JPS61173185U - - Google Patents
Info
- Publication number
- JPS61173185U JPS61173185U JP5550185U JP5550185U JPS61173185U JP S61173185 U JPS61173185 U JP S61173185U JP 5550185 U JP5550185 U JP 5550185U JP 5550185 U JP5550185 U JP 5550185U JP S61173185 U JPS61173185 U JP S61173185U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- lead wire
- housing
- electronic
- bush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Casings For Electric Apparatus (AREA)
Description
第１図は本案を電子、電気部品としての近接ス
イツチに適用した場合の望ましい一実施例の概略
構成断面図、第２図は同じく電子、電気部品とし
ての近接スイツチにおいて従来採用されていたリ
ード線引出し部におけるシール構造の代表的一例
の概略構成断面図、である。
図中、１はハウジング、４はリード線、５はブ
ツシユ、５ａはリード線被覆部、５ｂはブツシユ
端部乃至ブツシユ・キヤツプ、５ｃは隆起環、６
は蓋板乃至ハウジングの二壁面部、６ａは透孔、
６ｂは環状ボス、６ｃは溝、である。
Figure 1 is a schematic sectional view of a preferred embodiment of the present invention when applied to a proximity switch as an electronic or electrical component, and Figure 2 is a lead wire conventionally employed in a proximity switch as an electronic or electrical component. FIG. 2 is a schematic cross-sectional view of a typical example of a seal structure in a drawer section. In the figure, 1 is a housing, 4 is a lead wire, 5 is a bushing, 5a is a lead wire covering part, 5b is a bushing end or bushing cap, 5c is a raised ring, 6
6a is a through hole,
6b is an annular boss, and 6c is a groove.
Claims (1)
線を外部に引出すための透孔を開けた電子、電気
部品の当該リード線引出し部におけるシール構造
において、 上記リード線と上記透孔との間にブツシユを介
挿させ； ハウジング内の該ブツシユ端部を上記蓋板側に
折曲して隆起環を形成すると共に； 上記透孔のハウジング内に向いた周縁部に沿つ
ては、該透孔と一連の中央孔を持ち半径方向外向
きの外周面を持つ環状ボスを形成し； 上記隆起環を該環状ボスに係合させて密接状態
としたこと； を特徴とする電子、電気部品のリード線引出し部
シール構造。[Scope of Claim for Utility Model Registration] In a sealing structure for the lead wire extraction portion of an electronic or electrical component in which a through hole is formed in a cover plate provided on a part of the housing wall surface for leading the lead wire to the outside, the above-mentioned lead A bush is inserted between the wire and the through hole; an end of the bush within the housing is bent toward the cover plate to form a raised ring; and a peripheral edge of the through hole facing into the housing. An annular boss is formed along the through hole and a series of central holes and has an outer circumferential surface facing outward in the radial direction; The raised ring is engaged with the annular boss to form a close contact. Seal structure for lead wire extraction parts of electronic and electrical components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985055501U JPH046226Y2 (en) | 1985-04-16 | 1985-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985055501U JPH046226Y2 (en) | 1985-04-16 | 1985-04-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61173185U true JPS61173185U (en) | 1986-10-28 |
| JPH046226Y2 JPH046226Y2 (en) | 1992-02-20 |
Family
ID=30578235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985055501U Expired JPH046226Y2 (en) | 1985-04-16 | 1985-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046226Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206283A (en) * | 1990-11-29 | 1992-07-28 | Mitsubishi Electric Corp | Circuit board housing device |
| JPH058131U (en) * | 1991-07-11 | 1993-02-05 | エヌオーケー株式会社 | Grommet mounting structure |
| JP2017092354A (en) * | 2015-11-13 | 2017-05-25 | オムロン株式会社 | Electronic apparatus |
| JP2017092192A (en) * | 2015-11-06 | 2017-05-25 | オムロン株式会社 | Method of manufacturing electronic apparatus and electronic apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52166758U (en) * | 1976-06-11 | 1977-12-17 | ||
| JPS56129137U (en) * | 1980-02-28 | 1981-10-01 |
-
1985
- 1985-04-16 JP JP1985055501U patent/JPH046226Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52166758U (en) * | 1976-06-11 | 1977-12-17 | ||
| JPS56129137U (en) * | 1980-02-28 | 1981-10-01 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206283A (en) * | 1990-11-29 | 1992-07-28 | Mitsubishi Electric Corp | Circuit board housing device |
| JPH058131U (en) * | 1991-07-11 | 1993-02-05 | エヌオーケー株式会社 | Grommet mounting structure |
| JP2017092192A (en) * | 2015-11-06 | 2017-05-25 | オムロン株式会社 | Method of manufacturing electronic apparatus and electronic apparatus |
| JP2017092354A (en) * | 2015-11-13 | 2017-05-25 | オムロン株式会社 | Electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH046226Y2 (en) | 1992-02-20 |
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