JPS61141789U - - Google Patents

Info

Publication number
JPS61141789U
JPS61141789U JP2450385U JP2450385U JPS61141789U JP S61141789 U JPS61141789 U JP S61141789U JP 2450385 U JP2450385 U JP 2450385U JP 2450385 U JP2450385 U JP 2450385U JP S61141789 U JPS61141789 U JP S61141789U
Authority
JP
Japan
Prior art keywords
leads
integrated circuit
sandwiching
temperatures
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2450385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2450385U priority Critical patent/JPS61141789U/ja
Publication of JPS61141789U publication Critical patent/JPS61141789U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の部分透視斜視図で
ある。第2図は第1図の電極板と板バネとの常温
における関係を示した状態図である。第3図は同
様に高温における電極板と板バネとの状態を示し
た状態図である。 1……金属バネ、2……電極板、3……集積回
路のリード。
FIG. 1 is a partially transparent perspective view of an embodiment of the present invention. FIG. 2 is a state diagram showing the relationship between the electrode plate of FIG. 1 and the leaf spring at room temperature. FIG. 3 is a state diagram similarly showing the state of the electrode plate and leaf spring at high temperatures. 1...metal spring, 2...electrode plate, 3...lead of integrated circuit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路のリードとの接触部に熱変形金属材料
を用い、高温時にはリードをはさみ込み、低温時
にはリードを解放することを特徴とする集積回路
用ソケツト。
A socket for an integrated circuit, which uses a heat-deformable metal material in the contact area with the leads of an integrated circuit, and is characterized by sandwiching the leads when the temperature is high and releasing the leads when the temperatures are low.
JP2450385U 1985-02-22 1985-02-22 Pending JPS61141789U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2450385U JPS61141789U (en) 1985-02-22 1985-02-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2450385U JPS61141789U (en) 1985-02-22 1985-02-22

Publications (1)

Publication Number Publication Date
JPS61141789U true JPS61141789U (en) 1986-09-02

Family

ID=30518710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2450385U Pending JPS61141789U (en) 1985-02-22 1985-02-22

Country Status (1)

Country Link
JP (1) JPS61141789U (en)

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