JPS61144670U - - Google Patents
Info
- Publication number
- JPS61144670U JPS61144670U JP2829985U JP2829985U JPS61144670U JP S61144670 U JPS61144670 U JP S61144670U JP 2829985 U JP2829985 U JP 2829985U JP 2829985 U JP2829985 U JP 2829985U JP S61144670 U JPS61144670 U JP S61144670U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electrical component
- hole
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2829985U JPS61144670U (en, 2012) | 1985-02-28 | 1985-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2829985U JPS61144670U (en, 2012) | 1985-02-28 | 1985-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144670U true JPS61144670U (en, 2012) | 1986-09-06 |
Family
ID=30526047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2829985U Pending JPS61144670U (en, 2012) | 1985-02-28 | 1985-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144670U (en, 2012) |
-
1985
- 1985-02-28 JP JP2829985U patent/JPS61144670U/ja active Pending