JPS61153373U - - Google Patents

Info

Publication number

JPS61153373U

JPS61153373U JP3573785U JP3573785U JPS61153373U JP S61153373 U JPS61153373 U JP S61153373U JP 3573785 U JP3573785 U JP 3573785U JP 3573785 U JP3573785 U JP 3573785U JP S61153373 U JPS61153373 U JP S61153373U

Authority

JP

Japan

Prior art keywords

chip components

wiring board

printed wiring

circuit component

laminated

Prior art date

1985-03-13

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (1)