JPS61158944U - - Google Patents
Info
- Publication number
- JPS61158944U JPS61158944U JP4341385U JP4341385U JPS61158944U JP S61158944 U JPS61158944 U JP S61158944U JP 4341385 U JP4341385 U JP 4341385U JP 4341385 U JP4341385 U JP 4341385U JP S61158944 U JPS61158944 U JP S61158944U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holding
- evaporation
- identification symbol
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4341385U JPS61158944U (en:Method) | 1985-03-26 | 1985-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4341385U JPS61158944U (en:Method) | 1985-03-26 | 1985-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61158944U true JPS61158944U (en:Method) | 1986-10-02 |
Family
ID=30555059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4341385U Pending JPS61158944U (en:Method) | 1985-03-26 | 1985-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61158944U (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993009565A1 (fr) * | 1991-10-29 | 1993-05-13 | Komatsu Electronic Metals Co., Ltd. | Appareil et procede pour la fabrication de tranches de semi-conducteur |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5396015A (en) * | 1977-02-02 | 1978-08-22 | Shiseido Co Ltd | Production of mirror with letter patterns* etc* |
| JPS5848414A (ja) * | 1981-09-17 | 1983-03-22 | Toshiba Corp | 半導体基板の印字方法 |
| JPS5825039B2 (ja) * | 1975-02-28 | 1983-05-25 | 株式会社東芝 | リニアモ−タノデンリヨクキヨウキユウソウチ |
| JPS58104178A (ja) * | 1981-12-12 | 1983-06-21 | Olympus Optical Co Ltd | 電極蒸着方法 |
-
1985
- 1985-03-26 JP JP4341385U patent/JPS61158944U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825039B2 (ja) * | 1975-02-28 | 1983-05-25 | 株式会社東芝 | リニアモ−タノデンリヨクキヨウキユウソウチ |
| JPS5396015A (en) * | 1977-02-02 | 1978-08-22 | Shiseido Co Ltd | Production of mirror with letter patterns* etc* |
| JPS5848414A (ja) * | 1981-09-17 | 1983-03-22 | Toshiba Corp | 半導体基板の印字方法 |
| JPS58104178A (ja) * | 1981-12-12 | 1983-06-21 | Olympus Optical Co Ltd | 電極蒸着方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993009565A1 (fr) * | 1991-10-29 | 1993-05-13 | Komatsu Electronic Metals Co., Ltd. | Appareil et procede pour la fabrication de tranches de semi-conducteur |