JPS61156253U - - Google Patents
Info
- Publication number
- JPS61156253U JPS61156253U JP3864885U JP3864885U JPS61156253U JP S61156253 U JPS61156253 U JP S61156253U JP 3864885 U JP3864885 U JP 3864885U JP 3864885 U JP3864885 U JP 3864885U JP S61156253 U JPS61156253 U JP S61156253U
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- staggered
- electronic device
- utility
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案の一実施例を示す斜視図、第２
図は第１図のＦ―Ｆ線矢視図、第３図は本考案の
他の実施例を示す斜視図、第４図は第３図のＧ―
Ｇ線矢視図、第５図は従来の発光ダイオードの一
例を示す斜視図、第６図はこの発光ダイオードの
実装例を示す斜視図である。
１０……電子素子（発光ダイオード）、１２ａ
，１２ｂ……リード線、１６……本体。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a view taken along line F--F in FIG. 1, FIG. 3 is a perspective view showing another embodiment of the present invention, and FIG.
5 is a perspective view showing an example of a conventional light emitting diode, and FIG. 6 is a perspective view showing an example of mounting this light emitting diode. 10...Electronic element (light emitting diode), 12a
, 12b... Lead wire, 16... Main body.
Claims (1)
、前記リード線をツイストペアにして前記リード
線の各始端と各終端とをずらしたことを特徴とす
る電子素子。 1. An electronic device having two or more lead wires, characterized in that the lead wires are formed into a twisted pair and the starting ends and ending ends of the lead wires are staggered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3864885U JPS61156253U (en) | 1985-03-18 | 1985-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3864885U JPS61156253U (en) | 1985-03-18 | 1985-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61156253U true JPS61156253U (en) | 1986-09-27 |
Family
ID=30545852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3864885U Pending JPS61156253U (en) | 1985-03-18 | 1985-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61156253U (en) |
-
1985
- 1985-03-18 JP JP3864885U patent/JPS61156253U/ja active Pending