JPS61174772U - - Google Patents

Info

Publication number

JPS61174772U

JPS61174772U JP5856385U JP5856385U JPS61174772U JP S61174772 U JPS61174772 U JP S61174772U JP 5856385 U JP5856385 U JP 5856385U JP 5856385 U JP5856385 U JP 5856385U JP S61174772 U JPS61174772 U JP S61174772U

Authority

JP

Japan

Prior art keywords

conductive chip

wiring board

printed wiring

copper film

pattern connection

Prior art date

1985-04-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
• 229910052802 copper Inorganic materials 0.000 claims description 4
• 239000010949 copper Substances 0.000 claims description 4
• 238000000034 method Methods 0.000 description 2
• 238000005476 soldering Methods 0.000 description 1