JPS61178225U - - Google Patents
Info
- Publication number
- JPS61178225U JPS61178225U JP6101385U JP6101385U JPS61178225U JP S61178225 U JPS61178225 U JP S61178225U JP 6101385 U JP6101385 U JP 6101385U JP 6101385 U JP6101385 U JP 6101385U JP S61178225 U JPS61178225 U JP S61178225U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip
- hole
- shaped electronic
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 2
Description
第１図は本考案によるメンブレンスイツチのチ
ツプ状電子部品収納構造を示す断面図、第２図は
従来のメンブレンスイツリのチツプ状電子部品収
納構造を示す断面図である。
１……上部シート、２……上部電極、３……下
部シート、３ａ……貫通穴、４……下部電極、５
……スペーサ、５ａ，５ｂ……透孔、６……チツ
プ状電子部品、８……支持板、８ａ……逃げ部。
FIG. 1 is a sectional view showing a chip-shaped electronic component storage structure of a membrane switch according to the present invention, and FIG. 2 is a sectional view showing a chip-shaped electronic component storage structure of a conventional membrane switch. 1... Upper sheet, 2... Upper electrode, 3... Lower sheet, 3a... Through hole, 4... Lower electrode, 5
... Spacer, 5a, 5b ... Through hole, 6 ... Chip-shaped electronic component, 8 ... Support plate, 8a ... Relief part.
Claims (1)
スペーサと、下部電極を有する下部シートとが上
から順次積層されて支持板上に載置され、前記上
部電極と下部電極とが接離可能に対向していると
共に、前記透孔を利用してチツプ状電子部品を収
納してなるメンブレンスイツチにおいて、前記上
部シートの下面に前記チツプ状電子部品を取り付
けると共に、前記下部シートの前記チツプ状電子
部品を臨む位置に該電子部品を貫通するための貫
通穴を設け、かつ前記支持板の前記貫通穴を臨む
位置に前記チツプ状電子部品との非接触を確保す
るための逃げ部を設けたことを特徴とするメンブ
レンスイツチのチツプ状電子部品収納構造。 An upper sheet having an upper electrode, a spacer having a through hole, and a lower sheet having a lower electrode are sequentially laminated from above and placed on a support plate, and the upper electrode and the lower electrode face each other so as to be detachable. In the membrane switch in which a chip-shaped electronic component is housed using the through hole, the chip-shaped electronic component is attached to the lower surface of the upper sheet, and the chip-shaped electronic component is attached to the lower surface of the lower sheet. A through hole for passing through the electronic component is provided at a position facing the electronic component, and a relief part is provided at a position facing the through hole of the support plate to ensure non-contact with the chip-shaped electronic component. A chip-shaped electronic component storage structure for a membrane switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6101385U JPS61178225U (en) | 1985-04-25 | 1985-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6101385U JPS61178225U (en) | 1985-04-25 | 1985-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61178225U true JPS61178225U (en) | 1986-11-07 |
Family
ID=30588889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6101385U Pending JPS61178225U (en) | 1985-04-25 | 1985-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61178225U (en) |
-
1985
- 1985-04-25 JP JP6101385U patent/JPS61178225U/ja active Pending