JPS61182036U - - Google Patents

Info

Publication number
JPS61182036U
JPS61182036U JP6635685U JP6635685U JPS61182036U JP S61182036 U JPS61182036 U JP S61182036U JP 6635685 U JP6635685 U JP 6635685U JP 6635685 U JP6635685 U JP 6635685U JP S61182036 U JPS61182036 U JP S61182036U
Authority
JP
Japan
Prior art keywords
semiconductor element
lead frame
view
sectional
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6635685U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6635685U priority Critical patent/JPS61182036U/ja
Publication of JPS61182036U publication Critical patent/JPS61182036U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP6635685U 1985-05-02 1985-05-02 Pending JPS61182036U (US20070244113A1-20071018-C00087.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6635685U JPS61182036U (US20070244113A1-20071018-C00087.png) 1985-05-02 1985-05-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6635685U JPS61182036U (US20070244113A1-20071018-C00087.png) 1985-05-02 1985-05-02

Publications (1)

Publication Number Publication Date
JPS61182036U true JPS61182036U (US20070244113A1-20071018-C00087.png) 1986-11-13

Family

ID=30599185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6635685U Pending JPS61182036U (US20070244113A1-20071018-C00087.png) 1985-05-02 1985-05-02

Country Status (1)

Country Link
JP (1) JPS61182036U (US20070244113A1-20071018-C00087.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02158159A (ja) * 1988-12-12 1990-06-18 Mitsubishi Electric Corp 半導体集積回路装置及びその製造方法
JP2003068958A (ja) * 2001-08-28 2003-03-07 Dainippon Printing Co Ltd ディスクリート用パッケージ及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02158159A (ja) * 1988-12-12 1990-06-18 Mitsubishi Electric Corp 半導体集積回路装置及びその製造方法
JP2003068958A (ja) * 2001-08-28 2003-03-07 Dainippon Printing Co Ltd ディスクリート用パッケージ及びその製造方法

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