JPS61152065A - Semiconductor photodetector - Google Patents

Semiconductor photodetector

Info

Publication number
JPS61152065A
JPS61152065A JP59273109A JP27310984A JPS61152065A JP S61152065 A JPS61152065 A JP S61152065A JP 59273109 A JP59273109 A JP 59273109A JP 27310984 A JP27310984 A JP 27310984A JP S61152065 A JPS61152065 A JP S61152065A
Authority
JP
Japan
Prior art keywords
light
photo
circuit
signal
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59273109A
Other languages
Japanese (ja)
Inventor
Koji Tanaka
幸次 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP59273109A priority Critical patent/JPS61152065A/en
Publication of JPS61152065A publication Critical patent/JPS61152065A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers

Abstract

PURPOSE:To prevent the erroneous operation due to the incident ray from other than a specific direction by making the directivity against the incident ray from the specific direction shaper. CONSTITUTION:A light emitting diode 1 and a photo sensing part 5 are fixed, a rotary slit plate 3 is rotated synchronously with the rotation of a detected object and the light irradiated on the photo sensing part from the light emitting diode 1 through a slit 4 is moved to the same direction with the rotating direction of the rotary slit late 3. A photo diode which detected the light irradiated from the light emitting diode 1 through the slit 4 is made conductive, a current flows through the resistance connected to the photo diode and the photo diode from a power source Vcc, he cathode terminal of the photo doide is made an L level by the voltage drop of the resistance and an L level signal is applied to the inversion input terminal of the AND circuit connected to the cathode terminal. The AND circuit inverts the applied L level signal to an H level signal and generates a photo sensing signal. In this way, especially sharp directivity against the incident ray from a specific direction is make.

Description

【発明の詳細な説明】 (発明の技術分野〕 本発明は半導体受光素子に関し、特に特定方向からの入
射光に対して指向性を向上させた半導体受光素子に関す
る。
DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a semiconductor light-receiving element, and more particularly to a semiconductor light-receiving element with improved directivity for incident light from a specific direction.

〔発明の技術的背景と問題点〕[Technical background and problems of the invention]

近年の半導体技術の進歩により、受光部が半導体受光素
子を複数個直線状に配列して成る所謂ラインイメージセ
ンサが普及しつつあり、その応用分野もかなり広く、各
方面での実用化がなされて ′いる。
Due to recent advances in semiconductor technology, so-called line image sensors, in which the light-receiving section has a plurality of semiconductor light-receiving elements arranged in a straight line, are becoming popular, and their application fields are quite wide, and they are being put into practical use in various fields. 'There is.

ところで、前記ラインイメージセンサは正確な計測を行
なう上で、その受光部を構成する複数個の半導体受光素
子の各々が所定の方向からの光の有無を確実に検出する
ことが必要である。しかし前記ラインイメージセンサの
各受光素子は、一般に基板上に略平面状に形成されてお
り、特定方向からの光に対して特に指向性を有する構成
とはなっていないので、反射、屈折及び回り込み光等の
雑音要因となる外来光が入射しやすく、従来よりS/N
比の向上等の観点からこのような外来光に対する対策が
切望されていた。
Incidentally, in order for the line image sensor to perform accurate measurements, it is necessary for each of the plurality of semiconductor light receiving elements constituting the light receiving section to reliably detect the presence or absence of light from a predetermined direction. However, each light-receiving element of the line image sensor is generally formed in a substantially planar shape on a substrate, and is not configured to have particular directivity with respect to light from a specific direction. External light that causes noise such as light easily enters, and the S/N is lower than before.
Measures against such extraneous light have been desperately needed from the viewpoint of improving the ratio.

〔発明の目的〕[Purpose of the invention]

本発明は、上記に鑑みてなされたもので、その目的とす
るところは、特定方向からの入射光に対して指向性を鋭
くし、前記特定方向以外からの入射光による誤動作を防
止した半導体受光素子を提供することにある。
The present invention has been made in view of the above, and an object of the present invention is to sharpen the directivity of light incident from a specific direction and prevent malfunctions caused by light incident from a direction other than the specific direction. The purpose is to provide devices.

〔発明の概要〕[Summary of the invention]

上記目的を達成するために、この発明は、特定方向から
の入射光に対して受光可能で、互いに受光面の角度の異
なる少なくとも2個以上の受光手段と、前記受光手段が
すべて受光状態のとき受光信号を出力する検出処理手段
とを有することを要旨とする。
In order to achieve the above object, the present invention provides at least two or more light receiving means capable of receiving incident light from a specific direction and having mutually different angles of light receiving surfaces, and when all of the light receiving means are in a light receiving state. The gist of the present invention is to include a detection processing means for outputting a light reception signal.

(発明の実施例〕 以下、図面を用いてこの発明の詳細な説明する。(Example of the invention) Hereinafter, the present invention will be explained in detail using the drawings.

第1図及び第2図は、本発明に係る半導体受光素子を回
転センサに適用した場合の一例を示すもので、第1図は
回転センサの送光部及び受光部の概略を示す断面図、第
2図は第1図に示す受光部の平面図である。
1 and 2 show an example in which the semiconductor light-receiving element according to the present invention is applied to a rotation sensor, and FIG. 1 is a sectional view schematically showing a light transmitting section and a light receiving section of the rotation sensor, FIG. 2 is a plan view of the light receiving section shown in FIG. 1.

第1図において、1は発光ダイオード、3は回転を検出
すべき検出対象物に同期して回転する回転スリット板、
4はこの回転スリット板に設けられたスリット、5は発
光ダイオード1に対し回転スリット板3をはさんで配設
される受光部である。
In FIG. 1, 1 is a light emitting diode, 3 is a rotating slit plate that rotates in synchronization with the object to be detected, the rotation of which is to be detected;
Reference numeral 4 denotes a slit provided on this rotary slit plate, and 5 denotes a light-receiving section arranged with the rotary slit plate 3 interposed between the light emitting diode 1 and the light emitting diode 1.

発光ダイオード1は回転スリット板3を介して受光部5
に光を供給する。回転スリット板3は所定のピッチで連
続的に刻み込まれたスリット4を有し、回転時には発光
ダイオード1からの光の受光部5への供給を透過遮断す
るものである。
The light emitting diode 1 is connected to the light receiving section 5 via the rotating slit plate 3.
supply light to. The rotating slit plate 3 has slits 4 continuously cut at a predetermined pitch, and during rotation, transmits and blocks light from the light emitting diode 1 from being supplied to the light receiving section 5.

受光部5は後述するバイポーラプロセスにより形成され
、スリット4を透過した発光ダイオード1からの光を検
出して、検出した光を電気信号に変換する受光検出部7
8〜7eが例えば5個ライン状に配列され、各受光検出
部7a〜7eにはそれぞれホトダイオードが例えば2個
ずつ形成されいてる。すなわち受光検出部7aにはホト
ダイオード9a、9bが、受光検出部7bにはホトダイ
オード9c 、 9d 、受光検出部7Cにはホトダイ
オード9e 、 9f 、受光検出部7dにはホトダイ
オード9Q 、 9h 、受光検出部7eにはホトダイ
オード9i 、9jが形成されている。ホトダイオード
9a〜9jは、P型シリコン基板11上に形成された略
長方形状のn−エピタキシャル層158〜15jの表面
をV字状に掘り込んだ溝に、互いに向き合うように例え
ば54.7°の角度で傾斜して形成することで、上方か
らの入射光に対して長方形の面を有する傾斜面を受光面
としている。
The light receiving section 5 is formed by a bipolar process described later, and includes a light receiving detecting section 7 that detects the light from the light emitting diode 1 that has passed through the slit 4 and converts the detected light into an electrical signal.
For example, five photodiodes 8 to 7e are arranged in a line, and two photodiodes, for example, are formed in each of the light receiving and detecting parts 7a to 7e. That is, the light reception detection section 7a includes photodiodes 9a and 9b, the light reception detection section 7b includes photodiodes 9c and 9d, the light reception detection section 7C includes photodiodes 9e and 9f, the light reception detection section 7d includes photodiodes 9Q and 9h, and the light reception detection section 7e. Photodiodes 9i and 9j are formed in . The photodiodes 9a to 9j are placed in V-shaped grooves dug into the surfaces of substantially rectangular n-epitaxial layers 158 to 15j formed on the P-type silicon substrate 11, so that the photodiodes 9a to 9j face each other at an angle of, for example, 54.7°. By forming it at an angle, the inclined surface having a rectangular surface serves as a light-receiving surface for light incident from above.

すなわち、このホトダイオード9a〜9jは、前記溝の
両方の傾斜面にそれぞれ1つ形成され、P型シリコン基
板11及びP+素子分離領域13とn″″″エピタキシ
ヤルIlla〜15jとの間にPN接合を成しているの
である。
That is, one photodiode 9a to 9j is formed on each of the slopes of the groove, and a PN junction is formed between the P type silicon substrate 11 and the P+ element isolation region 13 and the n'''' epitaxial layers Illa to 15j. This is what is being accomplished.

そして、例えば回転スリット板3が第1図に示す位置に
ある場合にあっては、スリット4の貰下に位置する受光
検出部7b〜7dを構成するホトダイオード9C〜9h
には発光ダイオード1から照射される光が入射する一方
、ホトダイオード9a、9b及び9i、9jは回転スリ
ット板3により発光ダイオード1から照射される光が遮
断され、特に回り込み光等に対しても前述したようにホ
トダイオード93〜9jの受光面が54.7°の角度で
傾斜しているため、約±35.3”以上の入射角でスリ
ット4を介して入射する回り込み光等はホトダイオード
9b、9iには当たらない。このためホトダイオード9
a 、9jに回り込み光等が入射して出力信号を発生し
ても、後述するようにホトダイオード9a 、9bの出
力はアンド回路25aに、ホトダイオード9i 、9j
の出力はアンド回路250にそれぞれ接続され論理積が
とられているので、受光検出部7a、7eからの受光信
号は出力されないことになる。すなわち各受光検出部7
8〜7eにあっては、夫々を構成する2個のホトダイオ
ードの両方の受光面に光が入射しないと光の検出を示す
受光信号を出力しない構成になついる。
For example, when the rotating slit plate 3 is in the position shown in FIG.
The light emitted from the light emitting diode 1 is incident on the photodiodes 9a, 9b, 9i, and 9j, while the light emitted from the light emitting diode 1 is blocked by the rotating slit plate 3, and the light emitted from the light emitting diode 1 is blocked by the photodiodes 9a, 9b, 9i, and 9j. As shown above, since the light-receiving surfaces of the photodiodes 93 to 9j are inclined at an angle of 54.7 degrees, the wraparound light that enters through the slit 4 at an incident angle of about ±35.3" or more is not reflected by the photodiodes 9b and 9i. Therefore, the photodiode 9
Even if reflected light or the like enters the photodiodes 9i, 9j and generates an output signal, the outputs of the photodiodes 9a, 9b are sent to the AND circuit 25a, and the photodiodes 9i, 9j are sent to the AND circuit 25a, as will be described later.
Since the outputs of are connected to the AND circuit 250 and ANDed, the light reception signals from the light reception detection sections 7a and 7e are not output. In other words, each light receiving detection section 7
8 to 7e have a configuration in which a light reception signal indicating detection of light is not output unless light is incident on both of the light receiving surfaces of the two photodiodes constituting each photodiode.

なお、前記ホトダイオード98〜9jは、例えば次のよ
うな工程を経て形成される。すなわち、バイポーラプロ
セスによりP型シリコン基盤11の上に例えば厚さ12
μm、比抵抗2ΩcIIlのn″″エピタキシャル層1
5a〜15jを成長させ、P型シリコン基繋11にBB
r’ 3を被着させ基板内部へ埋込み拡散することによ
りP+素子分離領域13を形成し、POCJL:+を被
着させn+エミッタ拡散領域17を形成する。次に減圧
CVDにより3i3N411を被着させV溝を掘る部分
を除去し、このSI3N4膜をマスクにしてフィールド
酸化膜をエツチングする。更に、例えば3iエツチング
液でV溝を掘り、コンタクトエツチング、An蒸着、パ
ターン形成及びパッドのエツチングの工程を経て形成さ
れる。
Note that the photodiodes 98 to 9j are formed, for example, through the following steps. That is, a bipolar process is performed to form a layer with a thickness of, for example, 12 mm on a P-type silicon substrate 11.
μm, n″″ epitaxial layer 1 with specific resistance 2ΩcIIl
5a to 15j are grown, and BB is formed on the P-type silicon base bond 11.
P+ element isolation region 13 is formed by depositing r' 3 and embedding and diffusing into the substrate, and POCJL:+ is deposited to form n+ emitter diffusion region 17. Next, 3i3N411 is deposited by low pressure CVD, the portion where the V groove is to be dug is removed, and the field oxide film is etched using this SI3N4 film as a mask. Further, a V-groove is dug using, for example, a 3i etching solution, and a process of contact etching, An evaporation, pattern formation, and pad etching is performed.

第3図は、受光検出部の検出光を受光信号に変換する回
路の一例を示すものである。
FIG. 3 shows an example of a circuit that converts the light detected by the light detection section into a light reception signal.

前記ホトダイオード98〜9jの夫々のカソード端子は
、夫々抵抗23a〜23jを介して電源Vccに接続さ
れているとともに、1つの受光部毎に形成された2個の
ホトダイオードのカソード端子は、同一のアンド回路の
否定入力端子に接続されている。すなわち、ホトダイオ
ード9a 、 9bのカソード端子はアンド回路25a
に、ホトダイオード9c、9dのカソード端子はアンド
回路25bに、ホトダイオ−H2O,9fのカソード端
子はアンド回路25cに、ホトダイオード9(+。
The cathode terminals of the photodiodes 98 to 9j are connected to the power supply Vcc via the resistors 23a to 23j, respectively, and the cathode terminals of the two photodiodes formed for each light receiving section are connected to the same AND. Connected to the negative input terminal of the circuit. That is, the cathode terminals of the photodiodes 9a and 9b are connected to the AND circuit 25a.
The cathode terminals of the photodiodes 9c and 9d are connected to the AND circuit 25b, the cathode terminals of the photodiodes H2O and 9f are connected to the AND circuit 25c, and the photodiode 9(+) is connected to the AND circuit 25b.

9hのカソード端子はアンド回路25dに、ホトダイオ
ード9r 、 9jのカソード端子はアンド回路25e
にそれぞれ接続されている。また各々のホトダイオード
98〜9Jのアノード端子はアースに接続している。ア
ンド回路25a〜25eは、1つの受光検出部に形成さ
れた2つのホトダイオードのそれぞれの出力信号の論理
積をとり、前記2つのホトダイオードが光を検出し、こ
のホトダイオードに接続しているアンド回路の両方の反
転入力端子に、ともに“L”レベルの信号が入力するこ
とで受光信号を発生する。
The cathode terminal of photodiode 9h is connected to AND circuit 25d, and the cathode terminal of photodiode 9r and 9j is connected to AND circuit 25e.
are connected to each. Further, the anode terminal of each of the photodiodes 98 to 9J is connected to ground. The AND circuits 25a to 25e take the logical product of the respective output signals of two photodiodes formed in one light reception detection section, and when the two photodiodes detect light, the AND circuits connected to the photodiode A light reception signal is generated by inputting "L" level signals to both inverting input terminals.

第4図は、受光信号を受けて回転方向信号と回転パルス
信号を得る回路の一例を示すものである。
FIG. 4 shows an example of a circuit that receives a light reception signal and obtains a rotation direction signal and a rotation pulse signal.

同図において、D型フリップ70ツブ回路41のD入力
端子は、任意の隣り合う受光検出部に夫々形成されたホ
トダイオードの出力に接続されている一方のアンド回路
、例えばアンド回路25aの出力する受光信号が供給さ
れ、D型フリップ70ツブ回路41のGK端子には、他
方のアンド回路、例えばアンド回路25bの出力する受
光信号が供給されている。D型フリップフロップ回路4
1のCK端子に受光信号が入力することで、この受光信
号がGK端子に入力する直前にD入力端子に入力する信
号のレベル、例えば“L”あるいは“H”レベルの信号
をQ出力端子から回転方向信号として発生する。エツジ
トリガ単安定マルチパイプ°レータ43は、その入力端
子に受光信号が入力され、出力端子はオア回路45の入
力端子に接続され、入力される受光信号の立ち上がりで
トリガされワンショットパルス信号をオア回路45に出
力する。
In the figure, the D input terminal of the D-type flip 70 tube circuit 41 is connected to the output of one of the AND circuits, for example, the AND circuit 25a, which is connected to the output of the photodiode formed in each of the adjacent light detection sections. The GK terminal of the D-type flip 70 tube circuit 41 is supplied with a light reception signal output from the other AND circuit, for example, the AND circuit 25b. D type flip-flop circuit 4
When a light reception signal is input to the CK terminal of No. 1, the level of the signal input to the D input terminal, for example, a "L" or "H" level signal, is transferred from the Q output terminal immediately before this light reception signal is input to the GK terminal. Generated as a rotation direction signal. The edge-triggered monostable multi-pipe detector 43 receives a received light signal at its input terminal, and its output terminal is connected to the input terminal of an OR circuit 45, which is triggered by the rising edge of the input received light signal and outputs a one-shot pulse signal to an OR circuit. 45.

オア回路45は、それぞれのエツジトリガ単安定マルチ
バイブレータ43が出力するワンショットパルス信号の
論理和をとり、回転パルス信号を発生する。
The OR circuit 45 takes the logical sum of the one-shot pulse signals output from the respective edge-triggered monostable multivibrators 43, and generates a rotation pulse signal.

次にこの実施例の作用を説明する。Next, the operation of this embodiment will be explained.

発行ダイオード1と受光部5を固定し、回転スリット板
3が検出対象物の回転に同期して回転すると、スリット
4を介して発行ダイオード1から受光部に照射される光
が、前記回転スリット板3の回転方向と同じ方向に移動
する。前記スリット4を介して発行ダイオード1から照
射される光を検出したホトダイオードは導通状態となり
、電源Vccから前記ホトダイオードに接続された抵抗
及び前記ホトダイオードを介してアースに電流が流れ、
前記ホトダイオードのカソード端子は抵抗の電圧降下に
より″゛L″L″レベル、そのカソード端子に接続して
いるアンド回路の反転入力端子に“L“レベル信号が入
力する。アンド回路は入力された“L”レベル信号を“
H″レベル信号反転し受光信号を発生する。
When the emitting diode 1 and the light receiving section 5 are fixed and the rotating slit plate 3 rotates in synchronization with the rotation of the object to be detected, the light irradiated from the emitting diode 1 to the light receiving section via the slit 4 is transmitted to the rotating slit plate. Move in the same direction as the rotation direction in step 3. The photodiode that detects the light emitted from the emission diode 1 through the slit 4 becomes conductive, and a current flows from the power supply Vcc to the ground through the resistor connected to the photodiode and the photodiode.
The cathode terminal of the photodiode is at the "L" level due to the voltage drop across the resistor, and an "L" level signal is input to the inverting input terminal of the AND circuit connected to the cathode terminal. “L” level signal “
The H'' level signal is inverted and a light reception signal is generated.

第5図に各々のアンド回路25a〜25eが発生する受
光信号(A)〜(E)の−例を示す。各々の受光信号は
エツジトリが単安定マルチバイブレータ43に入力し、
このエツジトリガ単安定マルチバイブレータ43は、受
光信号の立ち上がりを検出すると同時にワンショットパ
ルス信号をオア回路45に供給する。オア回路45は各
々のエツジトリが単安定マルチバイブレータ43が出力
するワンショットパルス信号を受けて論理和をとり、第
5図の(F)に示す回転パルス信号を発生する。またD
型フリップフロップ回路41のCK端子に受光信号が入
力されることで、前記り型フリップフロップ回路41は
そのQ出力端子から回転方向信号を発生する。
FIG. 5 shows examples of light reception signals (A) to (E) generated by each of the AND circuits 25a to 25e. Each received light signal is inputted by the edge to a monostable multivibrator 43,
This edge trigger monostable multivibrator 43 supplies a one-shot pulse signal to the OR circuit 45 at the same time as it detects the rise of the light reception signal. In the OR circuit 45, each edge receives the one-shot pulse signal output from the monostable multivibrator 43, performs a logical sum, and generates the rotation pulse signal shown in FIG. 5(F). Also D
When the light reception signal is input to the CK terminal of the flip-flop circuit 41, the flip-flop circuit 41 generates a rotation direction signal from its Q output terminal.

したがって、スリット通過後の回り込み光等の誤検出に
よる回転パルスのミスカウント及び回転方向信号の誤動
作を確実に防止することができる。
Therefore, it is possible to reliably prevent rotational pulse miscounts and rotational direction signal malfunctions due to erroneous detection of reflected light after passing through the slit.

〔発明の効果〕〔Effect of the invention〕

半導体受光素子の受光部に、特定の方向からの入射光に
対して受光可能で、豆いに受光面の角喰の具なる少なく
とも2個以上の受光手段と、前記受光手段がすべて受光
状態のとき受光信号を出力する検出処理手段とを有し、
特定方向からの入射光に対して特に鋭い指向性を有する
構成としたので、前記特定方向以外からの入射光による
誤動作を防止することができるとともに、S/N比を向
上することができる。
The light receiving portion of the semiconductor light receiving element is provided with at least two or more light receiving means capable of receiving incident light from a specific direction, each of which has a square-shaped light receiving surface, and all of the light receiving means are in a light receiving state. and a detection processing means that outputs a light reception signal when
Since the configuration has particularly sharp directivity with respect to incident light from a specific direction, it is possible to prevent malfunctions due to incident light from directions other than the specific direction, and to improve the S/N ratio.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例を示す断面図、第2図は第
1図の一部平面図、第3図は受光信号を得る一回路図、
第4図は回転方向信号及び回転パルス信号を得る一回路
図、第5図は第4図の動作タイムチャートである。 (図の主要な部分を表わす符号の説゛明)1・・・発行
ダイオード 3・・・回転スリット板 4・・・スリット 5・・・受光部 78〜7e・・・受光検出部 9a〜9j・・・ホトダイオード 258〜25e・・・アンド回路 41・・・D型フリップ70ツブ回路 43・・・エツジトリガ単安定マルチバイブレータ45
・・・オア回路 くの(JO田
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a partial plan view of FIG. 1, and FIG. 3 is a circuit diagram for obtaining a received light signal.
FIG. 4 is a circuit diagram for obtaining a rotation direction signal and a rotation pulse signal, and FIG. 5 is an operation time chart of FIG. 4. (Explanation of symbols representing main parts in the figure) 1... Issuing diode 3... Rotating slit plate 4... Slit 5... Light receiving sections 78 to 7e... Light receiving detection sections 9a to 9j ... Photodiode 258-25e ... AND circuit 41 ... D-type flip 70 tube circuit 43 ... Edge trigger monostable multivibrator 45
...OR circuit Kuno (JOda)

Claims (1)

【特許請求の範囲】[Claims] 特定方向からの入射光に対して受光可能で、互いに受光
面の角度の異なる少なくとも2個以上の受光手段と、前
記受光手段がすべて受光状態のとき受光信号を出力する
検出処理手段とを有し、前記特定方向からの入射光に対
して鋭い指向性を有する構成としたことを特徴とする半
導体受光素子。
At least two or more light receiving means capable of receiving incident light from a specific direction and having mutually different angles of light receiving surfaces, and a detection processing means for outputting a light reception signal when all of the light receiving means are in a light receiving state. . A semiconductor light-receiving element, characterized in that the semiconductor light-receiving element is configured to have sharp directivity with respect to incident light from the specific direction.
JP59273109A 1984-12-26 1984-12-26 Semiconductor photodetector Pending JPS61152065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59273109A JPS61152065A (en) 1984-12-26 1984-12-26 Semiconductor photodetector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59273109A JPS61152065A (en) 1984-12-26 1984-12-26 Semiconductor photodetector

Publications (1)

Publication Number Publication Date
JPS61152065A true JPS61152065A (en) 1986-07-10

Family

ID=17523252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59273109A Pending JPS61152065A (en) 1984-12-26 1984-12-26 Semiconductor photodetector

Country Status (1)

Country Link
JP (1) JPS61152065A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5075748A (en) * 1989-03-10 1991-12-24 Mitsubishi Denki Kabushiki Kaisha Photodetector device
US5115295A (en) * 1989-10-31 1992-05-19 Mitsubishi Denki Kabushiki Kaisha Photodetector device
US5156980A (en) * 1989-03-10 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Method of making a rear surface incident type photodetector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5075748A (en) * 1989-03-10 1991-12-24 Mitsubishi Denki Kabushiki Kaisha Photodetector device
US5156980A (en) * 1989-03-10 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Method of making a rear surface incident type photodetector
US5115295A (en) * 1989-10-31 1992-05-19 Mitsubishi Denki Kabushiki Kaisha Photodetector device

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