JPS61171248U - - Google Patents
Info
- Publication number
- JPS61171248U JPS61171248U JP5411385U JP5411385U JPS61171248U JP S61171248 U JPS61171248 U JP S61171248U JP 5411385 U JP5411385 U JP 5411385U JP 5411385 U JP5411385 U JP 5411385U JP S61171248 U JPS61171248 U JP S61171248U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- bonder
- hot air
- semiconductor manufacturing
- function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims 1
- 238000011109 contamination Methods 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5411385U JPS61171248U (da) | 1985-04-11 | 1985-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5411385U JPS61171248U (da) | 1985-04-11 | 1985-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61171248U true JPS61171248U (da) | 1986-10-24 |
Family
ID=30575586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5411385U Pending JPS61171248U (da) | 1985-04-11 | 1985-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171248U (da) |
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1985
- 1985-04-11 JP JP5411385U patent/JPS61171248U/ja active Pending