JPS61131898U - - Google Patents

Info

Publication number
JPS61131898U
JPS61131898U JP1370585U JP1370585U JPS61131898U JP S61131898 U JPS61131898 U JP S61131898U JP 1370585 U JP1370585 U JP 1370585U JP 1370585 U JP1370585 U JP 1370585U JP S61131898 U JPS61131898 U JP S61131898U
Authority
JP
Japan
Prior art keywords
chip
electronic component
suction pin
shaped electronic
outer cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1370585U
Other languages
Japanese (ja)
Other versions
JPH0333111Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985013705U priority Critical patent/JPH0333111Y2/ja
Publication of JPS61131898U publication Critical patent/JPS61131898U/ja
Application granted granted Critical
Publication of JPH0333111Y2 publication Critical patent/JPH0333111Y2/ja
Expired legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係るチツプ状電子部品吸着ピ
ン機構の実施例を示す縦断面図、第2図は外筒体
の鋼球嵌入穴部分を示す側面図、第3図はチツプ
状電子部品吸着ピンを用いた一般的なチツプ状電
子部品装着装置の概略構成図である。 10……外筒体、12……吸着ピン、14……
軸方向溝、17……鋼球、20……コイルばね。
Fig. 1 is a longitudinal sectional view showing an embodiment of the chip-shaped electronic component suction pin mechanism according to the present invention, Fig. 2 is a side view showing the steel ball insertion hole of the outer cylinder, and Fig. 3 is the chip-shaped electronic component. 1 is a schematic configuration diagram of a general chip-shaped electronic component mounting device using suction pins. 10...Outer cylinder body, 12...Adsorption pin, 14...
Axial groove, 17... steel ball, 20... coil spring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外筒体の内周にチツプ状電子部品を吸着する吸
着ピンを摺動自在に設け、前記外筒体に嵌入した
球体を前記吸着ピンの外周に形成された軸方向溝
にばねにより圧接したことを特徴とするチツプ状
電子部品吸着ピン機構。
A suction pin for adsorbing a chip-shaped electronic component is slidably provided on the inner periphery of the outer cylinder, and the sphere fitted into the outer cylinder is pressed into contact with an axial groove formed on the outer periphery of the suction pin by a spring. A chip-shaped electronic component suction pin mechanism featuring:
JP1985013705U 1985-02-04 1985-02-04 Expired JPH0333111Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985013705U JPH0333111Y2 (en) 1985-02-04 1985-02-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985013705U JPH0333111Y2 (en) 1985-02-04 1985-02-04

Publications (2)

Publication Number Publication Date
JPS61131898U true JPS61131898U (en) 1986-08-18
JPH0333111Y2 JPH0333111Y2 (en) 1991-07-12

Family

ID=30497959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985013705U Expired JPH0333111Y2 (en) 1985-02-04 1985-02-04

Country Status (1)

Country Link
JP (1) JPH0333111Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5969292A (en) * 1982-10-15 1984-04-19 松下電工株式会社 Holding structure of tool for mounting electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5969292A (en) * 1982-10-15 1984-04-19 松下電工株式会社 Holding structure of tool for mounting electronic part

Also Published As

Publication number Publication date
JPH0333111Y2 (en) 1991-07-12

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