JPS61162076U - - Google Patents
Info
- Publication number
- JPS61162076U JPS61162076U JP4322985U JP4322985U JPS61162076U JP S61162076 U JPS61162076 U JP S61162076U JP 4322985 U JP4322985 U JP 4322985U JP 4322985 U JP4322985 U JP 4322985U JP S61162076 U JPS61162076 U JP S61162076U
- Authority
- JP
- Japan
- Prior art keywords
- chip components
- circuit board
- printed circuit
- copper foil
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4322985U JPS61162076U (fi) | 1985-03-27 | 1985-03-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4322985U JPS61162076U (fi) | 1985-03-27 | 1985-03-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61162076U true JPS61162076U (fi) | 1986-10-07 |
Family
ID=30554707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4322985U Pending JPS61162076U (fi) | 1985-03-27 | 1985-03-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61162076U (fi) |
-
1985
- 1985-03-27 JP JP4322985U patent/JPS61162076U/ja active Pending