JPS61142459U - - Google Patents
Info
- Publication number
- JPS61142459U JPS61142459U JP2704185U JP2704185U JPS61142459U JP S61142459 U JPS61142459 U JP S61142459U JP 2704185 U JP2704185 U JP 2704185U JP 2704185 U JP2704185 U JP 2704185U JP S61142459 U JPS61142459 U JP S61142459U
- Authority
- JP
- Japan
- Prior art keywords
- crimp
- package
- dip type
- lead terminals
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2704185U JPS61142459U (sh) | 1985-02-26 | 1985-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2704185U JPS61142459U (sh) | 1985-02-26 | 1985-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61142459U true JPS61142459U (sh) | 1986-09-03 |
Family
ID=30523625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2704185U Pending JPS61142459U (sh) | 1985-02-26 | 1985-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61142459U (sh) |
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1985
- 1985-02-26 JP JP2704185U patent/JPS61142459U/ja active Pending