JPS61173894U - - Google Patents
Info
- Publication number
- JPS61173894U JPS61173894U JP5840485U JP5840485U JPS61173894U JP S61173894 U JPS61173894 U JP S61173894U JP 5840485 U JP5840485 U JP 5840485U JP 5840485 U JP5840485 U JP 5840485U JP S61173894 U JPS61173894 U JP S61173894U
- Authority
- JP
- Japan
- Prior art keywords
- tongue piece
- elbow
- cover
- appropriate
- elbow cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002985 plastic film Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Branch Pipes, Bends, And The Like (AREA)
- Protection Of Pipes Against Damage, Friction, And Corrosion (AREA)
- Thermal Insulation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5840485U JPS61173894U (OSRAM) | 1985-04-19 | 1985-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5840485U JPS61173894U (OSRAM) | 1985-04-19 | 1985-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61173894U true JPS61173894U (OSRAM) | 1986-10-29 |
Family
ID=30583870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5840485U Pending JPS61173894U (OSRAM) | 1985-04-19 | 1985-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61173894U (OSRAM) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6029984B2 (ja) * | 1978-06-28 | 1985-07-13 | 富士通株式会社 | 主メモリ・ダンプ方式 |
-
1985
- 1985-04-19 JP JP5840485U patent/JPS61173894U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6029984B2 (ja) * | 1978-06-28 | 1985-07-13 | 富士通株式会社 | 主メモリ・ダンプ方式 |