JPS61140815U - - Google Patents
Info
- Publication number
- JPS61140815U JPS61140815U JP2284585U JP2284585U JPS61140815U JP S61140815 U JPS61140815 U JP S61140815U JP 2284585 U JP2284585 U JP 2284585U JP 2284585 U JP2284585 U JP 2284585U JP S61140815 U JPS61140815 U JP S61140815U
- Authority
- JP
- Japan
- Prior art keywords
- cleaner
- dust suction
- suction port
- air blow
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000428 dust Substances 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2284585U JPS61140815U (enExample) | 1985-02-20 | 1985-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2284585U JPS61140815U (enExample) | 1985-02-20 | 1985-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61140815U true JPS61140815U (enExample) | 1986-09-01 |
Family
ID=30515524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2284585U Pending JPS61140815U (enExample) | 1985-02-20 | 1985-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61140815U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362331A (ja) * | 1986-09-03 | 1988-03-18 | Nec Corp | 半導体樹脂封止装置 |
| JPH1110654A (ja) * | 1997-06-24 | 1999-01-19 | Apic Yamada Kk | 樹脂封止装置 |
-
1985
- 1985-02-20 JP JP2284585U patent/JPS61140815U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362331A (ja) * | 1986-09-03 | 1988-03-18 | Nec Corp | 半導体樹脂封止装置 |
| JPH1110654A (ja) * | 1997-06-24 | 1999-01-19 | Apic Yamada Kk | 樹脂封止装置 |