JPS61139956A - Manufacture of information carrier disk - Google Patents

Manufacture of information carrier disk

Info

Publication number
JPS61139956A
JPS61139956A JP59261141A JP26114184A JPS61139956A JP S61139956 A JPS61139956 A JP S61139956A JP 59261141 A JP59261141 A JP 59261141A JP 26114184 A JP26114184 A JP 26114184A JP S61139956 A JPS61139956 A JP S61139956A
Authority
JP
Japan
Prior art keywords
substrate
substrates
adhesive
disk
adhesive agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59261141A
Other languages
Japanese (ja)
Other versions
JPH0453013B2 (en
Inventor
Masami Uchida
内田 正美
Yoshihiro Minamide
南出 整宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59261141A priority Critical patent/JPS61139956A/en
Publication of JPS61139956A publication Critical patent/JPS61139956A/en
Priority to US07/135,539 priority patent/US4877475A/en
Publication of JPH0453013B2 publication Critical patent/JPH0453013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45Joining of substantially the whole surface of the articles
    • B29C66/452Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406Ultraviolet [UV] radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845Radiation curing adhesives, e.g. UV light curing adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/521Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/32Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/322Providing cavities in the joined article to collect the burr
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/32Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/324Avoiding burr formation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs

Abstract

PURPOSE:To make an external form finish of a substrate unnecessary, and to reduce cost by constituting a titled disk so that two substrates which have placed a viscous adhesive agent between are rotated, and a adhesive agent which has been protruded to an outside peripheral edge by a centrifugal fore is removed by a suction nozzle. CONSTITUTION:A disk substrate 2 on which a recording layer 1 has been formed is inserted into a center boss 7 of a rotary tool 6, the substrate is vacuum- adsorbed through a groove 3, a viscous ultraviolet polymerization type adhesive agent 8 is applied to the substrate, and thereafter, a protective substrate 9 is placed on it, and when the substrate is rotated, the adhesive agent is spread out to the outside peripheral end by a centrifugal force and packed between the substrates. Subsequently, the rotation is decelerated, an opening part 13 of a suction nozzle 12 is made to contact to the outside peripheral edge of the substrate, and a surplus adhesive agent 15 is absorbed and removed, and hardened by irradiating an ultraviolet ray from the direction as indicated with an arrow 16. Accordingly, the surplus adhesive agent is removed before it is hardened, an external form finish of the substrate becomes unnecessary, and the cost can be reduced.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は情報媒体層を有した円盤状基板を少なくとも1
枚含む2枚の円盤状基板を貼り合わせた情報担体ディス
ク(以下、単にディスクと称すンの製造方法に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides at least one disk-shaped substrate having an information medium layer.
This invention relates to a method of manufacturing an information carrier disk (hereinafter simply referred to as a disk), which is made by bonding two disk-shaped substrates together.

従来の技術 従来より円盤状の透明基板の一方の面に未記録の記録媒
体層、あるいはあらかじめ所定の情報信号を記録した凹
凸ピットに反射層を形成したもの等、透明基板に情報媒
体層を設けたディスク基板を用いて、前記情報媒体層の
面が互いに対向するようにあるいは単に保護基板を前記
情報媒体層に対向するように貼り合わせたディスクを用
いて、例えばレーザ光によって情報の記録再生を行なう
光ディスク、あるいは再生専用のビデオディスク等が実
用化されている。これらの2枚の円盤状基板を貼り合わ
せる方法として、2枚の基板の間忙粘性のある接着剤を
はさみ込んで2枚の基板を回転させながら、接着剤を2
枚の基板間の全面に均一に充填して貼り合わせを行なう
方法が提案された例はないが、発明者らが先に考えた貼
り合わせ方法は第6図のような構成になって込た。
Conventional technology Conventionally, an information medium layer is provided on a transparent substrate, such as an unrecorded recording medium layer on one side of a disc-shaped transparent substrate, or a reflective layer formed on uneven pits on which predetermined information signals are recorded. Using a disk substrate with the information medium layer facing each other, or simply bonding a protective substrate so as to face the information medium layer, information can be recorded and reproduced using, for example, a laser beam. Optical discs that perform this function or playback-only video discs have been put into practical use. The method of bonding these two disc-shaped substrates together is to sandwich a viscous adhesive between the two substrates and apply the adhesive twice while rotating the two substrates.
Although no method has been proposed in which the entire surface between two substrates is uniformly filled and bonded, the bonding method that the inventors first considered had a configuration as shown in Figure 6. .

すなわち記録媒体層1を一方の面に形成した円盤状のデ
ィスク基板2を、真空吸着用の溝3および通気孔4を有
し回転中心上に軸6を有した回転具6にセンタボスクを
介して固定する。次に粘性のある接着剤8をセンタボス
7と同心的に塗布し、保護基板9を重ね合わせ保護基板
9の自重等によって接着剤8がセンタボス7の全周に接
触するまで放置した後、2枚の基板を回転させることに
よって接着剤8を基板の全面に充填し余分な接着剤を振
り切った後、前記2枚の基板を回転させる回転速度より
遅い速度で回転させながら接着剤を硬化させて貼9合わ
せを行なうよう忙なっている。
That is, a disk-shaped disk substrate 2 having a recording medium layer 1 formed on one side is passed through a center bossk to a rotating tool 6 having a groove 3 for vacuum suction and a ventilation hole 4 and having a shaft 6 on the center of rotation. Fix it. Next, apply a viscous adhesive 8 concentrically with the center boss 7, stack the protective substrate 9, and leave it until the adhesive 8 comes into contact with the entire circumference of the center boss 7 due to the weight of the protective substrate 9. After filling the entire surface of the substrate with adhesive 8 by rotating the substrate and shaking off the excess adhesive, the adhesive is cured and pasted while rotating at a speed slower than the rotation speed at which the two substrates are rotated. I'm busy trying to match 9.

発明が解決しようとする問題点 しかし、2枚の基板を回転させて余分な接着剤を撮り切
った時、ディスクの外周端10に余分な接着剤11が溜
った状態になっておシ、このまま硬化させるとディスク
の外周端1oに接着剤11が不規則に突出した状態にな
るため、接着剤を充填し振り切る時の回転数より充分遅
い回転数で回転させながら接着剤を硬化させることによ
って、接着剤11が平均化されてなめらかな硬化状態を
得られるものであるが、接着剤11がディスク外周端1
oよりはみ出した状態で硬化することになるため、ディ
スクの外形が2枚の基板の外形上り大きくなることにな
る。このため例えばディスクをディスクカートリッヂ等
のケースに入れる、あるいは外観上接着剤がはみ出して
問題になる等の場合には2枚の基板を貼り合わた後、デ
ィスクの外形を仕上げ加工する必要があった。
Problems to be Solved by the Invention However, when the two substrates are rotated and the excess adhesive is removed, excess adhesive 11 accumulates on the outer peripheral edge 10 of the disk. When cured, the adhesive 11 will protrude irregularly from the outer peripheral edge 1o of the disk, so by curing the adhesive while rotating at a rotation speed sufficiently lower than the rotation speed at which the adhesive is filled and shaken off, The adhesive 11 is evened out to obtain a smooth hardened state, but the adhesive 11 is evened out on the outer peripheral edge 1 of the disk.
Since the disk is cured in a state protruding from the outside, the outer shape of the disk becomes larger than that of the two substrates. For this reason, for example, if the disc is placed in a case such as a disc cartridge, or if the adhesive protrudes outward, causing problems, it is necessary to finish the external shape of the disc after pasting the two boards together. Ta.

本発明はディスクの外形、外観が問われる場合でも外形
の後加工を必要としない製造方法を得ようとするもので
ある。
The present invention aims to provide a manufacturing method that does not require post-processing of the outer shape even when the outer shape and appearance of the disk are in question.

問題点を解決するための手段 上記問題点を解決するため、ディスクの外周端にはみ出
した接着剤を硬化させる前に、外周端の余分な接着剤を
吸引して除去したものである。
Means for Solving the Problems In order to solve the above-mentioned problems, the excess adhesive on the outer circumferential edge of the disk is removed by suction before the adhesive protruding onto the outer circumferential edge of the disk is cured.

作   用 すなわち、2枚の基板を回転させながら基板間の粘性の
ある接着剤を全面に均一に充填した後、この接着剤を全
面に充填する回転より遅く2枚の基板を回転させながら
、外周端に溜った接着剤を吸引ノズルを接触させて吸引
することにより、外周端に接着剤のはみ出しのない貼り
合わせができるものである。
In other words, after rotating the two substrates and uniformly filling the entire surface with the viscous adhesive between the substrates, the two substrates are rotated at a slower speed than the rotation that fills the entire surface with the adhesive, and then the outer periphery is filled with the adhesive. By bringing a suction nozzle into contact with the adhesive that has accumulated on the edge and suctioning it, bonding can be performed without adhesive protruding from the outer peripheral edge.

この結果、ディスクの外径寸法が2枚の基板の外径寸法
とほとんど変わらず、外形加工等の仕上加工が不要とな
るため低コストの貼り合わせが可能となるものである。
As a result, the outer diameter of the disk is almost the same as the outer diameter of the two substrates, and finishing work such as contouring is not required, allowing low-cost bonding.

実施例 以下、本発明の一実施例を図面にもとづいて説明する。Example Hereinafter, one embodiment of the present invention will be described based on the drawings.

第1図において記録媒体層1.ディスク基板2.真空吸
着用の溝32通気孔4.軸69回転具6.センタボス7
、接着剤8.保護基板9は第6図の従来例と同じ構成で
同一番号で示している。第2図は第1図における吸取り
状態を示す平面図である。第1図、第2図において12
は吸引ノズルでディスクの外周端に接触する側の先端を
絞ったパイプで構成しており、第3図に示すように吸引
ノズル12の先端の開口部13の形状は細長いだ円状に
なっており、その長手方向の寸法は2枚の基板の厚さよ
シ長い寸法であり、吸引ノズル12の先端は平面になっ
ている。また吸引ノズル12の肉厚は薄肉のパイプで構
成しているため、開口部13の幅より更に薄くなってい
る。このことは吸取り時に接着剤のディスク表面へのま
わり込みを訪止するために重要である。
In FIG. 1, recording medium layer 1. Disk substrate 2. Groove 32 for vacuum suction 4. Shaft 69 rotating tool 6. center boss 7
, adhesive8. The protection board 9 has the same structure as the conventional example shown in FIG. 6 and is indicated by the same number. FIG. 2 is a plan view showing the suction state in FIG. 1. 12 in Figures 1 and 2
The suction nozzle is composed of a pipe with the end that contacts the outer peripheral edge of the disk constricted, and as shown in Fig. 3, the opening 13 at the end of the suction nozzle 12 has an elongated oval shape. Its longitudinal dimension is longer than the thickness of the two substrates, and the tip of the suction nozzle 12 is flat. Furthermore, since the suction nozzle 12 is made of a thin pipe, the thickness of the suction nozzle 12 is even thinner than the width of the opening 13. This is important to prevent the adhesive from wrapping around the disk surface during blotting.

すなわち第2図に示すようにディスクが矢印14の方向
に回転して吸取りを行なう場合、ディスクの外周端の余
剰接着剤16を吸引ノズル12の先端の先に接着剤に接
触する側16で余剰接着剤15をかき切った後、開口部
13より吸取りを行なうことによってより確実な吸取り
が可能になるものであるが、この余剰接着剤15をかき
取った後、吸取シまでの時間が長くなるとかき取った余
剰接着剤16がディスク表面にまわり込むことになるた
め吸引ノズル12の先端部はできるだけ薄肉にする必要
があるものである。尚、吸引ノズル12をディスク外周
端に接触させる方法としては、例えばバネを介して押し
付けることによって容易にできるものである。
That is, when the disk rotates in the direction of the arrow 14 to perform suction as shown in FIG. After scraping off the adhesive 15, blotting is performed through the opening 13, which enables more reliable blotting. The tip of the suction nozzle 12 needs to be as thin as possible because the scraped excess adhesive 16 will wrap around the disk surface. Note that the suction nozzle 12 can be easily brought into contact with the outer circumferential edge of the disk by, for example, pressing it with a spring.

次にこの吸引ノズル12によって余剰接着剤を除去する
2枚の円盤状基板の貼り合わせ方法を第1図〜第6図で
説明する。まず第4図に示すように回転具6の軸5にセ
ンタボスクを挿入し、ディスク基板2を記録媒体層1が
上になるように乗せて回転具6の溝3および通気孔4を
通じてディスク基板2を真空吸着する。この真空吸着を
行なった状態で回転具6を軸6を中心に回転させるもの
であるが、これは一般的に行なわれているようにモータ
および回転継手(図示せず)を使用すれば容易にできる
ものである。次にディスク基板2に紫外線重合型の接着
剤8を塗布し保護基板9を接着剤8の全周に接触させる
。この状態で保護基板9を自然放置すれば保護基板9の
自重によって、第5図に示すように接着剤8が円盤状基
板の内外周それぞれの方向に広がる。この時保護基板9
を適度に加圧することも可能である。
Next, a method of bonding two disc-shaped substrates together by removing excess adhesive using the suction nozzle 12 will be described with reference to FIGS. 1 to 6. First, as shown in FIG. 4, insert the center boss into the shaft 5 of the rotating tool 6, place the disk substrate 2 with the recording medium layer 1 facing up, and pass the disk substrate 2 through the groove 3 and ventilation hole 4 of the rotating tool 6. Vacuum adsorption. The rotary tool 6 is rotated around the shaft 6 while this vacuum suction is performed, but this can be easily done by using a motor and a rotary joint (not shown) as is commonly done. It is possible. Next, an ultraviolet polymerized adhesive 8 is applied to the disk substrate 2, and the protective substrate 9 is brought into contact with the entire circumference of the adhesive 8. If the protective substrate 9 is left alone in this state, the adhesive 8 will spread in the directions of the inner and outer peripheries of the disc-shaped substrate, respectively, due to the weight of the protective substrate 9, as shown in FIG. At this time, the protective board 9
It is also possible to apply appropriate pressure.

第5図に示すように接着剤8が広がって接着剤8の内周
側がセンタボス7の全周に接触した状態になってから回
転具6の軸5を中心に2枚の基板を回転させることによ
って、接着剤8は遠心力によってディスクの外周端に向
って広がり、外周端からあふれ出た接着剤は第6図の従
来例で示したように遠心力によって飛散するためディス
ク表面にまわり込むことはない。この時のディスクの回
転数4、回転時間が均一な膜厚の接着層、あるいはディ
スク全面への充填を得るために重要であり、この条件は
接着剤の粘度によって左右されるが具体的には接着剤と
して1ooOCP〜2000CP(25°C)の粘度の
ものを使用した場合、回転数300〜1000 rPm
’q回転時間30〜90秒で所定の接着層厚さを得るこ
とができ、2枚の基板間の全面に均一に接着剤を充填す
ることができた。
As shown in FIG. 5, after the adhesive 8 has spread and the inner circumferential side of the adhesive 8 is in contact with the entire circumference of the center boss 7, the two substrates are rotated around the shaft 5 of the rotating tool 6. As a result, the adhesive 8 spreads toward the outer edge of the disk due to centrifugal force, and the adhesive overflowing from the outer edge is scattered by centrifugal force and wraps around the disk surface, as shown in the conventional example in FIG. There isn't. At this time, the number of rotations of the disk 4 and the rotation time are important in order to obtain an adhesive layer with a uniform thickness or to fill the entire surface of the disk, and this condition is influenced by the viscosity of the adhesive, but specifically When using an adhesive with a viscosity of 1ooOCP to 2000CP (25°C), the rotation speed is 300 to 1000 rPm.
A predetermined thickness of the adhesive layer could be obtained with a rotation time of 30 to 90 seconds, and the adhesive could be uniformly filled over the entire surface between the two substrates.

次に第1図、第2図に示すように上述した接着剤を充填
する回転数より充分遅い回転数で回転しながら吸引ノズ
ル12を接、触させてディスクの外周端にあふれ出て遠
心力で飛散しなかった余剰接着11°6をt*−ffi
 L&後・矢1′°0方向7゛ら紫外線       
1を照射することによって短時間で貼り合わせを行なう
ことができるものである。
Next, as shown in FIGS. 1 and 2, the suction nozzle 12 is brought into contact with the disk while rotating at a rotation speed sufficiently lower than the rotation speed at which the adhesive is filled, causing centrifugal force to overflow to the outer peripheral edge of the disk. The excess adhesive 11°6 that did not scatter at t*-ffi
L & rear arrow 1'° 0 direction 7' ultraviolet rays
1, it is possible to perform bonding in a short time.

発明の効果 本発明は2枚の円盤状基板を粘性のある接着剤で全面貼
り合わせるに当って、外周端にあふれた余剰接着剤を硬
化させる前に2枚の円盤状基板を回転させながら吸引ノ
ズルを外周端に接触させながら余剰接着剤を吸取ること
によって外周端に余剰接着剤のはみ出しのない貼り合わ
せができるものであり、ディスクの外径寸法が2枚の基
板の外径寸法とほとんど変わらず、外形加工等の仕上加
工を必要としない低コストの貼り合わせが可能になるも
のである。
Effects of the Invention The present invention, when bonding two disc-shaped substrates together on their entire surfaces with a viscous adhesive, sucks the excess adhesive overflowing to the outer edge while rotating the two disc-shaped substrates before curing the excess adhesive. By sucking up the excess adhesive while keeping the nozzle in contact with the outer edge, it is possible to bond the disk without excess adhesive protruding from the outer edge. This still allows for low-cost bonding that does not require finishing work such as contour processing.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の情報担体ディスクの製造方法を実施し
た装置の断面図、第2図は第1図の平面図、第3図は同
装置の吸引ノズルの先端部の正面図、第4図、第6図は
本発明の情報担体ディスクの製造方法を示す装置の断面
図、第6図は従来の情報担体ディスクの製造方法を実施
した装置の断面図である。 2・・・・・ディスク基板、6・・・・・回転具、8・
・・・・接着剤、9・・・・・・保護基板、12・・・
・・・吸引ノズル。 弔1図 第2図 第3図
FIG. 1 is a sectional view of an apparatus in which the method of manufacturing an information carrier disk of the present invention is carried out, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a front view of the tip of the suction nozzle of the same apparatus, and FIG. 6 is a sectional view of an apparatus showing the method for manufacturing an information carrier disk of the present invention, and FIG. 6 is a sectional view of an apparatus implementing the conventional method for manufacturing an information carrier disk. 2... Disk board, 6... Rotating tool, 8...
...Adhesive, 9...Protection board, 12...
...Suction nozzle. Funeral Figure 1 Figure 2 Figure 3

Claims (2)

【特許請求の範囲】[Claims] (1)2枚の円盤状の基板の間に粘性のある接着剤をは
さみ込み、この2枚の基板をその中心孔を中心に回転さ
せながら接着剤を2枚の基板間に充填し、その後、この
充填時の前記2枚の基板の回転数より遅い回転数で前記
2枚の基板を回転させ、このとき吸引ノズルを2枚の基
板の外周端に接触させて余剰な接着剤を除去する情報担
体ディスクの製造方法。
(1) A viscous adhesive is sandwiched between two disc-shaped substrates, and the adhesive is filled between the two substrates while rotating the two substrates around their center holes. , The two substrates are rotated at a rotation speed lower than the rotation speed of the two substrates during filling, and at this time, the suction nozzle is brought into contact with the outer peripheral edges of the two substrates to remove excess adhesive. Method for manufacturing an information carrier disk.
(2)吸引ノズルの先端が略平面で開口部の形状が細長
い長方形状あるいはだ円状の薄肉パイプで構成された特
許請求の範囲第1項記載の情報担体ディスクの製造方法
(2) The method of manufacturing an information carrier disk according to claim 1, wherein the suction nozzle has a substantially flat tip and an opening formed of a thin pipe having an elongated rectangular or elliptical shape.
JP59261141A 1984-11-01 1984-12-11 Manufacture of information carrier disk Granted JPS61139956A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59261141A JPS61139956A (en) 1984-12-11 1984-12-11 Manufacture of information carrier disk
US07/135,539 US4877475A (en) 1984-11-01 1987-12-18 Method for producing information storage disk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59261141A JPS61139956A (en) 1984-12-11 1984-12-11 Manufacture of information carrier disk

Publications (2)

Publication Number Publication Date
JPS61139956A true JPS61139956A (en) 1986-06-27
JPH0453013B2 JPH0453013B2 (en) 1992-08-25

Family

ID=17357661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59261141A Granted JPS61139956A (en) 1984-11-01 1984-12-11 Manufacture of information carrier disk

Country Status (1)

Country Link
JP (1) JPS61139956A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0744739A1 (en) * 1995-05-20 1996-11-27 Kitano Engineering Co., Ltd. Method of manufacturing an optical disc and a placing platform to be used by the same
EP0777223A3 (en) * 1995-11-30 1998-07-01 Kitano Engineering Co., Ltd. Method of manufacturing a storage disc
US5954908A (en) * 1995-10-13 1999-09-21 Kitano Engineering Co., Ltd. Developing storage disc boss
WO1999057721A1 (en) * 1998-05-05 1999-11-11 Tapematic, S.P.A. Apparatus for trimming dye coated on a recordable disc substrate and related method
US6503423B1 (en) 1999-06-11 2003-01-07 Kitano Engineering Co., Ltd. Method of and apparatus for curing an optical disc
WO2005093738A1 (en) * 2004-03-29 2005-10-06 Kitano Co., Ltd Method for spreading adhesive in optical disc

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0744739A1 (en) * 1995-05-20 1996-11-27 Kitano Engineering Co., Ltd. Method of manufacturing an optical disc and a placing platform to be used by the same
US5744193A (en) * 1995-05-20 1998-04-28 Kitano Engineering Co., Ltd. Method of manufacturing an optical disc and a placing platform to be used by the same
US5954908A (en) * 1995-10-13 1999-09-21 Kitano Engineering Co., Ltd. Developing storage disc boss
EP0777223A3 (en) * 1995-11-30 1998-07-01 Kitano Engineering Co., Ltd. Method of manufacturing a storage disc
US5951806A (en) * 1995-11-30 1999-09-14 Kitano Engineering Co., Ltd. Method of manufacturing a storage disc
WO1999057721A1 (en) * 1998-05-05 1999-11-11 Tapematic, S.P.A. Apparatus for trimming dye coated on a recordable disc substrate and related method
US6503423B1 (en) 1999-06-11 2003-01-07 Kitano Engineering Co., Ltd. Method of and apparatus for curing an optical disc
WO2005093738A1 (en) * 2004-03-29 2005-10-06 Kitano Co., Ltd Method for spreading adhesive in optical disc

Also Published As

Publication number Publication date
JPH0453013B2 (en) 1992-08-25

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