JPS61144675U - - Google Patents
Info
- Publication number
- JPS61144675U JPS61144675U JP2900785U JP2900785U JPS61144675U JP S61144675 U JPS61144675 U JP S61144675U JP 2900785 U JP2900785 U JP 2900785U JP 2900785 U JP2900785 U JP 2900785U JP S61144675 U JPS61144675 U JP S61144675U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- circuit wiring
- bent part
- circuit board
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011247 coating layer Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985029007U JPH0231795Y2 (US20050075337A1-20050407-C00081.png) | 1985-02-28 | 1985-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985029007U JPH0231795Y2 (US20050075337A1-20050407-C00081.png) | 1985-02-28 | 1985-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61144675U true JPS61144675U (US20050075337A1-20050407-C00081.png) | 1986-09-06 |
| JPH0231795Y2 JPH0231795Y2 (US20050075337A1-20050407-C00081.png) | 1990-08-28 |
Family
ID=30527423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985029007U Expired JPH0231795Y2 (US20050075337A1-20050407-C00081.png) | 1985-02-28 | 1985-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231795Y2 (US20050075337A1-20050407-C00081.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2006033346A1 (ja) * | 2004-09-21 | 2008-05-15 | イビデン株式会社 | フレキシブルプリント配線板 |
| JP2009302342A (ja) * | 2008-06-13 | 2009-12-24 | Denso Corp | 多層基板及びその設計方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015166588A1 (ja) * | 2014-05-02 | 2015-11-05 | 株式会社メイコー | 部品内蔵リジッドフレックス基板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649176U (US20050075337A1-20050407-C00081.png) * | 1979-09-22 | 1981-05-01 | ||
| JPS5654607U (US20050075337A1-20050407-C00081.png) * | 1979-10-01 | 1981-05-13 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54139830A (en) * | 1978-04-24 | 1979-10-30 | Nippon Keikinzoku Sougou Kenki | Method and apparatus for cooling plunger chip in cold chamber type diecast machine |
-
1985
- 1985-02-28 JP JP1985029007U patent/JPH0231795Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5649176U (US20050075337A1-20050407-C00081.png) * | 1979-09-22 | 1981-05-01 | ||
| JPS5654607U (US20050075337A1-20050407-C00081.png) * | 1979-10-01 | 1981-05-13 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2006033346A1 (ja) * | 2004-09-21 | 2008-05-15 | イビデン株式会社 | フレキシブルプリント配線板 |
| JP5006649B2 (ja) * | 2004-09-21 | 2012-08-22 | イビデン株式会社 | フレキシブルプリント配線板 |
| JP2009302342A (ja) * | 2008-06-13 | 2009-12-24 | Denso Corp | 多層基板及びその設計方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231795Y2 (US20050075337A1-20050407-C00081.png) | 1990-08-28 |
