JPS6114114Y2 - - Google Patents
Info
- Publication number
- JPS6114114Y2 JPS6114114Y2 JP10363982U JP10363982U JPS6114114Y2 JP S6114114 Y2 JPS6114114 Y2 JP S6114114Y2 JP 10363982 U JP10363982 U JP 10363982U JP 10363982 U JP10363982 U JP 10363982U JP S6114114 Y2 JPS6114114 Y2 JP S6114114Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature fuse
- casing
- insulating substrate
- electrodes
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Description
【考案の詳細な説明】
本考案は温度ヒユーズの改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in temperature fuses.
温度ヒユーズにおいて、互に平行な二本の導体
棒の先端を低融点金属材で結合し、該低融点金属
材を樹脂で被覆したものをソケツトに差込んで使
用すること、例えば温度ヒユーズで保護する電気
機器の回路に設けたソケツト部に当該温度ヒユー
ズの突出導体棒を差込んで使用することが公知で
ある。 In a temperature fuse, the ends of two parallel conductor rods are connected with a low melting point metal material, and the low melting point metal material is coated with resin and used by inserting it into a socket, for example, protected by a temperature fuse. It is known to use a thermal fuse by inserting its protruding conductor rod into a socket provided in a circuit of an electrical device.
しかしながら、この温度ヒユーズにおいては、
突出導体棒の間隔が外力を受けると変化し易く、
ソケツト部への差込みは容易でない。 However, in this temperature fuse,
The spacing between the protruding conductor bars tends to change when subjected to external force,
It is not easy to insert it into the socket.
本考案の目的は、ソケツト部に差込むべき導体
の間隔を一定に保持できる温度ヒユーズを提供す
ることにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a temperature fuse that can maintain a constant spacing between conductors to be inserted into sockets.
本考案に係る温度ヒユーズは、絶縁基板上に２
条の平行な電極を設け、これら電極の一端を低融
点金属材で橋絡し、絶縁基板の一半部を樹脂で被
覆してなる温度ヒユーズ部材を、ケーシング内に
バネ電極を設けたソケツト部材の当該ケーシング
内に収納したことを特徴とする構成である。 The temperature fuse according to the present invention has two
A temperature fuse member is constructed by providing parallel electrodes, one end of which is bridged with a low-melting point metal material, and one half of an insulating substrate is covered with resin. This configuration is characterized by being housed within the casing.
以下、図面により本考案を説明する。 The present invention will be explained below with reference to the drawings.
第１図において、１はソケツト部材であり、樹
脂ケーシング１１内にバネ電極１２を設け、この
バネ電極１２にリード導体１３を接続した構成で
ある。２は温度ヒユーズ部材であり、ソケツト部
材１のケーシング１１内に着脱自在に収納してあ
る。 In FIG. 1, reference numeral 1 denotes a socket member, which has a structure in which a spring electrode 12 is provided inside a resin casing 11 and a lead conductor 13 is connected to this spring electrode 12. Reference numeral 2 denotes a temperature fuse member, which is detachably housed within the casing 11 of the socket member 1.
第２図Ａは温度ヒユーズ部材２の上面図を、第
２図Ｂは第２図Ａにおけるｂ−ｂ断面図をそれぞ
れ示し、絶縁基板２１（例えば、ガラス板，セラ
ミツク板）上に２条の平行な電極２２，２２を設
け（電極には金属箔、メツキ層、銀ペースト、焼
付け電極ペーストを使用でき、金属組成として
は、例えば、Sn：8.3％−Bi：44.7％−Pb：22.6
％−Cd：5.3％−In：19.1％系合金、Sn：13％−
Bi：42％−Pb：35％−Cd：10％系合金、Sn：63
％−Pb：37％系合金等を使用できる。）、これら
電極の一端を低融点合金材２３で橋絡し、絶縁基
板２１の一半部を樹脂皮膜２４で被覆してある。
２２０，２２０は絶縁基板２１の他半部において
露出させた電極部分であり、これらの電極部分２
２０，２２０が第１図において、バネ電極１２に
接触している。 FIG. 2A shows a top view of the temperature fuse member 2, and FIG. 2B shows a sectional view taken along line bb in FIG. 2A. Parallel electrodes 22, 22 are provided (metal foil, plating layer, silver paste, baked electrode paste can be used for the electrodes, and the metal composition is, for example, Sn: 8.3% - Bi: 44.7% - Pb: 22.6
%-Cd: 5.3%-In: 19.1% alloy, Sn: 13%-
Bi: 42%-Pb: 35%-Cd: 10% alloy, Sn: 63
%-Pb:37% alloy etc. can be used. ), one end of these electrodes is bridged with a low melting point alloy material 23, and one half of the insulating substrate 21 is covered with a resin film 24.
Reference numerals 220 and 220 are electrode portions exposed in the other half of the insulating substrate 21, and these electrode portions 2
20 and 220 are in contact with the spring electrode 12 in FIG.
本考案に係る温度ヒユーズは上述した通りの構
成であり、絶縁基板に設けた平行な電極をソケツ
ト部材に差込んであり、これらの電極の間隔が絶
縁基板によつて一定に保持されているから、差込
み時に電極の間隔が変化するようなことがなく、
その差込みを容易に行い得る。また、ソケツト部
材に、ケーシング内にバネ電極を設けたものを使
用し、ケーシング内に温度ヒユーズ部材を収納し
たから、運搬中、温度ヒユーズ部材をケーシング
で保護できる。 The temperature fuse according to the present invention has the above-mentioned configuration, in which parallel electrodes provided on an insulating substrate are inserted into a socket member, and the spacing between these electrodes is maintained constant by the insulating substrate. , the electrode spacing does not change when inserted,
The insertion can be easily performed. Further, since the socket member is provided with a spring electrode in the casing and the temperature fuse member is housed in the casing, the temperature fuse member can be protected by the casing during transportation.
第１図は本考案に係る温度ヒユーズを示す説明
図、第２図Ａは本考案において使用する温度ヒユ
ーズ部材を示す上面説明図、第２図Ｂは第２図Ａ
におけるｂ−ｂ断面説明図である。
図において、１はソケツト部材、２は温度ヒユ
ーズ部材である。
Figure 1 is an explanatory diagram showing the temperature fuse according to the present invention, Figure 2A is a top explanatory diagram showing the temperature fuse member used in the present invention, and Figure 2B is Figure 2A.
It is a bb cross-sectional explanatory view in . In the figure, 1 is a socket member and 2 is a temperature fuse member.
Claims (1)
電極の一端を低融点金属材で橋絡し、絶縁基板の
一半部を樹脂で被覆してなる温度ヒユーズ部材
を、ケーシング内にバネ電極を設けたソケツト部
材の当該ケーシング内に収納したことを特徴とす
る温度ヒユーズ。 Two parallel electrodes are provided on an insulating substrate, one end of these electrodes is bridged with a low-melting point metal material, and one half of the insulating substrate is covered with resin.The temperature fuse member is made of a spring electrode inside the casing. A temperature fuse, characterized in that it is housed in a casing of a provided socket member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10363982U JPS597542U (en) | 1982-07-07 | 1982-07-07 | temperature fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10363982U JPS597542U (en) | 1982-07-07 | 1982-07-07 | temperature fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS597542U JPS597542U (en) | 1984-01-18 |
| JPS6114114Y2 true JPS6114114Y2 (en) | 1986-05-01 |
Family
ID=30243699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10363982U Granted JPS597542U (en) | 1982-07-07 | 1982-07-07 | temperature fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS597542U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59153918A (en) * | 1983-02-22 | 1984-09-01 | Mazda Motor Corp | Suction cooler for engine associated with turbocharger |
| JPS6137427U (en) * | 1984-08-11 | 1986-03-08 | 三菱重工業株式会社 | Internal combustion engine air supply system |
| JPS6388220A (en) * | 1986-09-30 | 1988-04-19 | Aisin Seiki Co Ltd | Supercharging device |
-
1982
- 1982-07-07 JP JP10363982U patent/JPS597542U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS597542U (en) | 1984-01-18 |
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