JPS61149483A - Blank material for forming metallic product - Google Patents

Blank material for forming metallic product

Info

Publication number
JPS61149483A
JPS61149483A JP27219984A JP27219984A JPS61149483A JP S61149483 A JPS61149483 A JP S61149483A JP 27219984 A JP27219984 A JP 27219984A JP 27219984 A JP27219984 A JP 27219984A JP S61149483 A JPS61149483 A JP S61149483A
Authority
JP
Japan
Prior art keywords
metal
product
acid
resistant film
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27219984A
Other languages
Japanese (ja)
Inventor
Takayuki Nakamoto
高行 中本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IWATA DENKO KK
Original Assignee
IWATA DENKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IWATA DENKO KK filed Critical IWATA DENKO KK
Priority to JP27219984A priority Critical patent/JPS61149483A/en
Publication of JPS61149483A publication Critical patent/JPS61149483A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To make possible the mass production of a metallic product having no burrs and flaws by coating a corrosion resistant film having the nature resistant to a metal etching liquid over the entire surface of a blank material for forming the metallic product and subjecting the blank material to press forming then shaping the material with the metal etching liquid. CONSTITUTION:The blank material for forming constituted by coating the corrosion resistant film having the nature resistant to the metal etching liquid over the entire surface of the blank metallic plate is press-formed to a product shape and the edges forming the shape are shaped by etching or electrolytic working with the metal etching liquid by which the metallic product is obtd. A plated surface, printed surface and two-layer worked surfaces consisting of an insulating surface for the lower layer and a printed wiring surface for the upper layer are formed on the surface of the above-mentioned metallic blank plate and thereafter the above-mentioned corrosion resistant film can be coated thereon via such surfaces. The water soluble or org. solvent soluble film consisting of a water soluble colloid, polycinnamic acid, cyclized rubber, quinone diazido magic ink, etc., is suitable for the above-mentioned corrosion resistant film and the aq. soln. of ferric chloride, acid such as nitric acid, hydrochloric acid, picric acid, or the mixed soln. thereof is suitable for the metal etching liquid.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は穿孔或いは打抜きに相当する加工を施されて成
形される各種の金属製品、たとえば電気および電子部品
等で、具体的には集積回路用フレーム、コネクター、7
Oツビーデイスクの磁器ヘッド用ジンバルスプリング等
のものや、センサースプリング、ステッピングモーター
用センサーステップ板、シャドウマスク(カラーテレビ
用マスク)、フロッピーディスク用のスチールベルト、
プリント配線板等のもののように、形状形成縁や表面に
パリや傷が在ってはならない金属製品用の成形素材に関
する。
Detailed Description of the Invention (Field of Industrial Application) The present invention relates to various metal products that are formed by processing equivalent to drilling or punching, such as electrical and electronic parts, and specifically integrated circuits. frame, connector, 7
Items such as gimbal springs for Otsubee disk porcelain heads, sensor springs, sensor step plates for stepping motors, shadow masks (color TV masks), steel belts for floppy disks,
This invention relates to molding materials for metal products, such as printed wiring boards, which must not have any cracks or scratches on their shape-forming edges or surfaces.

(従来の技術) この種の金属製品は、加工すべき成形素材の表面および
/又は裏面に、写真的な方法によって、所定の製品形状
に部分的にフォト印刷して耐食膜(レジ、スト)を形成
させた後、化学腐蝕させて形状加工をするフォトエツチ
ング法(ケミカルミ−リング法又はケミカルミーリング
法)によって成形しており、その成形素材としては鉄、
銅、アルミニウム、ニッケルおよびこれらの合金、チタ
ン、ジルコニウム等のほとんどの金属が対象になってい
る。 この成形素材を用いてのフォトエツチング法によ
り成形される金属製品は、形状形成縁のパリや表面の傷
がない利点を有しているものであるが、同時に次の問題
がある。
(Prior art) This type of metal product is manufactured by applying a corrosion-resistant film (resist, paste) by partially photoprinting a predetermined product shape using a photographic method on the front and/or back side of the molded material to be processed. After forming, it is molded using a photo-etching method (chemical milling method or chemical milling method) in which it is chemically etched and shaped, and the molding materials used are iron,
Most metals include copper, aluminum, nickel and their alloys, titanium, and zirconium. Metal products molded by the photoetching method using this molding material have the advantage of having no cracks on the edges of the shape and no scratches on the surface, but they also have the following problems.

すなわち、成形素材表面は所定の製品形状に部分的にフ
ォト印刷されるまで剥き出しのままであるために、仮に
表面をメッキ処理していても、そのメッキ自体を含めて
傷つけられ易くて、製品表面の傷を皆無とし難いこと、
その傷を隠すため或いは傷の錆止め等のためのメッキ処
理等の後処理を必須とすること、製品厚さが薄物に制限
されること、製造時間が長いこと、人聞生産ができない
こと、不良率が高いこと、単価が高いこと、エツチング
特有の突部すなわちエツチングパリが残ること等、上記
成形素材を用いていることによる種々の問題がある。
In other words, the surface of the molding material remains exposed until it is partially photoprinted into a predetermined product shape, so even if the surface is plated, the plating itself is easily damaged, and the product surface may be damaged. It is difficult to eliminate all the scars caused by
Requires post-treatment such as plating to hide the scratches or prevent scratches from rusting; product thickness is limited to thin products; manufacturing time is long; human production is not possible; There are various problems due to the use of the above-mentioned molding materials, such as a high etching rate, a high unit price, and the fact that protrusions peculiar to etching, that is, etching pads, remain.

又、電解加工法(エレクトロケミカル マシーニング法
)による成形が考えられるが、所定の製品形状に部分的
にフォト印刷されるまでその表面が剥き出しのままであ
る成形素材は、仮に表面をメッキ処理されていても、そ
のメッキ自体を含めて傷つけられ易すいことに変わりな
く、製品表面の傷を皆無とし難いこと、その傷を隠すた
め或いは傷の錆止め等のためのメッキ処理等の後処理を
必須とすること、製品厚さが厚くなるのに比例して製造
時間が長くなること、加工精度が劣ること等、同程度の
問題がある。
In addition, forming by electrochemical machining may be considered, but the surface of the forming material remains exposed until it is partially photoprinted into a predetermined product shape, so the surface may not be plated. However, the plating itself is still easily damaged, and it is difficult to eliminate all scratches on the surface of the product, and post-treatment such as plating is required to hide the scratches or prevent them from rusting. There are similar problems, such as the fact that the product is thicker, the manufacturing time becomes longer in proportion to the thickness of the product, and the processing accuracy is poorer.

斯様に既存の成形素材を用いてのフォトエツチング法、
電解加工法には種々の問題があるものの、それでも問題
を解決する成形素材が開発されていないために、尚且つ
不満足な成形素材を用いてのフォトエツチング法、電解
加工法に頼らざるを得ないでいるのが現状である。
In this way, the photoetching method using existing molding materials,
Although there are various problems with electrolytic processing, no molding material has been developed that solves the problems, so we have no choice but to rely on photoetching and electrolytic processing using unsatisfactory molding materials. This is the current situation.

(発明が解決しようとする問題点) 本発明が解決しようとする問題点は金属製品を、プレス
による製品形状成形と、エツチング又は電解加工による
形状形成縁の成形とにより成形可能にすると共にそのプ
レスによる製品形状の成形を終えるまで板面並びに板面
上の加工面を保護することである。
(Problems to be Solved by the Invention) The problems to be solved by the present invention are to make it possible to form metal products by forming the product shape by pressing and forming the shape forming edge by etching or electrolytic processing, and to This is to protect the plate surface and the processed surfaces on the plate surface until the product shape is finished.

(問題点を解決するための手段) 本発明が賃上の問題点を達成するために講じた手段は、
製品形状にプレス成形されて、その形状形成縁を金属腐
蝕液でエツチング又は電解加工により整形される金属製
品において、金属素板の板面全面および/又は同板面上
の加工面上に金属腐蝕液に犯されない性質の耐食膜を被
覆してなる構成としたことを特徴とする。
(Means for solving the problems) The means taken by the present invention to solve the problems regarding wages are as follows:
In metal products that are press-formed into a product shape and then shaped by etching the shape-forming edges with a metal corrosive solution or by electrolytic processing, metal corrosion may occur on the entire surface of the metal blank and/or on the processed surface of the same sheet. It is characterized by being coated with a corrosion-resistant film that is not attacked by liquids.

(作用) 金属素板の板面全面および/又は同板面上の加工面が耐
食膜で被覆されていて、プレスによる製品形状の成形終
了までの外圧及び同成形時における圧力から保護されて
傷を受けず、そしてプレスによる製品形状の成形及びエ
ツチング又は電解加工による形状形成縁の成形により、
パリおよび傷がない金属製品を大量生産可能になる。
(Function) The entire plate surface of the metal blank and/or the processed surface on the same plate surface is coated with a corrosion-resistant film, which protects it from external pressure until the end of forming the product shape by press and from the pressure during the forming process, preventing scratches. By forming the product shape by pressing and forming the shape forming edge by etching or electrolytic processing,
It becomes possible to mass produce metal products without scratches or scratches.

(実施例) 以下図面に基づいて本発明の一実施例を詳細に説明する
(Example) An example of the present invention will be described in detail below based on the drawings.

第1図は第一発明の成形素材Aの基本的構成を部分拡大
して示しており、この成形素材Aにおける金属素板1は
金属腐蝕液に浸蝕される材質のもの、具体的には鉄およ
びその合金にッケル鋼、ステンレス鋼、ケイ素鋼、パー
マロイなど)、銅およびその合金(真鍮、リン青銅。
FIG. 1 shows a partially enlarged view of the basic structure of the molding material A of the first invention, and the metal blank 1 in this molding material A is made of a material that is corroded by a metal corrosive liquid, specifically, iron. copper and its alloys (nickel steel, stainless steel, silicon steel, permalloy, etc.), copper and its alloys (brass, phosphor bronze).

ベリリウム銅、アームスブロンズなど)、アルミニウム
およびその合金(ジュラルミンなど)。
beryllium copper, arms bronze, etc.), aluminum and its alloys (duralumin, etc.).

ニッケルおよびその合金(洋銀、モネル、コーパルなど
)、チタン、ジルコニウム、その他の金属製で、金属製
品を成形可能な所要の幅および厚みの連続帯状に成形し
ている。
Made of nickel and its alloys (nickel silver, monel, copal, etc.), titanium, zirconium, and other metals, it is formed into a continuous strip of the desired width and thickness that allows metal products to be formed.

金属素板1の板面la、lb全面には金属腐蝕液に犯さ
れない性質の耐食l112を被覆していて、根面1a、
Ibがプレスによる製品形状成形時にも損傷を受けない
ようにしている。
The entire plate surfaces la and lb of the metal blank 1 are coated with a corrosion-resistant l112 that is not affected by metal corrosive liquid, and the root surfaces 1a,
This prevents Ib from being damaged during product shape forming using a press.

耐食II!I2はプレス成形による製品形状成形後の金
属腐蝕液によるエツチング又は電解加工処理中における
その金属腐蝕液には犯されない一方で、エツチング又は
電解加工処理後の洗浄処理中における溶解液には溶ける
性質の材質たとえば水溶性コロイド系、ポリ桂皮酸系、
環化ゴム系、キノン・ジアサイド系、マジックインキ等
の水溶性或いは有機溶剤可溶性のものである。
Corrosion resistance II! I2 has a property that it is not attacked by the metal corrosive liquid during etching or electrolytic processing after forming the product shape by press molding, but it is soluble in the solution during cleaning treatment after etching or electrolytic processing. Materials such as water-soluble colloid type, polycinnamic acid type,
Water-soluble or organic solvent-soluble ink such as cyclized rubber type, quinone diaside type, and marker ink.

その金属腐蝕液の材質は一般的に酸で、たとえば塩化第
二鉄、硝酸、塩酸、ピクリン酸等の単波又は複合液或い
はそれらの水溶液であり、また溶解液の材質は環化ゴム
系用として、石炭酸。
The material of the metal corrosive liquid is generally an acid, such as a single wave or a composite liquid such as ferric chloride, nitric acid, hydrochloric acid, picric acid, or an aqueous solution thereof, and the material of the dissolving liquid is one for cyclized rubber. As, carbolic acid.

四塩化エチレン、ジクロールベンゼン、アルキルベンゼ
ンスルホン酸等の混合液、硫酸と過酸化水素水の混合液
等であり、そして水溶性コロイド、ポリ桂皮酸系、キノ
ン・ジアザイド系。
These include mixtures of ethylene tetrachloride, dichlorobenzene, alkylbenzenesulfonic acids, etc., mixtures of sulfuric acid and hydrogen peroxide, and water-soluble colloids, polycinnamic acid, and quinone diazide.

マジックインキ用として、アセトン、アルコール、トリ
クロルエチレン等の有機溶媒等である。
Organic solvents such as acetone, alcohol, and trichlorethylene are used for marker ink.

第2図は第二発明の成形素材A1の基本的構成を部分拡
大して示しており、この成形素材A1における金属素板
10の材質は第一発明における金属素板1と同様の各金
属素材から、成形する金属製品に応じて最適な材質のも
のを選択し且つ同製品を成形可能な所要の幅および厚み
の連続帯状に成形している。
FIG. 2 shows a partially enlarged basic configuration of the molding material A1 of the second invention, and the material of the metal blank 10 in this molding material A1 is the same metal material as the metal blank 1 in the first invention. From these, the most suitable material is selected depending on the metal product to be molded, and the product is molded into a continuous band of the required width and thickness.

金属素材10の板面10aおよび/又は10bには加工
面11を全面又は部分的に施工すると共にこの加工面1
1を媒体として板面全面に金属腐蝕液に犯されない性質
の耐食膜12を被覆していて、加工面11および板面1
0a。
A processed surface 11 is applied entirely or partially to the plate surface 10a and/or 10b of the metal material 10, and this processed surface 1
1 as a medium, the entire surface of the plate is coated with a corrosion-resistant film 12 that is not attacked by metal corrosive liquid, and the processed surface 11 and the plate surface 1
0a.

10bがプレスによる製品形状成形時にも損傷を受けな
いようにしている。
10b is prevented from being damaged even when the product shape is formed using a press.

加工面11は板面の装飾・防食のための各種のメッキ面
或いは図面に示す印刷面であり、この印刷面は表示、装
飾等のために、文字、絵模様、模様9等から目的に応じ
て選択される。
The processed surface 11 is a plated surface of various types for decoration and anti-corrosion of the board surface, or a printed surface shown in drawings. selected.

耐食膜12は製品形状成形後のエツチング又は電解加工
処理中における金属腐蝕液には犯されない一方で、エツ
チング又は電解加工処理°後の洗浄処理中における溶解
液には溶ける性質の材質で、その具体的な材質は第一発
明で説明した耐食1m2と同じであり、金属腐蝕液およ
び溶解液の材質も第一発明で説明した金属腐蝕液および
溶解液と同じであるため、説明を省略する。
The corrosion-resistant film 12 is made of a material that is not attacked by the metal corrosive solution during etching or electrolytic processing after forming the product shape, but dissolves in the solution during cleaning processing after etching or electrolytic processing. The material is the same as the corrosion resistant 1 m2 explained in the first invention, and the material of the metal corrosive liquid and the solution are also the same as the metal corrosive liquid and the metal solution explained in the first invention, so the explanation will be omitted.

第3図は第二発明の他の実施例として、金属製品がプリ
ント基板であるときの成形素材A2の基本的構成を部分
拡大して示しており、この成形素材A2における金属素
板20の材質は第一発明で説明した金属素板1の材質の
なかでも特に剛性および放熱効率が高いもの、例えばア
ルミニウム等を選択して、所要の幅および厚さの連続帯
状若しくは板状に成形している。
FIG. 3 shows a partially enlarged basic configuration of a molding material A2 when the metal product is a printed circuit board as another embodiment of the second invention, and shows the material of the metal blank 20 in this molding material A2. Among the materials for the metal blank 1 described in the first invention, a material with particularly high rigidity and heat dissipation efficiency, such as aluminum, is selected and formed into a continuous band or plate shape of the required width and thickness. .

金属素板20の板面20aおよび/又は20bには同板
面側で下層の絶縁面21aと、これの上層のプリント配
線面21bとからなる加工面21を施すと共にこの加工
面21を媒体にして、板面全面に金属腐蝕液に犯されな
い性質の耐食膜22を被覆していて、加工面21すなわ
ち絶縁面21a並びにプリント配線面2111および板
面がプレスによる製品形状成形時にも損傷を受けないよ
うにしている。
A processed surface 21 consisting of a lower layer insulating surface 21a and an upper layer printed wiring surface 21b is applied to the plate surface 20a and/or 20b of the metal blank 20, and this processed surface 21 is used as a medium. The entire surface of the board is coated with a corrosion-resistant film 22 that is not affected by metal corrosive liquid, so that the processed surface 21, that is, the insulating surface 21a, the printed wiring surface 2111, and the board surface are not damaged even when the product shape is formed by press. That's what I do.

加工面21の下層の絶縁面21aは絶縁性に富み且つ製
品形状のプレス成形にも妨げとならない材質のもの、具
体的にはポリエチレンやボリブOピレン、ポリエステル
、その他の合成樹脂系、セラミック系、ゴム系等であっ
て、板面および加工面との接着性を有するものが望まし
く、また瑚材と混合したものであり、アルミニラム製で
導電性の金属素板20とプリント配線面20bとを確実
に絶縁し得るように、板面とプリント配線面21bとの
間に介在している。
The lower insulating surface 21a of the processed surface 21 is made of a material that is highly insulating and does not interfere with press molding into the product shape, specifically polyethylene, boli-O-pyrene, polyester, other synthetic resins, ceramics, etc. It is preferable to use a material such as rubber, which has adhesive properties with the plate surface and the processed surface, and is also mixed with a bamboo material, and is made of aluminum and is used to ensure the connection between the conductive metal base plate 20 and the printed wiring surface 20b. It is interposed between the board surface and the printed wiring surface 21b so as to be insulated.

耐食[122は製品形状成形後のエツチング又は電解加
工処理中における金属腐蝕液には犯されない一方で、エ
ツチング又は電解加工処理後の洗浄処理中における溶解
液には溶ける性質の材質で、その具体的な材質は第一発
明で説明した耐食膜2と同じであり、金属腐蝕液および
溶解液の材質も第一発明で説明した金属腐蝕液および溶
解液と同じであるため省略する。
Corrosion resistance [122] is a material that is not affected by the metal corrosive solution during etching or electrolytic processing after forming the product shape, but dissolves in the solution during cleaning processing after etching or electrolytic processing. The material is the same as that of the corrosion-resistant film 2 explained in the first invention, and the material of the metal corrosive liquid and the dissolving liquid are also the same as the metal corrosive liquid and the dissolving liquid explained in the first invention, so a description thereof will be omitted.

次に各成形素材A、A+ 、A2による金属製品Bの成
形例について具体例を掲げて説明する。
Next, examples of molding the metal product B using the molding materials A, A+, and A2 will be described using specific examples.

第4図は成形素材へによる金属製品Bの成形例を示して
おり、成形素材Aは第1〜4工程を間欠的に連続移送さ
れ、第1工程■では所定の製品形状にプレス成形されて
半製品Ba状に成形され、第2工程■では上記した金属
腐蝕液32中に浸漬されて、その金属腐蝕液32により
プレスバリb1および剪断面荒れb2を腐蝕整形されて
製品素体Bb状に整形され、第3工程■では上記した溶
解液34中に浸漬されて、板面の耐食膜2を除去され、
第4工程IVでは水洗い、乾燥されて、製品化される。
Figure 4 shows an example of forming a metal product B using a forming material, in which the forming material A is intermittently and continuously transferred through the first to fourth steps, and in the first step ■, it is press-formed into a predetermined product shape. It is formed into the shape of a semi-finished product Ba, and in the second step (3), it is immersed in the above-mentioned metal corrosive liquid 32, and the press burr b1 and shear surface roughness b2 are corroded and shaped by the metal corrosive liquid 32 to form the product body Bb shape. The plate is shaped, and in the third step (3), it is immersed in the above-mentioned solution 34 to remove the corrosion-resistant film 2 on the plate surface.
In the fourth step IV, it is washed with water, dried, and manufactured into a product.

第1工程Iはプレス装置30により、板面が耐食膜2で
被覆、保護されている成形素材Aを所定の製品形状にプ
レス成形して半製品3aとする。
In the first step I, a press machine 30 press-forms a molding material A whose plate surface is covered and protected with a corrosion-resistant film 2 into a predetermined product shape to obtain a semi-finished product 3a.

第2工程■はブレスバリb1および剪断面荒れb2のあ
る半製品Baを金属腐蝕液槽31に浸漬させて、耐食膜
2で覆われていない剥き出しのブレスバリb1および剪
断面荒れb2を金ff1X蝕液32で腐蝕して除去して
、プレスバリ跡B+および剪断面荒れ跡B2が平滑な鏡
面状に整形されている製品素体Bbとする。
In the second step (2), the semi-finished product Ba with the breath burr b1 and the shear surface roughness b2 is immersed in the metal corrosive liquid bath 31, and the exposed breath burr b1 not covered with the corrosion-resistant film 2 and the shear surface roughness b2 are removed with the gold ff1X etchant. 32 to remove the press burr mark B+ and the shear surface roughness mark B2 into a smooth mirror-like product body Bb.

第3工程■は製品素体Bbを溶解液槽33に浸漬させて
、溶解液34で板面表面の耐食膜2を溶かして製品素体
Bbから除去する。
In the third step (2), the product body Bb is immersed in the solution bath 33, and the corrosion resistant film 2 on the plate surface is dissolved by the solution 34 and removed from the product body Bb.

第4工程■は第3工程で実質的に製品化された金属製品
Bを洗浄装置35で水洗いし且つ乾燥装置36で乾燥さ
せて、製品全面を清浄する。
In the fourth step (2), the metal product B, which has been substantially made into a product in the third step, is washed with water in the washing device 35 and dried in the drying device 36, thereby cleaning the entire surface of the product.

第8図、第9図は上記成形例により成形される無端帯状
の金属製品例として、集積回路用フレームB(第8図)
と、ジンバルスプリング(第9図)を示しており、これ
らの製品Bは第3工程で耐食111!2を溶解、除去さ
れるまで保護されていた板面1aおよび1bそして第2
工程で整形されたプレスバリ跡B1および剪断面荒れ跡
B2まで、全面的に損傷がない鏡面状態に保たれている
。それにより、集積回路用フレームでは接触物を損傷さ
せるパリや、微粒子の脱落が懸念される剪断面荒れが全
く認められず、パリや微粒子による接触物の損傷並びに
ショートや混線等の電気的事故の心配が全くない。そし
て、フレーム面には損傷が全く無く、防食のためのメッ
キ処理を必要としない。
Figures 8 and 9 show an integrated circuit frame B (Figure 8) as an example of an endless band-shaped metal product formed by the above molding example.
and gimbal springs (Fig. 9), and these products B have plate surfaces 1a and 1b and the second
Even the press burr mark B1 and the shear surface roughness mark B2 formed in the process are maintained in a mirror-like state with no damage on the entire surface. As a result, the integrated circuit frame is completely free of cracks that can damage objects that come into contact with it, and no roughness on the sheared surface that could cause particles to fall off, and there is no risk of damage to objects that come in contact with particles or particles, as well as electrical accidents such as short circuits and cross-wires. I have no worries at all. Furthermore, there is no damage to the frame surface, and no plating treatment for corrosion protection is required.

第11図は成形素材A1による金属製品Bの成形例を示
しており、成形素材A+は第1工程工でプレス装置30
により所定の製品形状にプレス成形されて、この型抜き
された半製品Baはたとえば137内に落下して収容さ
れた後、137内に入れられたまま第2工程■乃至第4
工程IVを経て、定形状の金属製品Bに成形される。こ
の成形例における第2工程■乃至第4工程■は上記成形
素材Aの成形例における第2工程■乃至第4工程IVと
同様に行われる。
FIG. 11 shows an example of forming metal product B using forming material A1, in which forming material A+ is used in the press device 30 in the first process.
The semi-finished product Ba that has been press-molded into a predetermined product shape is dropped and stored in, for example, 137, and is then passed through the second to fourth steps while being placed in 137.
Through step IV, the metal product B is formed into a fixed shape. The second step (2) to the fourth step (2) in this molding example are performed in the same manner as the second step (2) to the fourth step IV in the molding example of the molding material A described above.

第12図は上記成形例により成形される定形状の金属製
品8例として、フロッピーディスク用のスチールベルト
を示しており、このスチールベルトBは第3工程で耐食
膜12を溶解、除去されるまで保護されていた印刷面1
1および板面10a、10bそして第2工程で整形され
たプレスバリ跡B1および剪断面荒れ跡B2まで、印刷
面11を含めて全面的に損傷がなく且つ印刷面11を除
く全面が鏡面状態に保たれている。それにより、フロッ
ピーディスク用スチールベルトでは接触物を損傷させた
り自らの摺り合いにより脱落が懸念されるブレスバリや
剪断面荒れが全く認められず、パリや微粒子による接触
物の損傷並びにディスクにおけるショート等の電気的事
故の心配が全くないばかりか、パリや剪断面荒れの引掛
りによる動作抵抗が生ぜずに動作性良好である。そして
、ベルト面および印刷面には損傷が全く無く、防食のた
めのメッキ処理を必要としないし、印刷表示が不鮮明に
なる懸念も全くない。
FIG. 12 shows a steel belt for a floppy disk as eight examples of fixed-shaped metal products formed by the above-mentioned forming example. Protected printing surface 1
1, the plate surfaces 10a and 10b, and the press burr marks B1 and shear surface rough marks B2 shaped in the second step, there is no damage on the entire surface including the printed surface 11, and the entire surface except the printed surface 11 is in a mirror-like state. It is maintained. As a result, steel belts for floppy disks are completely free of burrs and sheared surface roughness that could damage objects they come into contact with or cause them to fall off due to their own sliding, and there is no risk of damage to objects that come in contact with burrs or fine particles, as well as short circuits in the disk. Not only is there no need to worry about electrical accidents, but there is no operational resistance due to cracks or sheared surface roughness, resulting in good operability. Furthermore, there is no damage to the belt surface or the printed surface, no plating treatment is required for corrosion prevention, and there is no concern that the printed display will become unclear.

第14図は成形素材A2による金属製品すなわちプリン
ト配線板Bの成形例を示しており、成形素材A2は第1
工程Tでプレス装置30により所定製品形状のプリント
配線板状にプレス成形され、この第1工程で取付は孔2
3等まで含めて製品形状に型抜きされた半製品3aはた
とえば籠37内に落下して収容された後、籠37内に入
れられたまま第2工程■乃至第4工程IVを経て、プリ
ント配線板Bに成形される。
FIG. 14 shows an example of molding a metal product, that is, a printed wiring board B, using the molding material A2.
In step T, the press machine 30 press-forms a printed wiring board with a predetermined product shape, and in this first step, the mounting is done through hole 2.
The semi-finished product 3a, which has been die-cut into a product shape, including items 3 and 3, is dropped into a basket 37 and stored therein, and then, while being placed in the basket 37, passes through the second process (■) to the fourth process (IV), and is then printed. It is formed into wiring board B.

この成形例における第2工程■乃至第4工程■は上記成
形素材A1の成形例における第2工程■乃至第4工程■
と同様に行なわれる。
The second process ■ to the fourth process ■ in this molding example are the second process ■ to the fourth process ■ in the molding example of the molding material A1 above.
It is done in the same way.

第15図は上記成形例により成形されるプリント配線板
の一例を示しており、このプリント配線板Bは第3工程
で耐食1! 22を溶解、除去されるまで保護されてい
たプリント配線面21bおよび絶縁面21aおよび板面
20a。
FIG. 15 shows an example of a printed wiring board molded by the above molding example, and this printed wiring board B achieved corrosion resistance of 1 in the third step. The printed wiring surface 21b, the insulating surface 21a, and the plate surface 20a were protected until 22 was melted and removed.

20bそして第2工程で整形されたプレスパリ跡B+お
よび剪断面荒れ跡B2および取付は孔23面まで、全面
的に損傷がなく且つプリント配線面21bおよび絶縁面
21aを除く全面が鏡面状態に保たれている。それによ
り、プリント配線板では接触物を損傷させるパリや、微
粒子の脱落が懸念される剪断面荒れが全く認められず、
パリや微粒子による接触物の損傷並びにショートや混線
等の電気的事故の心配が全くなく、且つプリント配線面
には損傷が全く無くて、防食のためのメッキ処理を必要
としない。そして、プリント配線面と絶縁面を介して表
裏一体のアルミニウム製成形素析が必要十分な強度を有
していて、小形のものから大形のもの、更にその異形度
合の高い種々様々な形態のものまで対応でき、しかも高
い放熱効率でプリント配線面の温度上昇を抑止して、プ
リント配線面ば常温に保たれる。
20b and the press paring marks B+ and shear surface roughness marks B2 shaped in the second step and the mounting hole 23 are completely undamaged and the entire surface except the printed wiring surface 21b and the insulating surface 21a is kept in a mirror-like state. It's dripping. As a result, printed wiring boards do not have any cracks that can damage objects that come in contact with them, or roughness on the sheared surfaces that can cause particles to fall off.
There is no need to worry about damage to objects in contact with particles or electrical accidents such as short circuits or crosstalk, and there is no damage to the printed wiring surface, so there is no need for plating for corrosion protection. Furthermore, the aluminum molded element, which is integrally formed on the front and back sides through the printed wiring surface and the insulating surface, has the necessary and sufficient strength, and can be used in a wide variety of shapes, from small to large, and with a high degree of irregularity. In addition, the high heat dissipation efficiency suppresses the temperature rise of the printed wiring surface and keeps the printed wiring surface at room temperature.

斯様の如く、本発明成形素材により、各面が夫々滑らか
で傷がない各種金属製品を成形可能である。
As described above, by using the molding material of the present invention, it is possible to mold various metal products with smooth and scratch-free surfaces.

又、上記各成形例における第2工程■の浸漬式エツチン
グを、他のスプレ一式或いはパドル式にした成形例とす
ることも自由であるし、さらに電解加工により実施する
ことも自由である。
In addition, the immersion etching in the second step (3) in each of the above molding examples can be freely performed in other spray or paddle molding examples, and it is also free to carry out electrolytic processing.

(発明の効果) したがって本発明によれば次の利点がある。(Effect of the invention) Therefore, the present invention has the following advantages.

■ 金属腐食液に犯されない性質の耐食膜が各面を被覆
して、製品形状成形を終えるまでの外力およびプレス圧
力から、各面が損傷を受けないように保護しているため
、プレスにより製品形状に成形されて、次いで形状形成
縁すなわちプレスパリおよびプレス剪断面荒れを金属腐
蝕液でエツチング又は電解加工整形される金属製品を、
その各面に傷が全くない滑かなものとすることができる
■ Each surface is coated with a corrosion-resistant film that is uncorrosive to metal corrosive liquids, protecting each surface from damage from external forces and press pressure until the end of the product shape forming process. A metal product that is formed into a shape and then etched with a metal etching solution or electrolytically processed to remove the shape forming edge, that is, the press parry and press shear surface roughness,
Each surface can be smooth without any scratches.

■ 製品形状をプレス成形可能である各種金属製品、特
にパリや微粒子の存在を全く認めない各種の電気或いは
電子機器の部品用に好適である。
(2) Suitable for various metal products that can be press-molded into product shapes, especially for parts of various electrical or electronic devices that do not allow the presence of particles or fine particles at all.

■ 製品形状成形をプレス成形で、次いで形状形成縁を
エツチング又は電解加工整形することにより、各種形態
の金属製品を短時間に大量に自在に成形可能である有用
性がある。
(2) By forming the product shape by press molding and then etching or electrolytically processing the shape forming edges, it is useful in that metal products of various shapes can be freely formed in large quantities in a short time.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明成形素材の第一発明の一実施例を示す部
分拡大斜視図、第2図は第二発明の一実施例を示す部分
拡大斜視図、第3図は第二発明の他の実施例を示す部分
拡大斜視図、第4図乃至第10図は第1図の成形素材に
よる金属製品の成形例を示し、第4図は全体の工程図、
第5図は(5)−(5)線に沿える拡大断面図、第6図
は(6)−(6)線に沿える拡大断面図、第7図は(7
)−(7)線に沿える拡大断面図、第8図および第9図
は同成形例により成形した金属製品例を夫々部分的に示
す平面図、第10図は(10) −(10)線に沿える
部分拡大断面図。 第11図乃至第13図は第2図の成形素材による金属製
品の成形例を示し、第11図は全体の工程図、第12図
は同成形例により成形した金属製品例を示す平面図、第
13図は(13)−(13)I!に沿える部分拡大断面
図。第14図乃至第16図は第3図の成形素材による金
属製品の成形例を示し、第14図は全体の工程図、第1
5図は同成形例により成形した金属製品例を示す平面図
、第16図は(16) −(16)線に沿える部分拡大
断面図である。 図中 A、A+ 、A2は成形素材 Bは金属製品 1.10.20は金属素板 1 a 、 1 b 、 10a 、 10b 、 2
0a 、 20bは板面2.12.22は耐食膜 11.21は加工面 21aは絶縁面 21bはプリント配線面 32は金属腐蝕液 第2図 八。 第3図
Fig. 1 is a partially enlarged perspective view showing one embodiment of the first invention of the molding material of the present invention, Fig. 2 is a partially enlarged perspective view showing an embodiment of the second invention, and Fig. 3 is a partially enlarged perspective view showing an embodiment of the second invention. FIG. 4 to FIG. 10 show an example of molding a metal product using the molding material shown in FIG. 1, and FIG. 4 is an overall process diagram.
Figure 5 is an enlarged cross-sectional view taken along line (5)-(5), Figure 6 is an enlarged cross-sectional view taken along line (6)-(6), and Figure 7 is an enlarged cross-sectional view taken along line (6)-(6).
)-(7), FIG. 8 and FIG. 9 are plan views showing partial examples of metal products molded by the same molding example, and FIG. A partially enlarged sectional view along the line. 11 to 13 show an example of metal products molded using the molding material shown in FIG. 2, FIG. 11 is an overall process diagram, and FIG. 12 is a plan view showing an example of a metal product molded by the same molding example. Figure 13 shows (13)-(13)I! Partially enlarged sectional view that can be followed. Figures 14 to 16 show examples of molding metal products using the molding material shown in Figure 3, and Figure 14 is an overall process diagram;
FIG. 5 is a plan view showing an example of a metal product molded by the same molding example, and FIG. 16 is a partially enlarged sectional view taken along line (16)-(16). In the figure, A, A+, A2 are molding materials B are metal products 1.10.20 are metal blanks 1a, 1b, 10a, 10b, 2
0a, 20b are plate surfaces 2, 12, 22 are corrosion-resistant films 11, 21 are processed surfaces 21a, insulating surfaces 21b, and printed wiring surfaces 32 are metal corrosive liquids (FIG. 2-8). Figure 3

Claims (7)

【特許請求の範囲】[Claims] (1)製品形状にプレス成形されて、その形状形成縁を
金属腐蝕液でエッチング又は電解加工により整形される
金属製品において、金属素板の板面全面に金属腐蝕液に
犯されない性質の耐食膜を被覆してなる金属製品の成形
素材。
(1) In metal products that are press-formed into a product shape and the shape-forming edges are etched with a metal corrosive liquid or shaped by electrolytic processing, a corrosion-resistant film that is not damaged by the metal corrosive liquid is applied to the entire surface of the metal blank. Molding material for metal products coated with
(2)製品形状にプレス成形されて、その形状形成縁を
金属腐蝕液でエッチング又は電解加工により整形される
金属製品において、金属素板の板面に各種の表面加工を
施工し、この加工面を媒介して板面全面に金属腐蝕液に
犯されない性質の耐食膜を被覆してなる金属製品の成形
素材。
(2) In metal products that are press-formed into a product shape and the shape-forming edges are etched with a metal corrosive solution or shaped by electrolytic processing, various surface treatments are applied to the surface of the metal blank, and the processed surface is A molded material for metal products that is made by coating the entire plate surface with a corrosion-resistant film that is not affected by metal corrosive liquids.
(3)上記耐食膜が、水溶性コロイド系、ポリ桂皮酸系
、環化ゴム系、キノン・ジアサイド系、マジックインキ
等の水溶性或いは有機溶剤可溶性のものである特許請求
の範囲第1項又は第2項記載の金属製品の成形素材。
(3) The above-mentioned corrosion-resistant film is water-soluble or organic solvent-soluble, such as a water-soluble colloid type, polycinnamic acid type, cyclized rubber type, quinone diaside type, marker ink, etc. A molding material for metal products as described in item 2.
(4)上記金属腐蝕液が、塩化第二鉄、硝酸、塩酸、ピ
クリン酸等の酸又はそれらの複合液或いは水溶液である
特許請求の範囲第1項又は第2項記載の金属製品の成形
素材。
(4) The molded material for metal products according to claim 1 or 2, wherein the metal corrosive liquid is an acid such as ferric chloride, nitric acid, hydrochloric acid, or picric acid, or a composite liquid or aqueous solution thereof. .
(5)上記加工面が、メッキ面である特許請求の範囲第
2項記載の金属製品の成形素材。
(5) The molded material for a metal product according to claim 2, wherein the processed surface is a plated surface.
(6)上記加工面が、印刷面である特許請求の範囲第2
項記載の金属製品の成形素材。
(6) Claim 2, wherein the processed surface is a printed surface.
Molding materials for metal products listed in section.
(7)上記加工面が二層状で、板面側の下層が絶縁面で
、上層がプリント配線面である特許請求の範囲第2項記
載の金属製品の成形素材。
(7) The molded material for a metal product according to claim 2, wherein the processed surface has a two-layered structure, the lower layer on the plate surface side being an insulating surface, and the upper layer being a printed wiring surface.
JP27219984A 1984-12-22 1984-12-22 Blank material for forming metallic product Pending JPS61149483A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27219984A JPS61149483A (en) 1984-12-22 1984-12-22 Blank material for forming metallic product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27219984A JPS61149483A (en) 1984-12-22 1984-12-22 Blank material for forming metallic product

Publications (1)

Publication Number Publication Date
JPS61149483A true JPS61149483A (en) 1986-07-08

Family

ID=17510473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27219984A Pending JPS61149483A (en) 1984-12-22 1984-12-22 Blank material for forming metallic product

Country Status (1)

Country Link
JP (1) JPS61149483A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57168734A (en) * 1981-04-09 1982-10-18 Hitachi Zosen Corp Precise blanking process of mirror finished surface plate
JPS57172277A (en) * 1981-04-17 1982-10-23 Hamasawa Kogyo:Kk Manufacture of floating display member for clock

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57168734A (en) * 1981-04-09 1982-10-18 Hitachi Zosen Corp Precise blanking process of mirror finished surface plate
JPS57172277A (en) * 1981-04-17 1982-10-23 Hamasawa Kogyo:Kk Manufacture of floating display member for clock

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