JPS61146975U - - Google Patents
Info
- Publication number
- JPS61146975U JPS61146975U JP2925285U JP2925285U JPS61146975U JP S61146975 U JPS61146975 U JP S61146975U JP 2925285 U JP2925285 U JP 2925285U JP 2925285 U JP2925285 U JP 2925285U JP S61146975 U JPS61146975 U JP S61146975U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- pair
- electrical component
- foil lands
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2925285U JPS61146975U (zh) | 1985-03-01 | 1985-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2925285U JPS61146975U (zh) | 1985-03-01 | 1985-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61146975U true JPS61146975U (zh) | 1986-09-10 |
Family
ID=30527890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2925285U Pending JPS61146975U (zh) | 1985-03-01 | 1985-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61146975U (zh) |
-
1985
- 1985-03-01 JP JP2925285U patent/JPS61146975U/ja active Pending