JPS61173135U - - Google Patents

Info

Publication number
JPS61173135U
JPS61173135U JP1985056508U JP5650885U JPS61173135U JP S61173135 U JPS61173135 U JP S61173135U JP 1985056508 U JP1985056508 U JP 1985056508U JP 5650885 U JP5650885 U JP 5650885U JP S61173135 U JPS61173135 U JP S61173135U
Authority
JP
Japan
Prior art keywords
semiconductor device
face
wiring board
printed wiring
down mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985056508U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985056508U priority Critical patent/JPS61173135U/ja
Publication of JPS61173135U publication Critical patent/JPS61173135U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)
JP1985056508U 1985-04-16 1985-04-16 Pending JPS61173135U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985056508U JPS61173135U (fr) 1985-04-16 1985-04-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985056508U JPS61173135U (fr) 1985-04-16 1985-04-16

Publications (1)

Publication Number Publication Date
JPS61173135U true JPS61173135U (fr) 1986-10-28

Family

ID=30580168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985056508U Pending JPS61173135U (fr) 1985-04-16 1985-04-16

Country Status (1)

Country Link
JP (1) JPS61173135U (fr)

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