JPS61135745A - Method for printing on electronic parts - Google Patents

Abstract

PURPOSE:To make it possible to obtain high feed efficiency and reliability by reducing the loss of a parts supply and take-out process, by performing the supply/feed and take-out of electronic parts as taping was applied thereto and applying printing to the surface of electronic parts continuously and automatically to cure the applied ink. CONSTITUTION:Electronic parts 2, to which taping was applied, is set to a tape supply reel 8 in a roll form and fed by a constant dimension by a tape steady feed roller. When the electronic parts 2 was fed in front of a printer 3, printing is applied to the surface of the electronic parts 2 by the printer 3. The electronic parts 2, to which printing was applied by the printer 3, is further fed to the curing drying oven 4 of a post-process to perform the curing of ink and subsequently wound up by a tape wind-up reel 9.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Use The present invention relates to a method for marking the surface of an electronic component to display product numbers, electrical characteristics, etc.

BACKGROUND TECHNOLOGY In general, in the method of stamping electronic components, the electronic component is transported as a single unit, and after the stamp is stamped, the electronic component is cured.

The conventional sealing method will be explained below with reference to the drawings.

FIG. 2 shows a conventional marking device. In Fig. 2, 1 is a conveyor, 2 is an electronic component, 3 is a stamping machine,
Reference numeral 4 denotes a curing drying oven, 5 an electronic component supply device, and 6 an electronic component take-out device.The electronic component supply device 6 and the electronic component take-out device 61 are arranged before and after the conveyor 1 for holding and conveying the electronic components 2. A stamping machine 3 is disposed on the conveyor 1, and a curing/drying oven 4 is disposed in the subsequent process.

In the stamping device configured as described above, first, the electronic component 2 is supplied onto the conveyor 1 from the electronic component supply device 5, and is conveyed while being held.

When the electronic component 2 is conveyed to the front of the stamping machine 3, the stamping machine 3 stamps the surface of the electronic component 2.

The electronic parts 2 printed by the stamping machine 3 are transferred to the conveyor 1
After the ink is sent to a subsequent process and cured in a curing/drying oven 4, it is taken out from the conveyor 1 by an electronic component removal device 6.

Problems to be Solved by the Invention However, with the above configuration, the series of steps from supplying parts to stamping, curing, and taking out all involve handling the electronic parts as a single unit, so the conveyance efficiency is significantly reduced in the supplying and taking out processes. In addition, there were problems in that deformation of parts occurred during these processes.

In view of the above-mentioned problems, the present invention provides a stamping method that reduces losses in the parts supply and removal process when stamping and curing electronic components, and has high conveyance efficiency and reliability.

Means for Solving the Problems In order to solve the above-mentioned problems, the marking method of the present invention involves supplying, transporting, and stamping the electronic parts while they are still taped, and continuously stamping them on the surface of the electronic parts. It is characterized by automatic stamping and curing.

Effect of the present invention With the above-described configuration, the taped electronic components are supplied to the stamp hardening process in a roll state, and the electronic components are taken out after the stamp hardening by being wound in a roll state between the supply and the hardening process. All you have to do is remove it, and from the supply, stamping, curing,
The entire process up to winding can be handled as tape transport. In addition, the taping tape also serves as a component supply tape used in automatic devices for automatically inserting electronic components onto printed circuit boards, so after the electronic components are stamped and cured, they are rolled up. The rolled roll can be used as is in an automatic loading device or automatic insertion device.

EXAMPLE A stamping method according to an example of the present invention will be described below with reference to the drawings. FIG. 1 shows a stamping device in one embodiment of the present invention. In FIG. 1, 2 is an electronic component, 3 is a stamping machine, 4 is a curing/drying oven, 7 is a transport tape, 8 is a tape supply reel, 9 is a tape take-up reel, 10 is a transport tape fixed-size feed roller, A tape supply reel 8 and a tape take-up reel 9 are arranged before and after the conveying tape 7, and a tape sizing feed roller and a stamping machine 3 are arranged between the two reels, and a curing/drying oven 4 is arranged in the subsequent process.

In the marking device configured as described above, the taped electronic component 2 is set in the form of a roll on the tape supply reel 8, and is conveyed by a constant size feed roller by a fixed size tape. When the electronic component 2 is transported to the front of the stamping machine 3,
The stamping machine 3 stamps the surface of the electronic component 2. The electronic component printed by the stamping machine 3 is further transported, and after the ink is cured in a curing/drying oven 4 in a post-process, it is wound up by a tape take-up reel 9.

As described above, according to this embodiment, electronic components are supplied in the form of a tape, stamped, and cured and rolled up nine times, thereby improving the transport efficiency of electronic components, and since no components are left on hold, deformation can be prevented. be able to. In addition, the taping tape also serves as a component supply tape used for devices that automatically attach and automatically insert electronic components onto the upper printed base, so after stamping and curing the electronic components, the tape is rolled and sucked. The roll can be used as is in an automatic loading device or an automatic insertion device.

Effects of the Invention As described above, the present invention provides electronic components in the form of a tape,
By stamping, curing, and winding twice, it is possible to significantly improve the transport efficiency of electronic components, improve quality by preventing deformation of the components, and improve workability.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of a stamping method according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram of a conventional stamping method. 2...Electronic parts, 3...Stamping machine, 4.
...Curing drying oven, 7...Transport tape, 8
. . . Tape supply IJ-le, 9 . . . Tape take-up reel, 10 . . . Transport tape fixed-size feed roller.

Claims (1)

[Claims] A method for marking electronic parts, which is characterized in that the electronic parts are taped and then automatically stamped continuously on the surface of the electronic parts while being transported in a tape state from supply to removal.