JPS61142873U - - Google Patents

Info

Publication number
JPS61142873U
JPS61142873U JP2414185U JP2414185U JPS61142873U JP S61142873 U JPS61142873 U JP S61142873U JP 2414185 U JP2414185 U JP 2414185U JP 2414185 U JP2414185 U JP 2414185U JP S61142873 U JPS61142873 U JP S61142873U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
processing liquid
removal device
sandwiching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2414185U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2414185U priority Critical patent/JPS61142873U/ja
Publication of JPS61142873U publication Critical patent/JPS61142873U/ja
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の実施例による処理液除去装
置が設置されためつき前処理設備を示す概略断面
図、第2図は上記処理液除去装置を拡大して示し
た断面図、第3図はプリント基板のスルーホール
用の孔を示す部分断面図である。 A,B,C……処理液、1……プリント基板、
2……処理液除去装置、21……ローラ、21a
……ローラの表層部。
FIG. 1 is a schematic cross-sectional view showing a pre-processing facility equipped with a treatment liquid removal device according to an embodiment of the invention, FIG. 2 is an enlarged cross-sectional view of the treatment liquid removal device, and FIG. FIG. 3 is a partial cross-sectional view showing holes for through holes in the printed circuit board. A, B, C...processing liquid, 1...printed circuit board,
2... Processing liquid removal device, 21... Roller, 21a
...Laura's surface layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 押し合い状態で圧接する一対のローラが処理液
に浸漬されたプリント基板の引上げ経路を挾んで
それぞれ遊転自在に配置され、これらのローラは
、上記プリント基板に圧接される表層部が処理液
吸収性を持つ弾性材料によつて構成されているこ
とを特徴とするプリント基板の処理液除去装置。
A pair of rollers that press against each other are arranged so as to be freely rotatable, sandwiching the pulling path of the printed circuit board immersed in the processing liquid. A processing liquid removal device for a printed circuit board, characterized in that the device is made of an elastic material having the following properties.
JP2414185U 1985-02-19 1985-02-19 Pending JPS61142873U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2414185U JPS61142873U (en) 1985-02-19 1985-02-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2414185U JPS61142873U (en) 1985-02-19 1985-02-19

Publications (1)

Publication Number Publication Date
JPS61142873U true JPS61142873U (en) 1986-09-03

Family

ID=30518022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2414185U Pending JPS61142873U (en) 1985-02-19 1985-02-19

Country Status (1)

Country Link
JP (1) JPS61142873U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315837U (en) * 1976-07-22 1978-02-09
JPS5539266U (en) * 1978-09-07 1980-03-13
JPS5626857U (en) * 1979-08-08 1981-03-12

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315837U (en) * 1976-07-22 1978-02-09
JPS5539266U (en) * 1978-09-07 1980-03-13
JPS5626857U (en) * 1979-08-08 1981-03-12

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