JPS61171297U - - Google Patents

Info

Publication number
JPS61171297U
JPS61171297U JP5401185U JP5401185U JPS61171297U JP S61171297 U JPS61171297 U JP S61171297U JP 5401185 U JP5401185 U JP 5401185U JP 5401185 U JP5401185 U JP 5401185U JP S61171297 U JPS61171297 U JP S61171297U
Authority
JP
Japan
Prior art keywords
electronic device
resin layer
fin
mold
irregularities
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5401185U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5401185U priority Critical patent/JPS61171297U/ja
Publication of JPS61171297U publication Critical patent/JPS61171297U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP5401185U 1985-04-10 1985-04-10 Pending JPS61171297U (US07922777-20110412-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5401185U JPS61171297U (US07922777-20110412-C00004.png) 1985-04-10 1985-04-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5401185U JPS61171297U (US07922777-20110412-C00004.png) 1985-04-10 1985-04-10

Publications (1)

Publication Number Publication Date
JPS61171297U true JPS61171297U (US07922777-20110412-C00004.png) 1986-10-24

Family

ID=30575392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5401185U Pending JPS61171297U (US07922777-20110412-C00004.png) 1985-04-10 1985-04-10

Country Status (1)

Country Link
JP (1) JPS61171297U (US07922777-20110412-C00004.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016157786A (ja) * 2015-02-24 2016-09-01 三菱電機株式会社 放熱構造体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016157786A (ja) * 2015-02-24 2016-09-01 三菱電機株式会社 放熱構造体

Similar Documents

Publication Publication Date Title
JPS61171297U (US07922777-20110412-C00004.png)
JPS6048243U (ja) 半導体装置
JPS6234419U (US07922777-20110412-C00004.png)
JPS60183429U (ja) 電子部品
JPS6214742U (US07922777-20110412-C00004.png)
JPS60185658U (ja) 四弗化樹脂をコ−テイングしたホウロウ鉄板
JPS58134229U (ja) 穴の位置出し機能を有するモデル
JPS6056600U (ja) 装飾用樹脂モ−ル
JPH0171463U (US07922777-20110412-C00004.png)
JPS6245861U (US07922777-20110412-C00004.png)
JPS5829733U (ja) クロス下地用合成樹脂製コ−ナ部材
JPS6039272U (ja) 厚膜回路基板
JPS5975023U (ja) 樹脂モ−ルド装置
JPS599532U (ja) 電子部品
JPS6212948U (US07922777-20110412-C00004.png)
JPS6219745U (US07922777-20110412-C00004.png)
JPS61192480U (US07922777-20110412-C00004.png)
JPS59169910U (ja) 樹脂成形用金型
JPS60134612U (ja) 射出成形用金型
JPS6444638U (US07922777-20110412-C00004.png)
JPS60179737U (ja) 板材とゴム成型物で構成される床材
JPS63119247U (US07922777-20110412-C00004.png)
JPH0375564U (US07922777-20110412-C00004.png)
JPS5919316U (ja) 繊維強化合成樹脂製品の成型用石膏モ−ルド
JPS63142843U (US07922777-20110412-C00004.png)