JPS61149346U - - Google Patents
Info
- Publication number
- JPS61149346U JPS61149346U JP3081485U JP3081485U JPS61149346U JP S61149346 U JPS61149346 U JP S61149346U JP 3081485 U JP3081485 U JP 3081485U JP 3081485 U JP3081485 U JP 3081485U JP S61149346 U JPS61149346 U JP S61149346U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation sheet
- semiconductor device
- interposed
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985030814U JPH0414937Y2 (US07714131-20100511-C00038.png) | 1985-03-06 | 1985-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985030814U JPH0414937Y2 (US07714131-20100511-C00038.png) | 1985-03-06 | 1985-03-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61149346U true JPS61149346U (US07714131-20100511-C00038.png) | 1986-09-16 |
| JPH0414937Y2 JPH0414937Y2 (US07714131-20100511-C00038.png) | 1992-04-03 |
Family
ID=30530845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985030814U Expired JPH0414937Y2 (US07714131-20100511-C00038.png) | 1985-03-06 | 1985-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414937Y2 (US07714131-20100511-C00038.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002222904A (ja) * | 2001-01-26 | 2002-08-09 | Fuji Kobunshi Kogyo Kk | 放熱シート積層体とその巻回体、及び放熱シートの貼り付け方法 |
| JP2013021348A (ja) * | 2012-09-06 | 2013-01-31 | Denso Corp | 電子制御ユニット |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130077256A1 (en) * | 2010-06-09 | 2013-03-28 | Sharp Kabushiki Kaisha | Heat dissipation structure for electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4980667U (US07714131-20100511-C00038.png) * | 1972-11-01 | 1974-07-12 | ||
| JPS5297062U (US07714131-20100511-C00038.png) * | 1976-01-20 | 1977-07-20 |
-
1985
- 1985-03-06 JP JP1985030814U patent/JPH0414937Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4980667U (US07714131-20100511-C00038.png) * | 1972-11-01 | 1974-07-12 | ||
| JPS5297062U (US07714131-20100511-C00038.png) * | 1976-01-20 | 1977-07-20 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002222904A (ja) * | 2001-01-26 | 2002-08-09 | Fuji Kobunshi Kogyo Kk | 放熱シート積層体とその巻回体、及び放熱シートの貼り付け方法 |
| JP2013021348A (ja) * | 2012-09-06 | 2013-01-31 | Denso Corp | 電子制御ユニット |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0414937Y2 (US07714131-20100511-C00038.png) | 1992-04-03 |
