JPS61168573U - - Google Patents
Info
- Publication number
- JPS61168573U JPS61168573U JP5337885U JP5337885U JPS61168573U JP S61168573 U JPS61168573 U JP S61168573U JP 5337885 U JP5337885 U JP 5337885U JP 5337885 U JP5337885 U JP 5337885U JP S61168573 U JPS61168573 U JP S61168573U
- Authority
- JP
- Japan
- Prior art keywords
- conductive parts
- sheet
- thermally bonded
- utility
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5337885U JPS61168573U (US07923587-20110412-C00022.png) | 1985-04-09 | 1985-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5337885U JPS61168573U (US07923587-20110412-C00022.png) | 1985-04-09 | 1985-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61168573U true JPS61168573U (US07923587-20110412-C00022.png) | 1986-10-18 |
Family
ID=30574185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5337885U Pending JPS61168573U (US07923587-20110412-C00022.png) | 1985-04-09 | 1985-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61168573U (US07923587-20110412-C00022.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008071700A (ja) * | 2006-09-15 | 2008-03-27 | Japan Aviation Electronics Industry Ltd | 電気接続部材 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57208002A (en) * | 1981-06-18 | 1982-12-21 | Shinetsu Polymer Co | Thermal pressure conductive composition |
| JPS5823174A (ja) * | 1981-07-31 | 1983-02-10 | 信越ポリマー株式会社 | 接続端子の電気接続方法 |
-
1985
- 1985-04-09 JP JP5337885U patent/JPS61168573U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57208002A (en) * | 1981-06-18 | 1982-12-21 | Shinetsu Polymer Co | Thermal pressure conductive composition |
| JPS5823174A (ja) * | 1981-07-31 | 1983-02-10 | 信越ポリマー株式会社 | 接続端子の電気接続方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008071700A (ja) * | 2006-09-15 | 2008-03-27 | Japan Aviation Electronics Industry Ltd | 電気接続部材 |
