JPS61182063U - - Google Patents
Info
- Publication number
- JPS61182063U JPS61182063U JP6701885U JP6701885U JPS61182063U JP S61182063 U JPS61182063 U JP S61182063U JP 6701885 U JP6701885 U JP 6701885U JP 6701885 U JP6701885 U JP 6701885U JP S61182063 U JPS61182063 U JP S61182063U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- double
- printed wiring
- wiring board
- sided printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6701885U JPS61182063U (fr) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6701885U JPS61182063U (fr) | 1985-05-07 | 1985-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61182063U true JPS61182063U (fr) | 1986-11-13 |
Family
ID=30600444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6701885U Pending JPS61182063U (fr) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61182063U (fr) |
-
1985
- 1985-05-07 JP JP6701885U patent/JPS61182063U/ja active Pending