JPS61143807U - - Google Patents
Info
- Publication number
- JPS61143807U JPS61143807U JP2705085U JP2705085U JPS61143807U JP S61143807 U JPS61143807 U JP S61143807U JP 2705085 U JP2705085 U JP 2705085U JP 2705085 U JP2705085 U JP 2705085U JP S61143807 U JPS61143807 U JP S61143807U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- predetermined shape
- slush
- molding surface
- product molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Moulding By Coating Moulds (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図は本考案実施例の構造を示す断面図、第
２図は第１図の部分を拡大して示す一部拡大断
面図、第３図は第１図において製品が成形面から
離れた状態を示す断面図である。
１…型本体、２…成形面、３…製品、６…孔。
Fig. 1 is a sectional view showing the structure of the embodiment of the present invention, Fig. 2 is a partially enlarged sectional view showing the part in Fig. 1, and Fig. 3 shows the product separated from the molding surface in Fig. 1. It is a sectional view showing a state. 1... Mold body, 2... Molding surface, 3... Product, 6... Hole.
Claims (1)
本体の成形面に、外部へ開口する孔を設け、該孔
の開口部を圧力ガス源に連通させたことを特徴と
するスラツシユ成形型。 (2) 前記型本体の成形面に、前記所定形状に成
形された製品の周縁部を保持する環状溝を設けた
実用新案登録請求の範囲第１項記載のスラツシユ
成形型。[Scope of Claim for Utility Model Registration] (1) A hole opening to the outside is provided in the molding surface of the mold body to which a product molded into a predetermined shape is attached, and the opening of the hole is communicated with a pressure gas source. A slush mold that is characterized by: (2) The slush molding mold according to claim 1, wherein the molding surface of the mold body is provided with an annular groove for holding the peripheral edge of the product molded into the predetermined shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985027050U JPH0340575Y2 (en) | 1985-02-26 | 1985-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985027050U JPH0340575Y2 (en) | 1985-02-26 | 1985-02-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61143807U true JPS61143807U (en) | 1986-09-05 |
| JPH0340575Y2 JPH0340575Y2 (en) | 1991-08-27 |
Family
ID=30523641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985027050U Expired JPH0340575Y2 (en) | 1985-02-26 | 1985-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0340575Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5167368A (en) * | 1974-12-09 | 1976-06-10 | Nippon Paint Co Ltd | |
| JPS5740197U (en) * | 1980-08-20 | 1982-03-04 | ||
| JPS6042615U (en) * | 1983-09-02 | 1985-03-26 | 本田技研工業株式会社 | Mold release device in mold |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6042615B2 (en) * | 1977-07-08 | 1985-09-24 | 日本電気株式会社 | How to sort semiconductor devices |
-
1985
- 1985-02-26 JP JP1985027050U patent/JPH0340575Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5167368A (en) * | 1974-12-09 | 1976-06-10 | Nippon Paint Co Ltd | |
| JPS5740197U (en) * | 1980-08-20 | 1982-03-04 | ||
| JPS6042615U (en) * | 1983-09-02 | 1985-03-26 | 本田技研工業株式会社 | Mold release device in mold |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0340575Y2 (en) | 1991-08-27 |