 2013-07-30 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
JP2013153224A (ja) * 2006-09-12 2013-08-08 Hui Zhou Light Engine Ltd 一体成形ledライトワイヤ
US8567992B2 (en) 2006-09-12 2013-10-29 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
US8789971B2 (en) * 2006-09-12 2014-07-29 Huizhou Light Engine Ltd Integrally formed single piece light emitting diode light wire
US8807796B2 (en) 2006-09-12 2014-08-19 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof

Also Published As

Publication number Publication date
JPH0328470Y2 (US07943777-20110517-C00090.png) 1991-06-19

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