JPS61154954A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS61154954A JPS61154954A JP59275462A JP27546284A JPS61154954A JP S61154954 A JPS61154954 A JP S61154954A JP 59275462 A JP59275462 A JP 59275462A JP 27546284 A JP27546284 A JP 27546284A JP S61154954 A JPS61154954 A JP S61154954A
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- layer
- common electrode
- heat generating
- wiring conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、薄膜技術により発熱抵抗体や配線用導体を形
成したサーマルヘッドに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thermal head in which a heating resistor and a wiring conductor are formed using thin film technology.
従来の技術
従来、この種のサーマルヘッドは第４図および第５図に
示すように形成されている。すなわち。2. Description of the Related Art Conventionally, this type of thermal head has been formed as shown in FIGS. 4 and 5. Namely.
絶縁性基板１の表面にグレーズ層２を形成し、こ ”
のグレーズ層２の表面に各エレメント毎に平行に分割さ
れた発熱抵抗体層３が形成され、この発熱抵抗体層３の
表面に配線用導体層４が形成されている。この配線用導
体層４は、共通電極５と給電用電極６とよりなり、この
給電用電極６のそ九ぞれと前記共通電極５との間に前記
発熱抵抗体層３が露出されて発熱部７が形成されている
。このような発熱部７の表面には前記配線用導体層４と
ともに耐摩耗保護Ｍ８が積層形成されている。A glaze layer 2 is formed on the surface of an insulating substrate 1.
A heating resistor layer 3 divided in parallel for each element is formed on the surface of the glaze layer 2, and a wiring conductor layer 4 is formed on the surface of this heating resistor layer 3. This wiring conductor layer 4 consists of a common electrode 5 and a power feeding electrode 6, and the heat generating resistor layer 3 is exposed between each of the power feeding electrodes 6 and the common electrode 5 to generate heat. A portion 7 is formed. On the surface of such a heat generating portion 7, a wear-resistant protection M8 is laminated together with the wiring conductor layer 4.
発明が解決しようとする問題点
このような構造の従来のサーマルヘッドにおいて、高速
印字の際にサーマルヘッドと記録紙または転写リボンと
の摩擦により静電気が発生し、その静電気が耐摩耗保護
層８の不均一な部分、たとえば異物の混入部やピンホー
ル等を通じて発熱部７に向って放電し、この放電により
生じた熱により耐摩耗保護層８に剥離や亀裂が生じる。Problems to be Solved by the Invention In the conventional thermal head having such a structure, static electricity is generated due to friction between the thermal head and the recording paper or transfer ribbon during high-speed printing, and the static electricity is applied to the wear-resistant protective layer 8. Discharge occurs toward the heat-generating portion 7 through non-uniform portions such as foreign matter contamination, pinholes, etc., and the heat generated by this discharge causes peeling and cracks in the wear-resistant protective layer 8.
その結果、発熱抵抗体層３の劣化あるいは破壊が起こり
。As a result, the heating resistor layer 3 deteriorates or is destroyed.
サーマルヘッドの寿命が著しく低下する。The life of the thermal head will be significantly reduced.
また、耐摩耗保護層８が絶縁性の低いＳｉＣの一層から
なるサーマルヘッドでは、印字の際に記録紙と配線用導
体層４と耐摩耗保護層８との間で電流のバイパスができ
、配線用導体層４と発熱部７との端面に対応する耐摩耗
保護層８が異常に摩耗し、サーマルヘッドの寿命を著し
く低下させるものである。In addition, in a thermal head in which the abrasion-resistant protective layer 8 is made of a single layer of SiC with low insulation, current can be bypassed between the recording paper, the wiring conductor layer 4, and the abrasion-resistant protective layer 8 during printing, and the wiring The wear-resistant protective layer 8 corresponding to the end faces of the conductor layer 4 and the heat generating part 7 is abnormally worn, significantly shortening the life of the thermal head.
問題点を解決するための手段
耐摩耗保護層を絶縁抵抗の高い第一の保護膜とこの第一
の保護膜の上に形成された絶縁抵抗の低い第二の保護膜
との二層構造とし、この第二の保護膜を配線用導体層の
共通電極に接続する。Means for solving the problem The wear-resistant protective layer has a two-layer structure consisting of a first protective film with high insulation resistance and a second protective film with low insulation resistance formed on the first protective film. , this second protective film is connected to the common electrode of the wiring conductor layer.
作用
表面に位置する第二の保護膜は絶縁抵抗が低く、しかも
共通電極に接続されているので、記録用紙や転写リボン
との間で生じた静電気は第二の保護膜と共通電極とを経
て徐々に放電され、これにより２発熱部に向っての放電
を阻止して発熱抵抗体層の劣化、破壊を防止する。The second protective film located on the working surface has low insulation resistance and is connected to the common electrode, so static electricity generated between the recording paper and the transfer ribbon is transferred through the second protective film and the common electrode. It is gradually discharged, thereby preventing discharge toward the two heat generating parts and preventing deterioration and destruction of the heat generating resistor layer.
発明の実施例
本発明の第一の実施例を第１図および第２図に基づいて
説明する。まず、プラテン１１に巻回された記録紙１２
にヘッド本体１３が接離自在に設けられている。このヘ
ッド本体１３は絶縁性基板１４を基礎にして形成されて
いるものである。すなわち、絶縁性基板１４の表面にグ
レーズ層１５が形成され、このグレーズ層１５の上に薄
膜技術により発熱体抵抗層１６と配線用導体層１７とが
積層形成されている。そして、この配線用導体層１７は
、共通電極１８と給電用電極１９とよりなり、この給電
用電極１９は前記発熱体抵抗層１６を露出させた発熱部
２０毎に配設されている。Embodiment of the Invention A first embodiment of the present invention will be described based on FIGS. 1 and 2. FIG. First, the recording paper 12 wound around the platen 11
A head main body 13 is provided in such a manner that it can be freely approached and separated. This head main body 13 is formed based on an insulating substrate 14. That is, a glaze layer 15 is formed on the surface of an insulating substrate 14, and a heating element resistance layer 16 and a wiring conductor layer 17 are laminated on this glaze layer 15 by thin film technology. The wiring conductor layer 17 includes a common electrode 18 and a power supply electrode 19, and the power supply electrode 19 is provided for each heat generating portion 20 in which the heat generating element resistance layer 16 is exposed.
このような発熱部２０の表面には、耐摩耗保護層２１が
形成されている。この耐摩耗保護層２１は前記発熱部２
０と前記配線用導体層１７とに接合する第一の保護膜２
２とこの第一の保護膜２２の上に形成される第二の保護
膜２３とよりなる。A wear-resistant protective layer 21 is formed on the surface of such a heat generating part 20. This wear-resistant protective layer 21
0 and the wiring conductor layer 17.
2 and a second protective film 23 formed on the first protective film 22.
そして、前記第一の保護膜２２はＳｉ３Ｎ４により形成
されてその絶縁抵抗が高く、前記第二の保護膜２３はＳ
ｉＣで形成されてその絶縁抵抗が低いように形成されて
いる。また、前記第一の保護膜２２はピンホールなどに
より絶縁不良が生じるのを防ぐために１μ以上であるこ
とが必要であり、記録用紙１２への熱伝導性を良好に維
持するためには２μ以下であることが望ましい、また、
前記第二の保護膜２３は熱伝導性、耐摩耗性を損わず静
電気を外部に放電させることができる程度の絶縁抵抗を
持ったものであることが必要であるが、そのために最適
な厚さは２〜６μであり、４μである。このように形成
された前記第二の保護膜２３と前記共通電極１８とは導
電物質としての導電用ペースト２４により電気的に導通
されている。The first protective film 22 is made of Si3N4 and has high insulation resistance, and the second protective film 23 is made of Si3N4.
It is formed of iC and has low insulation resistance. Further, the first protective film 22 needs to have a thickness of 1μ or more to prevent insulation failure due to pinholes, etc., and must have a thickness of 2μ or less to maintain good thermal conductivity to the recording paper 12. It is desirable that
The second protective film 23 needs to have insulation resistance to the extent that it can discharge static electricity to the outside without impairing thermal conductivity or wear resistance. The diameter is 2 to 6μ, and is 4μ. The second protective film 23 and the common electrode 18 thus formed are electrically connected by a conductive paste 24 as a conductive material.
このような構成において、印字動作を行なわせている状
態では、ヘッド本体１３が記録用紙１２に接触するため
、静電気が発生し易いが、この静電気は絶縁抵抗の低い
第二の保護膜２３と導電用ペースト２４とを通って共通
電極１８に流れ、発熱部２０に向っては流れない、した
がって、耐摩耗保護層２１の劣化や破壊が発生しない。In such a configuration, when a printing operation is performed, the head main body 13 comes into contact with the recording paper 12, so static electricity is likely to be generated. It flows through the paste 24 to the common electrode 18 and does not flow toward the heat generating part 20, so that the wear-resistant protective layer 21 does not deteriorate or break.
また、電流発生に基づく耐摩耗保護層２１の異常摩耗の
発生もない。Further, abnormal wear of the wear-resistant protective layer 21 due to current generation does not occur.
つぎに、第３図に基づいて本発明の第二の実施例を説明
する。前記実施例について説明した部分と同一部分は同
一符号を用い説明も省略する。本実施例は第二の保護膜
２３と共通電極１９との接続をその保護膜２３を第一の
保護膜２３よりも広く形成して側方に延長させることに
より直接接続するようにしたものである。したがって、
電気的な接続構造がきわめて容易になる。Next, a second embodiment of the present invention will be described based on FIG. The same parts as those described in the previous embodiment are designated by the same reference numerals, and the description thereof will be omitted. In this embodiment, the second protective film 23 and the common electrode 19 are directly connected by forming the protective film 23 wider than the first protective film 23 and extending it laterally. be. therefore,
Electrical connection structure becomes extremely easy.
なお、前記実施例においては、第二の保護膜２３の材質
をＳｉＣとして説明したが、ＴｉＣを用いても良いもの
である。In addition, although the material of the second protective film 23 was explained as SiC in the said Example, TiC may also be used.
発明の効果
本発明は、上述のように発熱抵抗体層と配線用導体層と
の上に形成される耐摩耗保護層を絶縁抵抗の高い第一の
保護膜と絶縁抵抗の低い第二の保護膜とにより形成し、
この第二の保護膜を配線用導体層の共通電極に接続した
ので、印字時に発生する静電気は第二の保護膜から共通
電極に徐々に放電されるので、発熱部に向けて通電され
たり放電されることはなく、耐摩耗保護層を有効に保護
してその寿命を伸ばすことができるものである。Effects of the Invention The present invention provides a wear-resistant protective layer formed on the heat generating resistor layer and the wiring conductor layer as described above by combining a first protective film with high insulation resistance and a second protective film with low insulation resistance. formed by a membrane,
Since this second protective film is connected to the common electrode of the wiring conductor layer, static electricity generated during printing is gradually discharged from the second protective film to the common electrode, so that it is not energized or discharged toward the heat generating part. This can effectively protect the wear-resistant protective layer and extend its lifespan.
第１図は本発明の第一の実施例を示す縦断側面図、第２
図はその使用状態を示す側面図、第３図は本発明の郊二
の実施例を示す縦断側面図、第４図は従来の一例を示す
縦断側面図、第５図はその平面図である。
１４・・・絶縁性基板、１６・・・発熱抵抗体層、１７
・・・配線用導体層、１９・・・共通電極、２０・・・
発熱部、２１・・・耐摩耗保護層、２２・・・第一の保
護膜、２３・・・第二の保護膜、２４・・・導電ペース
ト（導電物質）出 願 人 東京電気株式会社
３」 艮
ＪｌＺ国
３は国
３３場FIG. 1 is a vertical cross-sectional side view showing the first embodiment of the present invention, and the second
The figure is a side view showing the state of use, FIG. 3 is a longitudinal side view showing an embodiment of the present invention, FIG. 4 is a longitudinal side view showing a conventional example, and FIG. 5 is a plan view thereof. . 14... Insulating substrate, 16... Heat generating resistor layer, 17
... Wiring conductor layer, 19... Common electrode, 20...
Heat generating part, 21... Wear-resistant protective layer, 22... First protective film, 23... Second protective film, 24... Conductive paste (conductive material) Applicant: Tokyo Electric Co., Ltd. 3 ” Ai JlZ Koku 3 is Kuni 33 place
Claims (1)
耗保護膜とを順次積層形成した薄膜形サーマルヘッドに
おいて、前記耐摩耗保護膜を絶縁抵抗の高い第一の保護
膜とこの第一の保護膜の上に形成された絶縁抵抗の低い
第二の保護膜との二層構造とし、この第二の保護膜を前
記配線用導体層の共通電極に接続したことを特徴とする
サーマルヘッド。 ２、第一の保護膜よりも第二の保護膜を広く形成して共
通電極に接続するようにしたことを特徴とする特許請求
の範囲第１項記載のサーマルヘッド。 ３、第二の保護膜と共通電極とを導電物質で接続したこ
とを特徴とする特許請求の範囲第１項記載のサーマルヘ
ッド。 ４、第二の保護膜をＳｉＣまたはＴｉＮにより形成した
ことを特徴とする特許請求の範囲第１項記載のサーマル
ヘッド。[Claims] 1. In a thin-film thermal head in which a heating resistor layer, a wiring conductor layer, and an abrasion-resistant protective film are sequentially laminated on an insulating substrate, the abrasion-resistant protective film is formed by laminating a layer with high insulation resistance. It has a two-layer structure of one protective film and a second protective film with low insulation resistance formed on the first protective film, and this second protective film is connected to the common electrode of the wiring conductor layer. Thermal head is characterized by: 2. The thermal head according to claim 1, wherein the second protective film is formed wider than the first protective film and is connected to the common electrode. 3. The thermal head according to claim 1, wherein the second protective film and the common electrode are connected by a conductive material. 4. The thermal head according to claim 1, wherein the second protective film is formed of SiC or TiN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59275462A JPS61154954A (en) | 1984-12-28 | 1984-12-28 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59275462A JPS61154954A (en) | 1984-12-28 | 1984-12-28 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61154954A true JPS61154954A (en) | 1986-07-14 |
Family
ID=17555868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59275462A Pending JPS61154954A (en) | 1984-12-28 | 1984-12-28 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61154954A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63141764A (en) * | 1986-12-04 | 1988-06-14 | Matsushita Electric Ind Co Ltd | Thermal recording head |
| JPS63145052A (en) * | 1986-12-10 | 1988-06-17 | Matsushita Electric Ind Co Ltd | Thermal recording head |
| JPH0479646U (en) * | 1990-11-21 | 1992-07-10 | ||
| EP0999065A1 (en) * | 1997-07-22 | 2000-05-10 | Rohm Co., Ltd. | Construction of thermal print head and method of forming protective coating |
| CN100430232C (en) * | 2004-10-27 | 2008-11-05 | 京瓷株式会社 | Thermal head, method for manufacturing the same, and thermal printer |
| US7484834B2 (en) | 2004-10-27 | 2009-02-03 | Kyocera Corporation | Thermal head, method of manufacturing the same, and thermal printer |
| JP2015006791A (en) * | 2013-05-27 | 2015-01-15 | 京セラ株式会社 | Thermal head and thermal printer including the same |
| JP2017114057A (en) * | 2015-12-25 | 2017-06-29 | ローム株式会社 | Thermal print head |
| JP2017114051A (en) * | 2015-12-25 | 2017-06-29 | ローム株式会社 | Thermal print head |
| JP2017114056A (en) * | 2015-12-25 | 2017-06-29 | ローム株式会社 | Thermal print head |
| JP2020073343A (en) * | 2020-02-04 | 2020-05-14 | ローム株式会社 | Thermal print head |
| JP2020073344A (en) * | 2020-02-04 | 2020-05-14 | ローム株式会社 | Thermal print head |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61135765A (en) * | 1984-12-07 | 1986-06-23 | Matsushita Electric Ind Co Ltd | Preparation of abrasion resistant protective film of thermal head |
-
1984
- 1984-12-28 JP JP59275462A patent/JPS61154954A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61135765A (en) * | 1984-12-07 | 1986-06-23 | Matsushita Electric Ind Co Ltd | Preparation of abrasion resistant protective film of thermal head |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63141764A (en) * | 1986-12-04 | 1988-06-14 | Matsushita Electric Ind Co Ltd | Thermal recording head |
| JPS63145052A (en) * | 1986-12-10 | 1988-06-17 | Matsushita Electric Ind Co Ltd | Thermal recording head |
| JPH0479646U (en) * | 1990-11-21 | 1992-07-10 | ||
| EP0999065A1 (en) * | 1997-07-22 | 2000-05-10 | Rohm Co., Ltd. | Construction of thermal print head and method of forming protective coating |
| EP0999065A4 (en) * | 1997-07-22 | 2001-03-14 | Rohm Co Ltd | Construction of thermal print head and method of forming protective coating |
| US6448993B1 (en) | 1997-07-22 | 2002-09-10 | Rohm Co., Ltd. | Construction of thermal print head and method of forming protective coating |
| CN100430232C (en) * | 2004-10-27 | 2008-11-05 | 京瓷株式会社 | Thermal head, method for manufacturing the same, and thermal printer |
| US7484834B2 (en) | 2004-10-27 | 2009-02-03 | Kyocera Corporation | Thermal head, method of manufacturing the same, and thermal printer |
| JP2015006791A (en) * | 2013-05-27 | 2015-01-15 | 京セラ株式会社 | Thermal head and thermal printer including the same |
| JP2017114057A (en) * | 2015-12-25 | 2017-06-29 | ローム株式会社 | Thermal print head |
| JP2017114051A (en) * | 2015-12-25 | 2017-06-29 | ローム株式会社 | Thermal print head |
| JP2017114056A (en) * | 2015-12-25 | 2017-06-29 | ローム株式会社 | Thermal print head |
| JP2020073343A (en) * | 2020-02-04 | 2020-05-14 | ローム株式会社 | Thermal print head |
| JP2020073344A (en) * | 2020-02-04 | 2020-05-14 | ローム株式会社 | Thermal print head |
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